A light emitting diode package includes a light emitting diode chip provided at a lower side thereof with a first electrode pad and a second electrode pad, a first lead and a second lead spaced apart from each other and contacting the first electrode pad and the second electrode pad of the light emitting diode chip to be electrically connected thereto, respectively, and a housing formed to surround the first lead and the second lead and having a cavity open at a top portion thereof. The first lead and the second lead have a first lead exposing plane and a second lead exposing plane disposed on a lower surface of the cavity of the housing and partially exposing the first lead and the second lead, respectively.

The present invention relates to a method for attaching micro LEDs at preset mounting positions on a target substrate, comprising the steps of: (a1) disposing, at the bottom of a filled fluid, a target substrate assembly to which micro LEDs are to be attached, and preparing a water tank in which the plurality of micro LEDs float in the fluid or on the surface of the fluid on the target substrate assembly, (b1) lowering the level of the fluid in the water tank so as to lower the floating position of the plurality of micro LEDs, thereby guiding some of the plurality of micro LEDs into the plurality of apertures of the mask; and (c1) attaching, to the target substrate, some of the micro LEDs guided into the apertures.

In an embodiment an optoelectronic component includes a carrier, an optoelectronic semiconductor chip and an encapsulation, wherein the semiconductor chip is fixed on a mounting surface of the carrier and is electrically conductively connected with the carrier, wherein the encapsulation is located around the semiconductor chip and covers the mounting surface at least partially, wherein the encapsulation includes a first layer and a second layer, wherein the first layer is arranged between the mounting surface and the second layer, wherein each of the first layer and the second layer is based on a silicone, and wherein the first layer and the second layer are directly adjacent to each other in a region of an interface.

A film package includes a film substrate, vias penetrating through the film substrate, interconnection patterns on the film substrate, and a semiconductor chip electrically connected to at least one of the interconnection patterns and to the vias, wherein the interconnection patterns include input patterns, first output patterns, and second output patterns, the film package includes input pads on a surface of the film substrate, and the input patterns extend from the input pads, the film package includes first output pads positioned toward a first edge of the film substrate on a first surface of the film substrate, and the first output patterns extend from the first output pads, and the film package includes second output pads positioned toward a second edge of the film substrate on a second surface of the film substrate opposite to the first surface, and the second output patterns extend from the second output pads.

A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.

The present disclosure discloses a display substrate, including a substrate, and a driver circuit, an insulation layer and a bonding electrode sequentially superposed on the substrate. The bonding electrode is configured to be connected to an anode and a cathode of a micro inorganic light-emitting diode chip to be bonded. The display substrate further includes an elastic layer sandwiched between the bonding electrode and the insulation layer, the elastic layer having an orthographic projection on the substrate covering at least an orthographic projection of the bonding electrode on the substrate. The present disclosure provides a display panel, including the above display substrate, and further including a micro inorganic light-emitting diode chip having an anode and a cathode thereof connected to the bonding electrode on the display substrate.

A display module includes a substrate including a mounting surface on which a plurality of inorganic LEDs are mounted and a side surface orthogonal to the mounting surface; a cover which is disposed on the mounting surface, and is configured to cover the mounting surface and extend to an area outside the mounting surface; and a side surface member provided on the side surface, and configured to be bonded to a lower surface of a region of the cover that corresponds to the area outside the mounting surface and to at least a part of the side surface.

An electronic device includes a heat dissipation structure that includes one or more openings. An electronic component is disposed on a surface of the heat dissipation structure and over the one or more openings. The electronic component is coupled to the heat dissipation structure by an adhesion material in the one or more openings.

In an embodiment a method for producing optoelectronic semiconductor devices includes providing at least one optoelectronic semiconductor chip with at least one contact side, generating at least one coating region and at least one protection region on the contact side or on at least one of the contact sides, applying at least one liquid coating material to the at least one contact side, wherein the at least one coating material wets the at least one coating region and does not wet the at least one protection region and solidifying the at least one coating material into at least one electrical contact structure on the at least one coating region such that the semiconductor chip is capable of being energized through the at least one contact structure.

Disclosed herein is a lead frame assembly including a frame and lead frame units each including a chip holder having first and second electrode pads; and a pin unit having a first pin, a second pin and third pins each extending from the chip holder. The pin unit extending from one of the lead frame units is connected to the pin unit of the adjacent one of the lead frame units. For the lead frame units disposed adjacent to the frame, the pin units extending towards the frame are connected to the frame such that the lead frame units are fixedly positioned within the frame. A chip packaging device including a lead frame body and a packaging structure is also disclosed.