The present application provides a display panel and a manufacturing method thereof, the manufacturing method comprises: providing a first substrate, wherein a side of the first substrate is provided with a plurality of Micro-LED chips that are spaced apart from each other; providing a second substrate, wherein a surface on a side of the second substrate has a plurality of conductive layer parts; forming an isolation layer on the second substrate, wherein the isolation layer has a plurality of opening groups, each of the opening groups comprises a first opening and a second opening to expose a surface of one of the conductive layer parts, wherein a width of the first opening is greater than that of a P-type electrode, and a width of the second opening is greater than that of a N-type electrode; forming a first bonding layer in the first opening and forming a second bonding layer in the second opening; while supporting the chip body by the isolation layer, bonding the P-type electrode with the first bonding layer and simultaneously bonding the N-type electrode with the second bonding layer, wherein the P-type electrode is embedded into the first bonding layer and the N-type electrode is embedded into the second bonding layer.

A light sensor structure and a packaging method thereof are disclosed. The light sensor structure comprises a light emitting element, a light sensing element, an opaque molding substance, an insulation layer and a connection layer. The opaque molding substance encloses the light emitting element and the light sensing element, and the opaque molding substance is provided with a via. The insulation layer is disposed on the bottom surface of the light emitting element, and the insulation layer is provided with a number of connection pads on a side away from the light emitting element and the light sensing element. The connection pads are electrically connected to the contacts on the bottom surface of the light emitting element through the connection layer, and the connection pads are electrically connected to the contacts on the light sensing surface of the light sensing element through the connection layer and the via.

Various embodiments of light emitting devices, assemblies, and methods of manufacturing are described herein. In one embodiment, a method for manufacturing a lighting emitting device includes forming a light emitting structure, and depositing a barrier material, a mirror material, and a bonding material on the light emitting structure in series. The bonding material contains nickel (Ni). The method also includes placing the light emitting structure onto a silicon substrate with the bonding material in contact with the silicon substrate and annealing the light emitting structure and the silicon substrate. As a result, a nickel silicide (NiSi) material is formed at an interface between the silicon substrate and the bonding material to mechanically couple the light emitting structure to the silicon substrate.

The present invention provides a display device using a semiconductor light-emitting element and a manufacturing method therefor, the display device transferring semiconductor light-emitting elements on a temporary substrate, and then directly implementing, through a stack process, the structure of a wiring substrate on the temporary substrate on which the semiconductor light-emitting elements are arrayed, thereby enabling the semiconductor light-emitting elements and the wiring substrate to be electrically connected.

An anisotropic conductive film in which conductive particles are dispersed in a resin includes a first region having a first pattern in which the conductive particles are discretely arranged, and a second region having a first shape by aggregating the conductive particles. Further, a display device includes a substrate provided with a plurality of electrodes arranged in a first pattern, the anisotropic conductive film, and a plurality of light emitting diodes. The plurality of light emitting diodes is electrically connected to the plurality of electrodes through the conductive particles in the first region.

A first pixel configured to emit light of a first color, a second pixel configured to emit light of a second color; and a third pixel configured to emit light of a third color are provided. The first pixel includes a first subpixel and a second subpixel each including a quantum dot light-emitting layer. A light-emission peak wavelength of the second subpixel is longer than a light-emission peak wavelength of the first subpixel.

An embodiment of the disclosure provides an electronic device including multiple units. Each unit in the units includes multiple primary bonding regions and at least one reserved bonding region. Each reserved bonding region is connected to the primary bonding regions. The number of the at least one reserved bonding region is less than the number of primary bonding regions.

A printed structure comprises a device comprising device electrical contacts disposed on a common side of the device and a substrate non-native to the device comprising substrate electrical contacts disposed on a surface of the substrate. At least one of the substrate electrical contacts has a rounded shape. The device electrical contacts are in physical and electrical contact with corresponding substrate electrical contacts. The substrate electrical contacts can comprise a polymer core coated with a patterned contact electrical conductor on a surface of the polymer core. A method of making polymer cores comprising patterning a polymer on the substrate and reflowing the patterned polymer to form one or more rounded shapes of the polymer and coating and then patterning the one or more rounded shapes with a conductive material.

A light emitting display apparatus includes a substrate including a plurality of pixels each including an emission area; a light extraction pattern including a plurality of concave portions in the emission area; and a light emitting portion over the light extraction pattern, wherein at least one of the plurality of concave portions has a curvature of 0.217 m.sup.1 to 0.311 m.sup.1.

A display device and a method of manufacturing a display device are provided. A method of manufacturing a display device may include: forming a sacrificial layer on a carrier glass; forming a first substrate layer on the sacrificial layer, the first substrate layer including an organic insulation material; forming a first through-hole in the first substrate layer, the first through-hole passing through the first substrate layer; forming a wiring on an upper surface of the first substrate layer, the wiring extending into the first through-hole; sequentially forming a circuit layer, an emission layer, and an encapsulation layer on the wiring; separating the sacrificial layer and the carrier glass from the first substrate layer by irradiating the sacrificial layer with a laser; and attaching a driving element on a lower surface of the first substrate layer, the driving element being electrically connected to the wiring through the first through-hole.