A photovoltaic laminate is disclosed. Embodiments include placing a first encapsulant on a substantially transparent layer that includes a front side of a photovoltaic laminate. Embodiments also include placing a first solar cell on the first encapsulant. Embodiments include placing a metal foil on the first solar cell, where the metal foil uniformly contacts a back side of the first solar cell. Embodiments include forming a metal bond that couples the metal foil to the first solar cell. In some embodiments, forming the metal bond includes forming a metal contact region using a laser source, wherein the formed metal contact region electrically couples the metal foil to the first solar cell. Embodiments can also include placing a backing material on the metal foil. Embodiments can further include forming a back layer on the backing material layer and curing the substantially transparent layer, first encapsulant, first solar cell, metal foil, backing material and back layer to form a photovoltaic laminate.

A method including providing a substrate comprising a device layer on which a plurality of device cells are defined; depositing a first dielectric layer on the device layer and metal interconnect such that the deposited interconnect is electrically connected to at least two of the device cells; depositing a second dielectric layer over the interconnect; and exposing at least one contact point on the interconnect through the second dielectric layer. An apparatus including a substrate having defined thereon a device layer including a plurality of device cells; a first dielectric layer disposed directly on the device layer; a plurality of metal interconnects, each of which is electrically connected to at least two of the device cells; and a second dielectric layer disposed over the first dielectric layer and over the interconnects, wherein the second dielectric layer is patterned in a positive or negative planar spring pattern.

Approaches for the foil-based metallization of solar cells and the resulting solar cells are described. In an example, a solar cell includes a substrate. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the substrate. A conductive contact structure is disposed above the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal seed material regions providing a metal seed material region disposed on each of the alternating N-type and P-type semiconductor regions. A metal foil is disposed on the plurality of metal seed material regions, the metal foil having anodized portions isolating metal regions of the metal foil corresponding to the alternating N-type and P-type semiconductor regions.

Methods of fabricating solar cells using a metal-containing thermal and diffusion barrier layer in foil-based metallization approaches, and the resulting solar cells, are described. For example, a method of fabricating a solar cell includes forming a plurality of semiconductor regions in or above a substrate. The method also includes forming a metal-containing thermal and diffusion barrier layer above the plurality of semiconductor regions. The method also includes forming a metal seed layer on the metal-containing thermal and diffusion barrier layer. The method also includes forming a metal conductor layer on the metal seed layer. The method also includes laser welding the metal conductor layer to the metal seed layer. The metal-containing thermal and diffusion barrier layer protects the plurality of semiconductor regions during the laser welding.

Thermal compression bonding approaches for foil-based metallization of solar cells, and the resulting solar cells, are described. For example, a method of fabricating a solar cell includes placing a metal foil over a metalized surface of a wafer of the solar cell. The method also includes locating the metal foil with the metalized surface of the wafer. The method also includes, subsequent to the locating, applying a force to the metal foil such that a shear force appears between the metal foil and the metallized surface of the wafer to electrically connect a substantial portion of the metal foil with the metalized surface of the wafer.

A high efficiency configuration for a solar cell module comprises solar cells arranged in an overlapping shingled manner and conductively bonded to each other in their overlapping regions to form super cells, which may be arranged to efficiently use the area of the solar module.

Automatic assembly method of a photovoltaic panel with cells of the back-contact type provided with a conductive backsheet with a thermoplastic encapsulating layer; the loading of the cells occurs in combination with their pre-fixing in a combined station sequentially placed before the superimposition of the upper encapsulating layer and after the laying of the conductive adhesive. The loading is carried out with a first device of the automatic mechanical hand type which takes a group of cells, aligns them with the back contacts in correspondence of the holes and lays them vertically from above. Furthermore, a second device of the presser-heater type carries out the pre-fixing of the cells holding them in the final position also with localized heating on at least one portion of each cell in such a way as to activate the adhesive function of the underlying thermoplastic encapsulating layer. A combined loading and pre-fixing station is also disclosed.

Automatic production system and production process for the automatic manufacturing of conductive backsheets with an integrated encapsulating and dielectric layer, for photovoltaic panels of the back-contact type. The system includes operating stations in sequence and is made up of at least one main line combined with a secondary line having a flow converging to a station of calibrated superimposition with fixing. The main line, on trays on a continuous conveying system, arranges and prepares the back supporting and conductive layer, whereas the secondary line forms the encapsulating and dielectric multi-layer element holed in correspondence of the electrical contacts comprising an automatic picking device which takes, roto-translates and holds said multi-layer element during processing and releases it only after the calibrated superimposition with fixing. The system is combined with a control system made up of at least four devices integrated with one another to enable calibration and check the automated processes.

A solar cell module includes solar cells. encapsulants are layered on surfaces of the solar cells. A glass substrate is layered on the encapsulants. The solar cell module further includes an epoxy resin-containing member. Each encapsulant includes the ultraviolet ray-absorbing member. The ultraviolet ray-absorbing member sets the transmittance to 1% or less at the wavelengths ranging from 300 to 360 nm.

A photovoltaic module comprises a back substrate having a plurality of conductive interconnects on top thereof. A conductive interconnect includes a first contact region and a second contact region. The photovoltaic module further comprises a plurality of photovoltaic cells comprising front electrodes disposed on a front surface of a photovoltaic layer on top of back electrodes on top of a support substrate. A plurality of back vias extending through the support substrate of a first cell form an electrical contact between the back electrodes and the second contact region, and a plurality of front vias extending through the support substrate, the back electrodes and the photovoltaic layer of a second cell form an electrical contact between the front electrodes and the first contact region, and is insulated from an electrical contact with the back electrodes and a P side of the photovoltaic layer.