A negative differential resistance device includes a dielectric layer having a first surface and a second surface opposing the first surface, a first semiconductor layer that includes a first degenerated layer that is on the first surface of the dielectric layer and has a first polarity, a second semiconductor layer that includes a second degenerated layer that has a region that overlaps the first semiconductor layer and has a second polarity, a first electrode electrically connected to the first semiconductor layer, a second electrode electrically connected to the second semiconductor layer, and a third electrode on the second surface of the dielectric layer and which has a region overlapping at least one of the first semiconductor layer or the second semiconductor layer.

Provided is a semiconductor device including a first semiconductor transistor including a semiconductor channel layer, and a metal-oxide semiconductor channel layer, and having a structure in which a second semiconductor transistor is stacked on the top of the first semiconductor transistor. A gate stack of the second semiconductor transistor and the top of a gate stack of the first semiconductor transistor may overlap by greater than or equal to 90%. The first semiconductor transistor and the second semiconductor transistor may have a similar level of operation characteristics.

A semiconductor device with low power consumption is provided. The semiconductor device includes a first transistor, a second transistor, and a capacitor. The first transistor includes a first gate and a first back gate, and the second transistor includes a second gate and a second back gate. A gate insulating layer for the first back gate has ferroelectricity. The first transistor has a function of, when being in an off state, retaining a first potential corresponding to first data. The second transistor has a function of making an output current flow between a source and a drain of the second transistor.

The present disclosure provides a semiconductor device based on a dielectric material containing a metal interstitial impurity, including: a substrate, a dielectric material layer, and a functional layer. A material for preparing the dielectric material layer is a compound containing the metal interstitial impurity. The dielectric material layer and/or the functional layer is configured to subject to at least one of electricity, heat, light or magnetism, such that the dielectric material layer reaches a crystallization temperature to transit from a first state to a second state.

A memory device including a plurality of memory cells, at least one of the plurality of memory cells includes a first transistor, a second transistor, and a third transistor. The first transistor includes a first drain/source path and a first gate structure electrically coupled to a write word line. The second transistor includes a second drain/source path and a second gate structure electrically coupled to the first drain/source path of the first transistor. The third transistor includes a third drain/source path electrically coupled to the second drain/source path of the second transistor and a third gate structure electrically coupled to a read word line. Where, the first transistor, and/or the second transistor, and/or the third transistor is a ferroelectric field effect transistor or a negative capacitance field effect transistor.

A semiconductor device includes a first channel region disposed over a substrate, and a first gate structure disposed over the first channel region. The first gate structure includes a gate dielectric layer disposed over the channel region, a lower conductive gate layer disposed over the gate dielectric layer, a ferroelectric material layer disposed over the lower conductive gate layer, and an upper conductive gate layer disposed over the ferroelectric material layer. The ferroelectric material layer is in direct contact with the gate dielectric layer and the lower gate conductive layer, and has a U-shape cross section.

A memory device with a novel structure. A first transistor includes a first oxide semiconductor layer, a first conductive layer, a second conductive layer, a third conductive layer, a fourth conductive layer, a first insulating layer, and a second insulating layer. A second transistor includes a second oxide semiconductor layer, the first conductive layer, a fifth conductive layer, a sixth conductive layer, a seventh conductive layer, a third insulating layer, and a fourth insulating layer. In a plan view, the first oxide semiconductor layer includes a region facing the first conductive layer with the first insulating layer therebetween and a region facing the second conductive layer with the second insulating layer therebetween. In a plan view, the second oxide semiconductor layer includes a region facing the fifth conductive layer with the third insulating layer therebetween and a region facing the sixth conductive layer with the fourth insulating layer therebetween. The first oxide semiconductor layer is provided in contact with the third conductive layer and the fourth conductive layer. The second oxide semiconductor layer is provided in contact with the first conductive layer and the seventh conductive layer. In a cross-sectional view, the third conductive layer includes a region overlapping with the first conductive layer, the second conductive layer, the fourth conductive layer, the fifth conductive layer, the sixth conductive layer, and the seventh conductive layer.

A semiconductor memory device is provided. The semiconductor device includes: a stacked structure with word line plates and mold insulating layers which extend in first and second horizontal directions, and are alternately stacked in a vertical direction in a cell array region and an extension region, the plurality of word line plates forming a staircase structure in the extension region; a vertical bit line extending into the stacked structure in the cell array region; a plurality of selection layers between the plurality of word line plates and the vertical bit line; and a vertical channel transistor connected to one end of the vertical bit line. A first thickness of each of the plurality of mold insulating layers is about 1.5 times to about 3 times a second thickness of each of the plurality of word line plates.

A ferroelectric field effect transistor comprises a semiconductive channel comprising opposing sidewalls and an elevationally outermost top. A source/drain region is at opposite ends of the channel. A gate construction of the transistor comprises inner dielectric extending along the channel top and laterally along the channel sidewalls. Inner conductive material is elevationally and laterally outward of the inner dielectric and extends along the channel top and laterally along the channel sidewalls. Outer ferroelectric material is elevationally outward of the inner conductive material and extends along the channel top. Outer conductive material is elevationally outward of the outer ferroelectric material and extends along the channel. Other constructions and methods are disclosed.

The present disclosure relates to a memory cell, a memory array, and methods for writing a memory cell. In an example embodiment, a memory cell comprises a first transistor, a second transistor, and a differential sense amplifier. The first transistor is a Vt-modifiable n-channel transistor and the second transistor is a Vt-modifiable p-channel transistor, each transistor having first and second main electrodes. The first main electrodes of the first and second transistors are connected together. The differential sense amplifier is connected to the second main electrodes of the first and the second transistor. The differential sense amplifier is adapted for sensing the current difference between the first transistor and the second transistor.