Disclosed is a RF switch module and methods to fabricate and operate such RF switch to alternatively couple an antenna to either a transmitter transmission line or a receiver transmission line to realize lower distortion of a signal at high frequencies with improved insertion loss and without affecting isolation. In one embodiment, a Radio Frequency (RF) switch module, includes, a switch circuit for switching between transmitting first signals from a transmitter unit to an antenna and transmitting second signals from the antenna to the receiver unit, wherein the switch circuit comprises a plurality of field effect transistors (FETs), wherein each of the plurality of FETs comprises stacked gate dielectrics and at least three metal contacts to a conductive gate, wherein the stacked gate dielectrics comprises at least one first dielectric layer, wherein the first dielectric layer comprises a negative-capacitance material.

A memory device and method of forming the same are provided. The memory device includes a first memory cell disposed over a substrate. The first memory cell includes a transistor and a data storage structure coupled to the transistor. The transistor includes a gate pillar structure, a channel layer laterally wrapping around the gate pillar structure, a source electrode surrounding the channel layer, and a drain electrode surrounding the channel layer. The drain electrode is separated from the source electrode a dielectric layer therebetween. The data storage structure includes a data storage layer surrounding the channel layer and sandwiched between a first electrode and a second electrode. The drain electrode of the transistor and the first electrode of the data storage structure share a common conductive layer.

A semiconductor device includes a substrate including a planar portion and a mesa portion over the planar portion; an oxide layer over the mesa portion; a ferroelectric material strip covering a protruding plane of the oxide layer and exposing a side plane of the oxide layer; and a gate strip over the ferroelectric material strip and overlapping the oxide layer.

A metal gate stack on a substrate comprises: an interfacial layer on the substrate; a high- metal oxide layer on the interfacial layer, the high- metal oxide layer comprising a dipole region adjacent to the interfacial layer, the dipole region comprising niobium (Nb); a high- metal oxide capping layer on the high- metal oxide layer; a positive metal-oxide-semiconductor (PMOS) work function material above the high- metal oxide capping layer; and a gate electrode above the PMOS work function material. The dipole region is formed by driving Nb species of a Nb-based film into the high- metal oxide layer to form a dipole region.

The present disclosure relates to an integrated circuit (IC) in which a memory structure comprises a ferroelectric structure without critical-thickness limitations. The memory structure comprises a first electrode and the ferroelectric structure. The ferroelectric structure is vertically stacked with the first electrode and comprises a first ferroelectric layer, a second ferroelectric layer, and a first restoration layer. The second ferroelectric layer overlies the first ferroelectric layer, and the first restoration layer is between and borders the first and second ferroelectric layers. The first restoration layer is a different material type than that of the first and second ferroelectric layers and is configured to decouple crystalline lattices of the first and second ferroelectric layers so the first and second ferroelectric layers do not reach critical thicknesses. A critical thickness corresponds to a thickness at and above which the orthorhombic phase becomes thermodynamically unstable, such that remanent polarization is lost.

A 3-dimensional vertical memory string array includes high-speed ferroelectric field-effect transistor (FET) cells that are low-cost, low-power, or high-density and suitable for SCM applications. The memory circuits of the present invention provide random-access capabilities. The memory string may be formed above a planar surface of substrate and include a vertical gate electrode extending lengthwise along a vertical direction relative to the planar surface and may include (i) a ferroelectric layer over the gate electrode, (ii) a gate oxide layer; (iii) a channel layer provided over the gate oxide layer; and (iv) conductive semiconductor regions embedded in and isolated from each other by an oxide layer, wherein the gate electrode, the ferroelectric layer, the gate oxide layer, the channel layer and each adjacent pair of semiconductor regions from a storage transistor of the memory string, and wherein the adjacent pair of semiconductor regions serve as source and drain regions of the storage transistor.

Provided are an electronic device and a method of manufacturing the same. The electronic device includes a ferroelectric crystallization layer between a substrate and a gate electrode and a crystallization prevention layer between the substrate and the ferroelectric crystallization layer. The ferroelectric crystallization layer is at least partially crystallized and includes a dielectric material having ferroelectricity or anti-ferroelectricity. Also, the crystallization prevention layer prevents crystallization in the ferroelectric crystallization layer from being spread toward the substrate.

A semiconductor device with a small circuit area and low power consumption is provided. The semiconductor device includes first to fourth cells, a current mirror circuit, and first to fourth wirings, and the first to fourth cells each include a first transistor, a second transistor, and a capacitor. In each of the first to fourth cells, a first terminal of the first transistor is electrically connected to a first terminal of the capacitor and a gate of the second transistor. The first wiring is electrically connected to first terminals of the second transistors in the first cell and the second cell, the second wiring is electrically connected to first terminals of the second transistors in the third cell and the fourth cell, the third wiring is electrically connected to second terminals of the capacitors in the first cell and the third cell, and the fourth wiring is electrically connected to second terminals of the capacitors in the second cell and the fourth cell. The current mirror circuit is electrically connected to the first wiring and the second wiring.

Provided is a ferroelectric field effect transistor including a source region, a drain region, a channel provided between the source region and the drain region, a ferroelectric layer provided on the channel and including a ferroelectric material including an oxide of a first element, a gate-interposed layer provided on the ferroelectric layer and including a paraelectric material including an oxide of a second element different from the first element, and a gate electrode provided on the gate-interposed layer, wherein the gate-interposed layer includes a first interposed layer adjacent to the ferroelectric layer, and a second interposed layer adjacent to the gate electrode, the first interposed layer includes a mixture of the first element and the second element, and a ratio of the first element in the first interposed layer may be greater than a ratio of the first element in the ferroelectric layer.

A four transistor ternary content-addressable memory cell includes a first series connection of a first non-hysteretic transistor (e.g., a thin-film transistor) and a first memory transistor (e.g., a thin-film transistor) including a first memory element configured to store a first binary bit; and a second series connection of a second non-hysteretic transistor and a second memory transistor including a second memory element configured to store a second binary bit. The first series connection and the second series connection are connected in parallel between a match line and a word line.