An array-type light-emitting device includes multiple pixel circuits electrically coupled in parallel and spatially arranged in a matrix. A power supply circuit supplies electric power to the array-type light-emitting device. A DC/DC converter has an output coupled to a power supply terminal of the array-type light-emitting device via a power supply line. A power supply control circuit sets a target value that corresponds to a light distribution pattern, and controls the DC/DC converter such that the control target voltage approaches the target value.

A unit pixel includes a transparent substrate, a plurality of light emitting devices arranged on the transparent substrate, and an optical layer disposed between the light emitting devices and the transparent substrate and transmitting light emitted from the light emitting devices. The transparent substrate has a concavo-convex pattern on a surface facing the light emitting devices.

The present inventive concept provides a display device comprising: a first electrode provided on a substrate; a light-emitting layer provided on the first electrode; a second electrode provided on the light-emitting layer; and an antireflective layer, which is provided on the second electrode and comprises a light-absorbing material, wherein the light-absorbing material comprises at least one selected from the group consisting of amorphous carbon (a-C), a polymer, a monomer, metal and graphite.

A pattern recognition substrate and a display device are disclosed, the pattern recognition substrate includes: a base substrate; a photosensitive device arranged on the base substrate and including a first electrode, a photoelectric conversion layer and a second electrode that are stacked, where the photoelectric conversion layer includes an I-type semiconductor layer with a thickness enough to convert a part of fingerprint-reflected light to an electrical signal, the first electrode includes a light-transmitting region transmitting the fingerprint-reflected light which is converted by the photoelectric conversion layer; and a light absorbing layer arranged between the base substrate and a layer where the photosensitive device is located to absorb the fingerprint-reflected light not converted by the photoelectric conversion layer.

Direct-bonded LED arrays and applications are provided. An example process fabricates a LED structure that includes coplanar electrical contacts for p-type and n-type semiconductors of the LED structure on a flat bonding interface surface of the LED structure. The coplanar electrical contacts of the flat bonding interface surface are direct-bonded to electrical contacts of a driver circuit for the LED structure. In a wafer-level process, micro-LED structures are fabricated on a first wafer, including coplanar electrical contacts for p-type and n-type semiconductors of the LED structures on the flat bonding interface surfaces of the wafer. At least the coplanar electrical contacts of the flat bonding interface are direct-bonded to electrical contacts of CMOS driver circuits on a second wafer. The process provides a transparent and flexible micro-LED array display, with each micro-LED structure having an illumination area approximately the size of a pixel or a smallest controllable element of an image represented on a high-resolution video display.

An object is to obtain a semiconductor device having a high sensitivity in detecting signals and a wide dynamic range, using a thin film transistor in which an oxide semiconductor layer is used. An analog circuit is formed with the use of a thin film transistor including an oxide semiconductor which has a function as a channel formation layer, has a hydrogen concentration of 510.sup.19 atoms/cm.sup.3 or lower, and substantially functions as an insulator in the state where no electric field is generated. Thus, a semiconductor device having a high sensitivity in detecting signals and a wide dynamic range can be obtained.

A light emitting diode including a substrate having a first area and a second area defined by an isolation groove line, a semiconductor stack disposed on the substrate and including a lower semiconductor layer, an upper semiconductor layer, an active layer, a first electrode pad electrically connected to the lower semiconductor layer, a second electrode pad electrically connected to the upper semiconductor layer, and a connecting portion electrically connecting the semiconductor stack disposed in the first and second areas to each other, and including a first portion, a second portion, and a third portion extending from a second distal end of the first portion, in which the isolation groove line is disposed between the first and second electrode pads and exposes the substrate, the first portion extends along a first direction substantially parallel to an extending direction of the isolation groove line, and the second and third portions extend in a second direction crossing the first direction.

A display device comprises a substrate, a first electrode on the substrate and extending in a first direction, a second electrode on the substrate and extending in the first direction, the second electrode being spaced apart from the first electrode in a second direction, a first insulating layer on the first electrode and the second electrode, light-emitting elements on the first insulating layer, the light-emitting elements being disposed on the first electrode and the second electrode, a second insulating layer disposed on the light-emitting elements, a first contact electrode disposed on the first electrode and electrically contacting the light-emitting elements, and a second contact electrode disposed on the second electrode and electrically contacting the light-emitting elements. The second insulating layer comprises patterns that cover at least part of the light-emitting elements and are spaced apart from one another in the first direction.

An electronic device can include integrated micro circuitry configurable for optical sensing and touch and/or proximity sensing. An integrated touch screen can include light emitting diodes or organic light emitting diodes and chiplets. In some examples, the LEDs/OLEDs and chiplets can be disposed in a visible area of the integrated touch screen. In some examples, some or all of the chiplets can be disposed outside of the visible area of the integrated touch screen. In some examples, the chiplets can include display driving circuitry and touch sensing circuitry, and can optionally perform optical sensing using the touch sensing circuitry. In some examples, the chiplets can include separate touch chiplets configured to perform touch sensing (and/or optical sensing) and display chiplets configured to perform display functionality (and optionally provide some switching functionality).

A display device and an electronic device are provided. The display device includes a back plate, a display panel, an optical film, a first light-emitting unit, and a second light-emitting unit. The display panel and the second light-emitting unit are carried on the back plate. The optical film and the first light-emitting unit located on one side of the optical film away from the display panel are accommodated in an accommodating cavity cooperatively defined by the display panel and the back plate. The visible light emitted by the first light-emitting unit is incident on the display panel via the optical film. A part of the ultraviolet light emitted by the second light-emitting unit avoids the display screen and is emitted onto the transparent cover plate, and another part of the ultraviolet light is emitted onto the transparent cover plate via the display screen, to clean the display panel.