A light emitting substrate and a display device are provided, the light emitting substrate includes: a base substrate: an electrode planarization layer, on the base substrate: an electrode layer, at a side of the electrode planarization layer away from the base substrate, the electrode layer includes a first electrode and a second electrode, the first electrode includes at least one first electrode strip, the second electrode includes at least one second electrode strip, the first electrode strip and the second electrode strip are spaced and alternately arranged in a first direction, each of the at least one first electrode strip and each of the at least one second electrode strip extend along a second direction, the electrode planarization layer includes a first groove between a first electrode strip and a second electrode strip which are adjacent to each other, the first groove is configured to accommodate a light emitting diode.

A method includes forming a light emitting chip on a surface of a growth substrate; forming a transfer film layer on a transient substrate; forming an electrode fixing structure on a side of the transfer film layer away from the transient substrate, and opening a through-wire hole in the transfer film layer adjacent to the electrode fixing structure; making the growth substrate opposite to the transient substrate; making the light emitting transfer structure opposite to a driving backplane; and forming a connection wire, a portion of the connection wire is connected to the binding-point electrode through the through-wire hole, and another portion of the connection wire is connected to the electrode fixing structure.

A light-emitting element includes a semiconductor structure body, a light-transmissive conductive film, a light-transmissive insulating film provided with a plurality of first openings, and a light-reflective conductive film contacting the light-transmissive conductive film in the first openings. In a top view, the extending portions of a first semiconductor layer include end portions (the portion of the extending portion located closest to a side of a second outer peripheral portion), the light-transmissive conductive film includes outer edges facing the end portions of the extending portions in a second direction, respectively, the first openings are not located between a first outer peripheral portion and a first straight line passing through an outer edge closest to the second outer peripheral portion among the plurality of outer edges of the light-transmissive conductive film and extending in a first direction, and are located between the first straight line and the second outer peripheral portion.

A unit pixel includes a transparent substrate, a plurality of light emitting devices arranged on the transparent substrate, and an optical layer disposed between the light emitting devices and the transparent substrate and transmitting light emitted from the light emitting devices. The transparent substrate has a concavo-convex pattern on a surface facing the light emitting devices.

A light emitting diode package includes a light emitting diode chip provided at a lower side thereof with a first electrode pad and a second electrode pad, a first lead and a second lead spaced apart from each other and contacting the first electrode pad and the second electrode pad of the light emitting diode chip to be electrically connected thereto, respectively, and a housing formed to surround the first lead and the second lead and having a cavity open at a top portion thereof. The first lead and the second lead have a first lead exposing plane and a second lead exposing plane disposed on a lower surface of the cavity of the housing and partially exposing the first lead and the second lead, respectively.

In an embodiment, an optoelectronic component includes a structured region including a semiconductor body having a first semiconductor region and a second semiconductor region, which have different conductivities, a first main surface and a second main surface and at least one first delimiting surface and at least one second delimiting surface delimiting a recess, a protective layer, which is arranged on the at least one first delimiting surface and covers a junction between the first semiconductor region and the second semiconductor region in the recess, wherein the first main surface is not covered by the protective layer and the protective layer does not adjoin any further protective layer on a side facing the junction and on a side facing away from the junction, and wherein the protective layer is retracted from the first delimiting surface and the second delimiting surface or wherein the protective layer has an L-shape in cross-section.

A light emitting diode including a substrate having a first area and a second area defined by an isolation groove line, a semiconductor stack disposed on the substrate and including a lower semiconductor layer, an upper semiconductor layer, an active layer, a first electrode pad electrically connected to the lower semiconductor layer, a second electrode pad electrically connected to the upper semiconductor layer, and a connecting portion electrically connecting the semiconductor stack disposed in the first and second areas to each other, and including a first portion, a second portion, and a third portion extending from a second distal end of the first portion, in which the isolation groove line is disposed between the first and second electrode pads and exposes the substrate, the first portion extends along a first direction substantially parallel to an extending direction of the isolation groove line, and the second and third portions extend in a second direction crossing the first direction.

A light-emitting device including an epitaxial layer, a support layer, an insulating layer, a first electrode pad, and a second electrode pad is provided. The epitaxial layer includes a first type doped semiconductor layer, a light-emitting layer and a second type doped semiconductor layer, wherein the light-emitting layer is disposed on a partial area of the first type doped semiconductor layer and is between the first type doped semiconductor layer and the second type doped semiconductor layer. The support layer covers the second type doped semiconductor layer while the insulating layer covers the epitaxial layer and the support layer. The first and the second electrode pads are disposed over the insulating layer and electrically connected to the first and the second type doped semiconductor layers, respectively. The support layer extends from a first position below the first electrode pad to a second position below the second electrode pad.

A display device and a method of manufacturing the display device are provided. The display device includes a display substrate including a driving circuit; an array layer provided on the display substrate and including a plurality of grooves; a micro-semiconductor chip provided in a groove of the plurality of grooves, the micro-semiconductor chip including: an n-type semiconductor layer; an active layer provided on the n-type semiconductor layer; a p-type semiconductor layer provided on the active layer; and a first electrode provided on the p-type semiconductor layer; and a second electrode connected to the n-type semiconductor layer from a lower surface of the display substrate; a first wiring connected to the first electrode; and a second wiring connected to the second electrode.

The disclosure provides a light emitting element array, a display device, and a method of manufacturing the display device. A light emitting element array includes a base substrate, each of a plurality of light emitting elements including a light emitting element rod including a third semiconductor layer, a second semiconductor layer, a light emitting layer, and a first semiconductor layer sequentially stacked on the base substrate and an insulating layer surrounding the light emitting element rod and a connection electrode disposed on the first semiconductor layer of each of the plurality of light emitting elements, wherein a diameter of the connection electrode is greater than a diameter of the light emitting element, and the connection electrode surrounds a side surface of the first semiconductor layer and a side surface of the light emitting layer.