A light source module includes a circuit board having a plurality of chip mounting regions, the plurality of chip mounting regions respectively having at least one connection pad; at least one alignment component respectively disposed on the plurality of chip mounting regions, and having a convex or concave shape; and a plurality of LED chips respectively mounted on the plurality of chip mounting regions, respectively having at least one electrode electrically connected to the at least one connection pad, and respectively coupled to the at least one alignment component.

A light-emitting element, a light-emitting element unit and a light-emitting element package are provided, which are each reduced in reflection loss and intra-film light absorption by suppressing multiple light reflection in a transparent electrode layer and hence have higher luminance. The light-emitting element 1 includes a substrate 2, an n-type nitride semiconductor layer 3, a light-emitting layer 4, a p-type nitride semiconductor layer 5, a transparent electrode layer 6 and a reflective electrode layer 7, and the transparent electrode layer 6 has a thickness T satisfying the following expression (1):

[00001]$\begin{array}{cc}\frac{3.Math.}{4.Math.n}+0.30\left(\frac{}{4.Math.n}\right)T\frac{3.Math.}{4.Math.n}+0.45\left(\frac{}{4.Math.n}\right)& \left(1\right)\end{array}$

wherein is the light-emitting wavelength of the light-emitting element 4, and n is the refractive index of the transparent electrode layer 6.

A light emitting device includes a first bonding pad configured to be mounted to a substrate, a first electrode electrically connected to the first bonding pad, a first conductive type semiconductor layer having a middle area disposed between two, opposing end areas, a second conductive type semiconductor layer disposed on the first conductive type semiconductor layer and connected to the first electrode; and a first contact portion and a plurality of second contact portions disposed on the first conductive type semiconductor layer, in which the first contact portion is disposed adjacent one end area of the first conductive type semiconductor layer, the second contact portions are disposed in the middle area of the first conductive type semiconductor layer, and the first bonding pad exposes at least one of the second contact portion.

A light-emitting element includes a semiconductor light-emitting stack including a first semiconductor layer, an active layer, and a second semiconductor layer; a first conductive layer disposed on the second semiconductor layer and electrically connecting the second semiconductor layer; a second conductive layer disposed on the second semiconductor layer and electrically connecting the first semiconductor layer; and a cushion part disposed on the semiconductor light-emitting stack; wherein in a top view, the cushion part is disposed in a center region of the light-emitting element.

Provided is a light-emitting module that achieves high brightness, whose electrode structure is simple and whose brightness distribution has rotational symmetry. The light-emitting module includes a substrate, a first electrode and a second electrode disposed on the substrate, LED devices connected between the first electrode and the second electrode, a dam member disposed on the substrate so as to surround the LED devices, and a phosphor-containing resin for sealing the LED devices by being filled into a region surrounded by the dam member on the substrate. The first electrode includes a first outer electrode disposed under the dam member and a first inner electrode disposed nearer to a center of the substrate than the first outer electrode is. The second electrode includes a second outer electrode disposed under the dam member and a second inner electrode disposed nearer to the center of the substrate than the second outer electrode is. The first outer electrode is disposed so as to oppose the second inner electrode. The second outer electrode is disposed so as to oppose the first inner electrode.

The light emitting device includes the cap including the ultraviolet light transmitting part made of glass for transmitting ultraviolet light. In the light emitting device, the first electrode of the ultraviolet light emitting element and the first conductor of the mounting substrate are bonded with the first bond made of AuSn, the second electrode of the ultraviolet light emitting element and the second conductor of the mounting substrate are bonded with the second bond made of AuSn, and the first bonding metal layer of the mounting substrate and the second bonding metal layer of the cap are bonded with the third bond made of AuSn.

A display device in accordance with some embodiments may include a base layer, a first bank pattern and a second bank pattern on the base layer, and spaced apart from each other in a first direction, a first electrode overlapping the first bank pattern, a second electrode overlapping the second bank pattern, and a light emitting element aligned between the first electrode and the second electrode, wherein a distance between an end of the first electrode and an end of the first bank pattern differs from a distance between an end of the second electrode and an end of the second bank pattern in the first direction.

A display device in accordance with some embodiments may include a base layer, a first bank pattern and a second bank pattern on the base layer, and spaced apart from each other in a first direction, a first electrode overlapping the first bank pattern, a second electrode overlapping the second bank pattern, and a light emitting element aligned between the first electrode and the second electrode, wherein a distance between an end of the first electrode and an end of the first bank pattern differs from a distance between an end of the second electrode and an end of the second bank pattern in the first direction.

A display device is provided. The display device includes a substrate, a driving layer, a light-emitting element, and a light-shielding element. The substrate has a surface. The driving layer includes a thin-film transistor. The thin-film transistor is disposed on the surface. The light-emitting element has a P-end and an N-end. The light-emitting element is disposed on the driving layer and arranged in such a way that a virtual line connecting the P-end and the N-end is parallel to the surface of the substrate. The light-shielding element is disposed between the light-emitting element and the thin-film transistor for blocking a light emitted from the light-emitting element from irradiating the thin-film transistor.

A display device is provided. The display device includes a substrate, a driving layer, a light-emitting element, and a light-shielding element. The substrate has a surface. The driving layer includes a thin-film transistor. The thin-film transistor is disposed on the surface. The light-emitting element has a P-end and an N-end. The light-emitting element is disposed on the driving layer and arranged in such a way that a virtual line connecting the P-end and the N-end is parallel to the surface of the substrate. The light-shielding element is disposed between the light-emitting element and the thin-film transistor for blocking a light emitted from the light-emitting element from irradiating the thin-film transistor.