A thin film transistor array substrate includes a bottom gate disposed on a substrate and a bottom gate insulating layer covering the bottom gate, a semiconductor oxide layer disposed on the bottom gate insulating layer and an etch blocking layer covering the semiconductor oxide layer and including a first via, a drain disposed on the etch blocking layer and contacting with the semiconductor oxide layer through the first via and an insulating protection layer covering the drain, a second via arranged in the insulating protection layer, the etch blocking layer and the bottom gate insulating layer, a top gate disposed on insulating protection layer and contacting with the bottom gate through the second via. A method for manufacturing the thin film transistor array substrate is also disclosed. The thin film transistor prevents the threshold voltage thereof from being drifted in a case of negative bias illumination stress (NBIS).

In an active matrix substrate, each of at least two auxiliary capacitance electrodes contains a first electrode section and a second electrode section, at least a portion of the first electrode sections and at least a portion of a plurality of source bus lines overlap each other, the second electrode section has two linear sections that branch from the first electrode section and that extend in a second direction, a portion of the region between the two linear sections and at least a portion of the plurality of source bus lines overlap each other, and the first and second electrode sections, which are adjacent and arranged in a first direction, are disposed symmetrically to each other about a reference point that is on a straight line passing through a substantially central portion of respective pixels arranged in the first direction.

A dual gate oxide semiconductor TFT substrate is made by utilizing a halftone mask to implement one photo process, which accomplishes patterning of an oxide semiconductor layer and forms an oxide conductor layer with ion doping process. Patterning of a bottom gate isolation layer and a top gate isolation layer are performed at the same time with one photo process. A first top gate, a first source, a first drain, a second top gate, a second source, and a second drain are formed at the same time with one photo process. Patterning of a flat layer, a passivation layer, and a top gate isolation layer are performed at the same time with one photo process. As such, the number of photo processes applied to manufacture the TFT substrate is reduced to five and the manufacturing process is shortened to thereby raise the production efficiency and lower the production cost.

Provided is a co-planar oxide semiconductor TFT substrate structure, in which an active layer includes a main body and a plurality of short channels connected to the main body and are separated with a plurality of strip metal electrodes to make the active layer possess higher mobility and lower leak current. Also provided is a manufacture method of the co-planar oxide semiconductor TFT substrate structure, in which with the plurality of strip metal electrodes formed between the source and the drain, which are separately positioned, as deposing the oxide semiconductor layer, the plurality of short channels can be formed between the source and the drain. The method is simple and does not require additional mask or process to obtain the active layer structure different from prior art. The manufactured actively layer possesses higher mobility and lower leak current. Thus, the performance of the TFT element can be improved.

An integrated circuit (IC) includes a first semiconductor device on a glass substrate. The first semiconductor device includes a first semiconductive region of a bulk silicon wafer. The IC includes a second semiconductor device on the glass substrate. The second semiconductor device includes a second semiconductive region of the bulk silicon wafer. The IC includes a through substrate trench between the first semiconductive region and the second semiconductive region. The through substrate trench includes a portion disposed beyond a surface of the bulk silicon wafer.

A semiconductor device having a high aperture ratio and including a capacitor capable of increasing the charge capacity is provided. A semiconductor device includes a transistor over a substrate, a first light-transmitting conductive film over the substrate, an oxide insulating film covering the transistor and having an opening over the first light-transmitting conductive film, a nitride insulating film over the oxide insulating film and in contact with the first light-transmitting conductive film in the opening, a second light-transmitting conductive film connected to the transistor and having a depressed portion in the opening, and an organic resin film with which the depressed portion of the second light-transmitting conductive film is filled.

A pixel electrode of an array substrate is connected with a drain electrode of a TFT via a first aperture formed on a second interlayer insulating film, a second aperture that includes a bottom portion of the first aperture and is formed on a common electrode, a third aperture that includes at least a part of the bottom portion of the first aperture, is included in a second aperture and is formed on a third interlayer insulating film, and a fourth aperture that is formed on the first interlayer insulating film in a region where the third aperture overlaps with the bottom portion of the first aperture.

A method for manufacturing an array substrate comprises: forming a pixel electrode and a gate of a thin film transistor on a substrate; forming a gate insulating layer; forming an active layer and a source and a drain, which are provided on the active layer, of the thin film transistor by a patterning process; forming a passivation layer; forming a main via penetrating through the gate insulating layer and the passivation layer and a main-via extension portion under a portion of the drain by a patterning process, wherein the main via is connected to the main-via extension portion; removing a portion of the drain which protrudes above the main-via extension portion so as to form a final via; and forming a connection electrode and a common electrode, wherein the connection electrode electrically connects the drain to the pixel electrode through the final via.

An array substrate is provided. The array substrate includes: a substrate; a LTPS TFT disposed above the substrate; a planarization layer covering the LTPS TFT; a via hole formed in the planarization layer, wherein the via hole reveals a drain electrode of the LTPS TFT; multiple common electrodes and receiving electrodes disposed separately on the planarization layer, wherein the multiple common electrode function as a driving electrode in a touch stage, and the multiple common electrodes which are disposed separately are connected with each other; a passivation layer which covers the multiple common electrodes and the multiple receiving electrodes and the planarization layer; and a pixel electrode disposed on the passivation layer, wherein, the pixel electrode is contacted with the drain electrode through the via hole. A manufacturing method for the array substrate is also provided. The present invention can reduce one manufacturing process and decrease production cost.

It is an object of the present invention to provide a semiconductor display device having an interlayer insulating film which can obtain planarity of a surface while controlling film formation time, can control treatment time of heating treatment with an object of removing moisture, and can prevent moisture in the interlayer insulating film from being discharged to a film or an electrode adjacent to the interlayer insulating film. An inorganic insulating film containing nitrogen, which is less likely to transmit moisture compared with an organic resin, is formed so as to cover a TFT. Next, an organic resin film containing photosensitive acrylic resin is applied to the organic insulting film, and the organic resin film is partially exposed to light to be opened. Thereafter, an inorganic insulting film containing nitrogen, which is less likely to transmit moisture compared with an organic resin, is formed so as to cover the opened organic resin film. Then, in the opening part of the organic resin film, a gate insulating film and the two layer inorganic insulating film containing nitrogen are opened partially by etching to expose an active layer of the TFT.