A light-emitting device includes a first light-emitting element, a phosphor, and a second light-emitting element having a peak wavelength between peak wavelengths of two peaks that define a deepest dip in a composite emission spectrum of the first light-emitting element and the phosphor.

An object of the present invention is to provide a light-emitting device that can implement a natural, vivid, highly visible and comfortable appearance of colors and appearance of objects as if the objects are seen outdoors, and to provide a light-emitting device that can change the appearance of colors of the illuminated objects so as to satisfy the requirements for various illuminations, and a method for designing thereof. Another object of the present invention is to improve the appearance of colors of a light-emitting device which currently exists or is in use, and which includes a semiconductor light-emitting device of which appearance of colors is not very good. Moreover, another object of the present invention is to provide a method for driving the light-emitting device, an illumination method by the device, and a method for manufacturing the light-emitting device.

These objects are achieved by the light-emitting device that incorporates light-emitting elements and satisfies predetermined requirements, in which .sub.SSL() emitted from the light-emitting device satisfies a predetermined condition.

To provide an illumination method and a light-emitting device which are capable of achieving, under an indoor illumination environment where illuminance is around 5000 lx or lower when performing detailed work and generally around 1500 lx or lower, a color appearance or an object appearance as perceived by a person, will be as natural, vivid, highly visible, and comfortable as though perceived outdoors in a high-illuminance environment, regardless of scores of various color rendition metric. Light emitted from the light-emitting device illuminates an object such that light measured at a position of the object satisfies specific requirements. A feature of the light-emitting device is that light emitted by the light-emitting device in a main radiant direction satisfies specific requirements.

A manufacturing method of a LED display is provided. A temporary substrate is provided, wherein the temporary substrate has a first adhesive layer and a plurality of first, second and third LED chips mounted on the first adhesive layer. A first transparent substrate is provided, the transparent substrate has a plurality of pixels disposed thereon, and each of the pixels comprises a first sub-pixel, a second sub-pixel and a third sub-pixel respectively surrounded by a light-insulating structure. Then, the temporary substrate and the first transparent substrate are bonded together, such that each of the first, second and third LED chips is correspondingly mounted in each of the first sub-pixels, the second sub-pixels and the third sub-pixels. After that, the temporary substrate is removed. A LED display manufactured by said method is also provided.

The invention discloses a QD CF substrate and manufacturing method thereof. The manufacturing method uses a patterned photo-resist layer as a masking layer to perform selective quenching on QD layer with a quencher to obtain selectively quenched QD layer, which simplifies QD CF substrate manufacturing process and reduces cost. The QD CF substrate does not use blue QD material in QD layer, but uses blue backlight and organic transparent photo-resist layer to improve light utilization efficiency and reduce material cost. The QD layer is a selectively quenched QD layer, and the portion of the QD layer located above the organic transparent photo-resist layer is quenched by the quencher, and will not emit light when excited by backlight. As such, the invention achieves using the QD material to improve color gamut and brightness, avoid color impurity at blue sub-pixels caused by light mixture, and the manufacturing method is simple.

First and second multi-LED packages are installed on a carrier. Each package includes its own emitting diodes that are series coupled to each other and that are encased within a single, internally reflective package having two external terminals. Each package has a light output face from which light, produced by all of the emitting diodes contained therein is emitted in response to a forward current passing through the two terminals. Each package also has phosphor mediums each positioned to be stimulated by primary light of a respective one of its contained emitting diodes, and in response emit secondary wavelength-converted light that emerges from the light output face and is combined with some of the primary light to yield white light. Other embodiments are also described and claimed.

Green-emitting phosphors are useful in devices including an LED light source radiationally coupled and/or optically coupled to the phosphors, which are selected from [Ba.sub.1abSr.sub.aCa.sub.b].sub.x[Mg,Zn].sub.y(UO.sub.2).sub.z([P,V]O.sub.4).sub.2(x+y+z)/3, where 0a1, 0b1, 0.75x1.25, 0.75y1.25, 0.75z1.25; and [Ba,Sr,Ca,Mg,Zn].sub.p(UO.sub.2).sub.q[P,V].sub.rO.sub.(2p+2q+5r)/2, where 2.5p3.5, 1.75q2.25, 3.5r4.5.

Light-emitting sub-pixels and pixels for micro-light-emitting diode-based displays are provided. Also provided are methods of fabricating individual sub-pixels, pixels, and arrays of the pixels. The sub-pixels include a double-layered film that includes a coupling layer disposed over a light-emitting diode and a light-emission layer disposed over the coupling layer.

Flip chip LEDs comprise a transparent carrier and an active material layer such as AlInGaP bonded to the carrier and that emits light between about 550 to 650 nm. The flip chip LED has a first electrical terminal in contact with a first region of the active material layer, and a second electrical terminal in contact with a second region of the active material layer, wherein the first and second electrical terminals are positioned along a common surface of the active material layer. Chip-on-board LED packages comprise a plurality of the flip chip LEDs with respective first and second electrical terminals interconnected with one another. The package may include Flip chip LEDs that emit light between 420 to 500 nm, and the flip chip LEDs are covered with a phosphorus material comprising a yellow constituent, and may comprise a transparent material disposed over the phosphorus material.

A lighting device including at least one light emitter to emit blue light, a green phosphor having an emission peak in a range of 500 nm to 550 nm, a yellow phosphor having an emission peak in a range of 550 nm to 600 nm, and a red phosphor having an emission peak in a range of 600 nm to 650 nm, in which the yellow phosphor and the red phosphor have different full widths at half maximum, and the full width at half maximum of the yellow phosphor is longer than that of the red phosphor, and, in an emission spectrum, an intensity of light emitted from the lighting device increases from 500 nm to 600 nm, and the intensity of light emitted from the lighting device at 700 nm is less than about 10% of the maximum intensity of light emitted from the lighting device.