An active-matrix touchscreen includes a substrate, a system controller, and a plurality of spatially separated independent touch elements disposed on the substrate. Each touch element includes a touch sensor and a touch controller circuit that provides one or more sensor-control signals to the touch sensor and receives a sense signal responsive to the sensor-control signals from the touch sensor. Each touch sensor operates independently of any other touch sensor.

Disclosed is a light emitting device. The light emitting device includes a body, first and second metal layers on a top surface of the body, a heat radiation plate disposed between the first and second metal layers and having a circular outline, a plurality of light emitting parts on the heat radiation plate, first and second bonding regions disposed on the first and second metal layers and electrically connected with the light emitting parts, and a molding member disposed on the heat radiation plate to cover the light emitting parts. Each of the light emitting parts includes a plurality of light emitting chips connected with each other, and a plurality of wires to electrically connect the light emitting chips with the first and second bonding regions, and the wires of each light emitting part are arranged a radial direction about a central of the heat radiation plate.

Disclosed herein are a light emitting module and a lighting device that may be used for a display application or a lighting application. The light emitting module includes an electrode layer including a plurality of blocks that are insulated from each other by an electrode separating line; and one or more light emitting elements mounted on the electrode layer so as to be electrically connected to any one block of the blocks of the electrode layer and a neighboring block, respectively, wherein the blocks have another neighboring block disposed in a first direction and still another neighboring block disposed in a second direction, based on any one block of the blocks while having the electrode separating line formed to be bent more than once at a predetermined interval therebetween so that heat generated from the light emitting elements is emitted through the blocks.

A light emitting device includes: a first support member having an opening; a second support member disposed in the opening of the first support member; an adhesive member disposed between the first and second support members; a first lead electrode disposed on the second support member; a second lead electrode disposed on at least one of the first and second support members; a light emitting chip disposed on the first lead electrode, the light emitting chip being electrically connected to the second lead electrode; and a conductive layer disposed under the second support member, wherein the first support member includes a resin material, the second support member includes a ceramic material, and the first lead electrode is disposed between the light emitting chip and the second support member.

The present invention discloses an embedded white light LED package structure based on a solid-state fluorescence material. In the present invention, the high power blue light chip is directly embedded into and bonded with a groove of the solid-state fluorescence material, and blue light emitted by the chip and yellow and green light obtained by conversion and emitted by the solid-state fluorescence material are blended by using the principle of lenses, to obtain white light. The embedded white light LED package structure based on a solid-state fluorescence material has a simple process, low cost, and high fluorescence efficiency; and blue light does not leak. Heat dissipation can be directly performed by using the solid-state fluorescence material, and heat dissipation performance is desirable. Energy conservation and environmental protection is achieved, and a service life of an LED lighting device is greatly improved.

The invention relates to an optoelectronic semiconductor device comprising a carrier, an optoelectronic semiconductor chip arranged on the carrier and a plurality of columns, wherein the plurality of columns are arranged on a base surface of the carrier opposite to the optoelectronic semiconductor chip, and wherein the plurality of columns cause a thermal heat conduction away from the optoelectronic semiconductor chip and the carrier. The invention further relates to a method for producing an optoelectronic semiconductor device.

Described herein are devices, systems and methods for utilizing fluid cooling to thermally manage electrically-powered devices such as microprocessors and microprocessor chips. Embodiments incorporating features of the present disclosure can purge heated cooling fluid from the system immediately after it has been used to absorb heat from an electrically-powered device, so that other devices in the system do not receive cooling fluid from another device in the system. In some embodiments, cooling fluid can be made to directly impinge on or near an electrically-powered device such as a microprocessor or microprocessor chip.

A tiled display device includes: a plurality of display devices; and a thermally variable member between the plurality of display devices. The thermally variable member includes a material whose light transmittance is different depending on a temperature.

A method of manufacturing a display module which is able to present a split-screen display without a black line prominent at the boundary includes: providing a first circuit substrate including a plurality of first pads, providing a second circuit substrate including a plurality of second pads; bonding the first circuit substrate and the second circuit sub state onto a surface of a heat dissipation plate through a first heat conductive adhesive; and mounting a plurality of light emitting diodes onto the first conductive wiring layer and the third conductive wiring layer, where one light emitting diodes is electrically connected to two first pad, one light emitting diode is electrically connected to one first pad and one second pad, and one light emitting diode is electrically connected to two second pads. A display module including light emitting diodes is also disclosed.

The invention relates to a light emitting device (LED), especially a LED at least partly embedded in transparent or translucent silicone fill, whereby the embedded LED is housed in a white silicone housing. Here and in the following, the wording transparent silicone fill always means a transparent or translucent silicone material. The invention further relates to a method for embedding the LED partly in a white silicone housing on the one hand and partly in transparent silicone fill on the other hand. The invention finally relates to the transparent silicone fill. The inner part of the LED device is at least partly embedded in transparent silicone fill, wherein the at least partly embedded LED device is housed in a white silicone housing comprising a white box silicone. A part of the inner part of the LED device is embedded in the white box silicone.