Embedded white light LED package structure based on solid-state fluorescence material and manufacturing method thereof

Abstract

The present invention discloses an embedded white light LED package structure based on a solid-state fluorescence material. In the present invention, the high power blue light chip is directly embedded into and bonded with a groove of the solid-state fluorescence material, and blue light emitted by the chip and yellow and green light obtained by conversion and emitted by the solid-state fluorescence material are blended by using the principle of lenses, to obtain white light. The embedded white light LED package structure based on a solid-state fluorescence material has a simple process, low cost, and high fluorescence efficiency; and blue light does not leak. Heat dissipation can be directly performed by using the solid-state fluorescence material, and heat dissipation performance is desirable. Energy conservation and environmental protection is achieved, and a service life of an LED lighting device is greatly improved.

Claims

1. An embedded white light LED package structure based on a solid-state fluorescence material, comprising a blue light chip and a Ce:YAG solid-state fluorescence material, wherein a groove matching the blue light chip is disposed on the Ce: YAG solid-state fluorescence material, and the blue light chip is embedded into the groove wherein the embedded white light LED package structure based on a solid-state fluorescence material further comprises a heat conducting substrate, and the heat conducting substrate is disposed on an embedded surface of the blue light chip of the Ce:YAG solid-state fluorescence material.

2. The embedded white light LED package structure based on a solid-state fluorescence material according to claim 1, wherein a light reflecting film is disposed on an embedded surface of the blue light chip of the Ce:YAG solid-state fluorescence material, the heat conducting substrate is disposed on an embedded surface of the blue light chip of the Ce:YAG solid-state fluorescence material.

3. The embedded white light LED package structure based on a solid-state fluorescence material according to claim 1, wherein a red light film is disposed on a light extraction surface of the Ce:YAG solid-state fluorescence material, and the red light film is capable of converting partial blue light into red light having a light emission band being 580 nm to 660 nm.

4. The embedded white light LED package structure based on a solid-state fluorescence material according to claim 1, wherein the Ce:YAG solid-state fluorescence material is any one of Ce:YAG fluorescent single crystal, Ce:YAG fluorescent polycrystal, Ce:YAG fluorescent ceramic, or Ce:YAG fluorescent glass.

5. The embedded white light LED package structure based on a solid-state fluorescence material according to claim 4, wherein a chemical formula of a main constituent of the Ce:YAG solid-state fluorescence material is (Y.sub.1-x-mA.sub.xCe.sub.m).sub.3(Al.sub.1-yB.sub.y).sub.5O.sub.12 with 0x1, 0y1, and 0m0.05, A representing one of Lu, Tb, Pr, La, and Gd, and B representing one of Ga, Ti, Mn, Cr, and Zr.

6. The embedded white light LED package structure based on a solid-state fluorescence material according to claim 1, wherein the blue light chip is GaN-based blue light chip.

7. The embedded white light LED package structure based on a solid-state fluorescence material according to claim 2, wherein a red light film is disposed on a light extraction surface of the Ce:YAG solid-state fluorescence material, and the red light film is capable of converting partial blue light into red light having a light emission band being 580 nm to 660 nm.

8. The embedded white light LED package structure based on a solid-state fluorescence material according to claim 2, wherein the Ce:YAG solid-state fluorescence material is any one of Ce:YAG fluorescent single crystal, Ce:YAG fluorescent polycrystal, Ce:YAG fluorescent ceramic, or Ce:YAG fluorescent glass.

9. The embedded white light LED package structure based on a solid-state fluorescence material according to claim 8, wherein a chemical formula of a main constituent of the Ce:YAG solid-state fluorescence material is (Y.sub.1-x-mA.sub.xCe.sub.m).sub.3(Al.sub.1-yB.sub.y).sub.5O.sub.12 with 0x1, 0y1, and 0m0.05, A representing one of Lu, Tb, Pr, La, and Gd, and B representing one of Ga, Ti, Mn, Cr, and Zr.

10. The embedded white light LED package structure based on a solid-state fluorescence material according to claim 2, wherein the blue light chip is GaN-based blue light chip.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) To illustrate the technical solutions in the embodiments of the present invention or in the prior art more clearly, the following briefly introduces the accompanying drawings required for describing the embodiments or the prior art. Apparently, the accompanying drawings in the following description show merely some embodiments of the present invention, and a person of ordinary skill in the art may still derive other drawings from these accompanying drawings without creative efforts.

(2) FIG. 1 is a schematic structural diagram of Embodiment 1 of the present invention;

(3) FIG. 2 is a schematic structural diagram of Embodiment 2 of the present invention;

(4) FIG. 3 is a schematic structural diagram of Embodiment 3 of the present invention; and

(5) FIG. 4 is a schematic structural diagram of Embodiment 4 of the present invention.

(6) In the figures: 1. Blue light chip, 2. Solid-state fluorescence piece, 3. Electrode, 4. Heat conducting substrate; and

(7) 5. Red light film, 6. Light reflecting film, and 7. Groove

DETAILED DESCRIPTION

(8) Specific implementation manners of the present invention are further described with reference to the accompanying drawings and embodiments. The following embodiments are merely intended to describe the technical solutions of the present invention more clearly, and the protection scope of the present invention is not limited thereto.

Embodiment 1

(9) (1) growing Ce:YAG crystals by using a Kyropoulos method;

(10) (2) cutting and polishing the Ce:YAG crystals obtained in step (1), to obtain fluorescence crystal pieces 2 having size being 10*10 millimeters and thickness being 0.5 millimeter;

(11) (3) etching grooves 7 matching the size of blue light chips 1 on the fluorescence crystal piece 2; and

(12) (4) placing the blue light chips 1 into the grooves 7 of the fluorescence crystal piece, sequentially connecting blue light chips in series, and finally installing electrodes 3.

(13) An embedded white light LED package structure based on a solid-state fluorescence material that is obtained is shown in FIG. 1.

Embodiment 2

(14) (1) growing Ce:YAG crystals by using a Czochralski method;

(15) (2) cutting and polishing the Ce:YAG crystals obtained in step (1), to obtain fluorescence crystal pieces 2 having size being 6*6 millimeters and thickness being 0.6 millimeter;

(16) (3) etching grooves 7 matching the size of blue light chips 1 on the fluorescence crystal piece 2;

(17) (4) placing the blue light chips 1 into the grooves 7 of the fluorescence crystal piece 2, sequentially connecting blue light chips in series, and installing electrodes 3; and

(18) (5) finally fastening the embedded surface of the blue light chip of an entire device obtained in step (4) to a heat conducting substrate 4, to form an entire white light LED package structure.

(19) The embedded white light LED package structure based on a solid-state fluorescence material that is obtained is shown in FIG. 2.

Embodiment 3

(20) (1) growing Ce:YAG crystals by using a temperature gradient method;

(21) (2) cutting and polishing the Ce:YAG crystals obtained in step (1), to obtain fluorescence crystal pieces 2 having size being 5*5 millimeters and thickness being 0.6 millimeter;

(22) (3) etching grooves 7 matching the size of the blue light chips 1 on the fluorescence crystal piece 2;

(23) (4) placing the blue light chips 1 into the grooves 7 of the fluorescence crystal piece 2, sequentially connecting blue light chips in series, and installing electrodes 3;

(24) (5) finally fastening an embedded surface of the blue light chip of the fluorescence crystal piece to a heat conducting substrate 4, to form an entire white light LED package structure; and

(25) (6) adding a red light film 5 to a light extraction surface of the fluorescence crystal piece 2, to adjust light emission performance of a device.

(26) An embedded white light LED package structure based on a solid-state fluorescence material that is obtained is shown in FIG. 3.

Embodiment 4

(27) (1) growing Ce:YAG crystals by using a Czochralski method;

(28) (2) cutting and polishing the Ce:YAG crystals obtained in step (1), to obtain fluorescence crystal pieces 2 having size being 5*5 millimeters and thickness being 0.6 millimeter;

(29) (3) etching grooves 7 matching the size of the blue light chips 1 on the fluorescence crystal piece 2;

(30) (4) placing the blue light chips 1 into the grooves 7 of the fluorescence crystal piece 2, sequentially connecting blue light chips in series, and installing an electrode 3;

(31) (5) adding a light reflecting film 6 to an embedded surface of the blue light chip of the fluorescence crystal piece, to adjust an overall lighting effect of a device; and

(32) (6) finally fastening a surface of the light reflecting film of the device to a heat conducting substrate 4, to form an entire white light LED package structure.

(33) An embedded white light LED package structure based on a solid-state fluorescence material that is obtained is shown in FIG. 4.

(34) The foregoing description shows merely preferred embodiments of the present invention, and are not intended to limit the present invention. Any modification, equivalent replacement, improvement, and the like made within the spirit and principle of the present invention shall fall within the protection scope of the present invention.