An improved transistor with channel epitaxial silicon. In one aspect, a method of fabrication includes: forming a gate stack structure on an epitaxial silicon region disposed on a substrate, a width dimension of the epitaxial silicon region approximating a width dimension of the gate stack structure; and growing a raised epitaxial source and drain from the substrate, the raised epitaxial source and drain in contact with the epitaxial silicon region and the gate stack structure. For a SRAM device, further: removing an epitaxial layer in contact with the silicon substrate and the raised source and drain and to which the epitaxial silicon region is coupled leaving a space above the silicon substrate and under the raised epitaxial source and drain; and filling the space with an insulating layer and isolating the raised epitaxial source and drain and a channel of the transistor from the silicon substrate.

A method for manufacturing a semiconductor device having a shallow trench isolation structure includes providing a semiconductor substrate having first and second regions, multiple fins disposed on the first and second regions, and a hardmask layer on an upper surface of the fins, forming a first dielectric layer on the semiconductor substrate covering the fins, forming a first mask layer including an opening exposing a portion of the first dielectric layer between the first and second regions, implanting dopant ions into the exposed portion of the first dielectric layer, removing the first mask layer, and performing an etching process on the first dielectric layer to form a first isolation region between the first and second regions and a second isolation region between the fins. The doped portion has a reduced etch rate so that the thickness of the first isolation region is thicker than the second isolation region.

A method of fabricating a vertical field effect transistor including forming a first recess in a substrate; epitaxially growing a first drain from the first bottom surface of the first recess; epitaxially growing a second drain from the second bottom surface of a second recess formed in the substrate; growing a channel material epitaxially on the first drain and the second drain; forming troughs in the channel material to form one or more fin channels on the first drain and one or more fin channels on the second drain, wherein the troughs over the first drain extend to the surface of the first drain, and the troughs over the second drain extend to the surface of the second drain; forming a gate structure on each of the one or more fin channels; and growing sources on each of the fin channels associated with the first and second drains.

A method of fabricating a vertical field effect transistor including forming a first recess in a substrate; epitaxially growing a first drain from the first bottom surface of the first recess; epitaxially growing a second drain from the second bottom surface of a second recess formed in the substrate; growing a channel material epitaxially on the first drain and the second drain; forming troughs in the channel material to form one or more fin channels on the first drain and one or more fin channels on the second drain, wherein the troughs over the first drain extend to the surface of the first drain, and the troughs over the second drain extend to the surface of the second drain; forming a gate structure on each of the one or more fin channels; and growing sources on each of the fin channels associated with the first and second drains.

A method for fabricating semiconductor device includes the steps of: providing a substrate having a fin-shaped structure thereon and a shallow trench isolation (STI) around the fin-shaped structure, in which the fin-shaped structure has a top portion and a bottom portion; forming a first doped layer on the STI and the top portion; and performing a first anneal process.

A technique relates to manufacturing a finFET device. A plurality of first and second semiconductor fins are formed on a substrate. Gate stacks are formed on the substrate, each including a gate, a hard mask and an oxide layer. A dielectric spacer layer is deposited. A sacrificial fill material is deposited on the finFET device and planarized. A second hard mask is deposited, a trench area is patterned in the hard mask parallel to the first and second semiconductor fins, and the sacrificial fill material is anisotropically etched to create a trench. A dielectric wall is formed in the trench and the second hard mask and sacrificial fill material are removed.

A semiconductor device includes a first active region including at least one first recess; a second active region including at least one second recess; an isolation region including a diffusion barrier that laterally surrounds at least any one active region of the first active region and the second active region; a first recess gate filled in the first recess; and a second recess gate filled in the second recess, wherein the diffusion barrier contacts ends of at least any one of the first recess gate and the second recess gate.

A semiconductor device includes a substrate including a first region and a second region, a first fin-type pattern in the first region, a second fin-type pattern in the second region, a first gate structure intersecting the first fin-type pattern, the first gate structure including a first gate spacer, a second gate structure intersecting the second fin-type pattern, the second gate structure including a second gate spacer, a first epitaxial pattern formed on opposite sides of the first gate structure, on the first fin-type pattern, the first epitaxial pattern having a first impurity, a second epitaxial pattern formed on opposite sides of the second gate structure, on the second fin-type pattern, the second epitaxial pattern having a second impurity, a first silicon nitride film extending along a sidewall of the first gate spacer, and a first silicon oxide film extending along a sidewall of the first gate spacer.

A semiconductor device includes a substrate, a fin structure and an isolation layer formed on the substrate and adjacent to the fin structure. The semiconductor device includes a gate structure formed on at least a portion of the fin structure and the isolation layer. The semiconductor device includes an epitaxial layer including a strained material that provides stress to a channel region of the fin structure. The epitaxial layer has a first region and a second region, in which the first region has a first doping concentration of a first doping agent and the second region has a second doping concentration of a second doping agent. The first doping concentration is greater than the second doping concentration. The epitaxial layer is doped by ion implantation using phosphorous dimer.

A semiconductor device according to one embodiment of the present invention comprises: a semiconductor substrate having a main surface; a noise source element formed at the main surface of the semiconductor substrate; a protection target element formed at the main surface of the semiconductor substrate; an n type region disposed between the noise source element and the protection target element; and a p type region disposed between the noise source element and the protection target element and electrically connected to the n type region. The n type region and the p type region are adjacent to each other on the main surface of the semiconductor substrate in a direction intersecting a direction from the noise source element toward the protection target element.