A chip substrate includes at least one insulation portion interposed between conductive portions. A cavity formed in a recessed shape from a region of an upper surface of the chip substrate exposes a top surface of a part of the at least one insulation portion. An insulation layer is coated on the upper surface of the chip substrate excluding the region of the cavity. A bump may be formed at a predetermined height within the cavity.

First and second multi-LED packages are installed on a carrier. Each package includes its own emitting diodes that are series coupled to each other and that are encased within a single, internally reflective package having two external terminals. Each package has a light output face from which light, produced by all of the emitting diodes contained therein is emitted in response to a forward current passing through the two terminals. Each package also has phosphor mediums each positioned to be stimulated by primary light of a respective one of its contained emitting diodes, and in response emit secondary wavelength-converted light that emerges from the light output face and is combined with some of the primary light to yield white light. Other embodiments are also described and claimed.

A light diffuser includes: a thermoplastic resin base which has a thermal expansion coefficient of at least 410.sup.5/K and at most 810.sup.5/K; and a light diffusion layer which is disposed on a surface of the thermoplastic resin base and includes an acrylic resin film and an acrylic resin particle, the acrylic resin film including one or more acrylic resins having a glass transition temperature of at least 30 C. and at most 50 C., the acrylic resin particle being included in the acrylic resin film and having an average particle size of at least 1 m and at most 15 m.

The invention relates to a polarized-light-emitting SMD (surface-mounted device) LED (light-emitting diode) lamp bead and a method of batch manufacturing the same; the LED lamp bead comprises an SMD LED lamp bead bracket and N LED light-emitting die(dice) on its inner bottom surface, wherein a polarizing film is horizontally disposed above the LED light-emitting die, and first light-transmitting glue is filled between the inner bottom surface of the bracket and the lower surface of the polarizing film.

The invention relates to a polarized-light-emitting SMD (surface-mounted device) LED (light-emitting diode) lamp bead and a method of batch manufacturing the same; the LED lamp bead comprises an SMD LED lamp bead bracket and N LED light-emitting die(dice) on its inner bottom surface, wherein a polarizing film is horizontally disposed above the LED light-emitting die, and first light-transmitting glue is filled between the inner bottom surface of the bracket and the lower surface of the polarizing film.

A display device includes a substrate; a plurality of pixels provided on the substrate; and a plurality of inorganic light emitting elements provided on each of the pixels. The inorganic light emitting elements each include a semiconductor substrate having a first face facing the substrate and a second face provided in a convex shape on a side opposite from the first face; and a plurality of semiconductor nanowires provided on the first face, the semiconductor nanowires extending in a direction perpendicular to the first face.

A display device includes a substrate; a plurality of pixels provided on the substrate; and a plurality of inorganic light emitting elements provided on each of the pixels. The inorganic light emitting elements each include a semiconductor substrate having a first face facing the substrate and a second face provided in a convex shape on a side opposite from the first face; and a plurality of semiconductor nanowires provided on the first face, the semiconductor nanowires extending in a direction perpendicular to the first face.

A light emitting module including a circuit board, a plurality of unit pixels arranged on the circuit board, a molding member covering the unit pixels, and an anti-glare layer disposed on the molding member, in which the molding member includes a first molding layer at least partially covering each of the unit pixels, and a second molding layer covering the first molding layer.

A light emitting module including a circuit board, a plurality of unit pixels arranged on the circuit board, a molding member covering the unit pixels, and an anti-glare layer disposed on the molding member, in which the molding member includes a first molding layer at least partially covering each of the unit pixels, and a second molding layer covering the first molding layer.

A pixel module includes a circuit board, a plurality of unit pixels arranged on the circuit board, and a molding member covering the plurality of unit pixels. The molding member includes a light diffusion layer and a black molding layer covering the light diffusion layer.