A pixel module includes a circuit board, a plurality of unit pixels arranged on the circuit board, and a molding member covering the plurality of unit pixels. The molding member includes a light diffusion layer and a black molding layer covering the light diffusion layer.

A display device including: a substrate having a display area and a non-display area extending around the display area, the display area having emission areas and a light blocking area; a thin film transistor layer on the substrate and including thin film transistors; a light emitting element layer on the thin film transistor layer and including light emitting elements; a wavelength conversion layer on the light emitting element layer to convert a peak wavelength of light provided from at least some of the light emitting elements; and a color filter layer on the wavelength conversion layer. The color filter layer includes: color filters in each of the emission areas; a first light blocking part in the light blocking area; and a second light blocking part in the non-display area.

A display device including: a substrate having a display area and a non-display area extending around the display area, the display area having emission areas and a light blocking area; a thin film transistor layer on the substrate and including thin film transistors; a light emitting element layer on the thin film transistor layer and including light emitting elements; a wavelength conversion layer on the light emitting element layer to convert a peak wavelength of light provided from at least some of the light emitting elements; and a color filter layer on the wavelength conversion layer. The color filter layer includes: color filters in each of the emission areas; a first light blocking part in the light blocking area; and a second light blocking part in the non-display area.

A light source device includes: a mounting board; a plurality of light-emitting parts disposed on the mounting board, each of the plurality of light-emitting parts being configured to be individually turned on; a light-shielding member defining an opening; and a light-guide member supported by the light-shielding member, the light-guide member comprising a Fresnel lens portion, wherein, in a top view, the Fresnel lens portion is located within an area of the opening of the light-shielding member. In the top view, irradiation areas of the respective light-emitting parts are at least partially separated from each other.

A light source device includes: a mounting board; a plurality of light-emitting parts disposed on the mounting board, each of the plurality of light-emitting parts being configured to be individually turned on; a light-shielding member defining an opening; and a light-guide member supported by the light-shielding member, the light-guide member comprising a Fresnel lens portion, wherein, in a top view, the Fresnel lens portion is located within an area of the opening of the light-shielding member. In the top view, irradiation areas of the respective light-emitting parts are at least partially separated from each other.

Provided are a light emitting element and a display device comprising same. The light emitting element comprises: a first conductivity type semiconductor doped with a dopant having a first polarity, a second conductivity type semiconductor doped with a dopant having a second polarity opposite to the first polarity; an active layer between the first conductivity type semiconductor and the second conductivity type semiconductor; and an insulation film which surrounds at least a side surface of the active layer, wherein the insulation film includes an insulation coating film and at least one light conversion particle on at least a portion of the insulation coating film.

Provided are a light emitting element and a display device comprising same. The light emitting element comprises: a first conductivity type semiconductor doped with a dopant having a first polarity, a second conductivity type semiconductor doped with a dopant having a second polarity opposite to the first polarity; an active layer between the first conductivity type semiconductor and the second conductivity type semiconductor; and an insulation film which surrounds at least a side surface of the active layer, wherein the insulation film includes an insulation coating film and at least one light conversion particle on at least a portion of the insulation coating film.

Solid-state transducers (SSTs) and vertical high voltage SSTs having buried contacts are disclosed herein. An SST die in accordance with a particular embodiment can include a transducer structure having a first semiconductor material at a first side of the transducer structure, and a second semiconductor material at a second side of the transducer structure. The SST can further include a plurality of first contacts at the first side and electrically coupled to the first semiconductor material, and a plurality of second contacts extending from the first side to the second semiconductor material and electrically coupled to the second semiconductor material. An interconnect can be formed between at least one first contact and one second contact. The interconnects can be covered with a plurality of package materials.

A light emitting device package can include a sub-mount having a first surface, a second surface, a bottom surface and a cavity; a first layer on the first surface; a second layer on the second surface; a third layer on the bottom surface; a light emitting device on the first layer and including a supporting layer including an anti-diffusion layer, a first electrode on the supporting layer, a semiconductor light emitting structure electrically connected to the first electrode, and a second electrode electrically connected to the semiconductor light emitting structure, in which the first and second electrodes electrically connect to the first layer and the second layer, respectively, and the semiconductor light emitting structure includes a light extraction structure; an ESD property improving diode on the second surface, electrically connected to the second layer and arranged a distance apart from the light emitting device, and a lens on the sub-mount.

A light emitting device includes a substrate; a first frame located on the substrate; a second frame located on the substrate, the second frame being located inward of and spaced apart from the first frame; at least one first light emitting element located on the substrate in a first region located between the first frame and the second frame; at least one second light emitting element located on the substrate in a second region located inward of the second frame; and a sealing member covering the at least one first light emitting element and the at least one second light emitting element. The second frame includes a light-transmissive portion. A highest portion of the second frame is higher than a highest portion of the first frame.