A light-emitting module is provided. The light-emitting module includes a circuit substrate and a first light-emitting element disposed on the circuit substrate. The light-emitting module also includes an optical pattern disposed on the circuit substrate and adjacent to the first light-emitting element. The light-emitting module further includes a lens covering the first light-emitting element and the optical pattern.

A light emitting device includes: a base substrate; a plurality of unit regions provided on the base substrate; a barrier disposed at a boundary of the unit regions to surround each of the unit regions; a dam disposed in each of the unit regions to be spaced apart from the barrier; a first electrode provided in each of unit light emitting regions surrounded by the dam; a second electrode disposed in each of the unit light emitting regions, the second electrode of which at least one region is provided opposite to the first electrode; and one or more LEDs provided in each of the unit light emitting regions, the one or more LEDs being electrically connected between the first electrode and the second electrode.

A light emitting diode package includes a body part having a cavity at the upper part thereof and having a long shape in one direction; and a first lead frame and a second lead frame which are coupled to the bottom of the body part and spaced apart from each other in a transverse direction. The first lead frame includes a first mounting part exposed in the cavity; a first terminal part exposed to one side surface of the body part; and a first connection part exposed to the lower surface of the body part. The second lead frame includes a second mounting part exposed in the cavity; a second terminal part exposed to the other side surface of the body part along a one-side direction; and a second connection part exposed to the lower surface of the body part.

A light emitting diode package includes a body part having a cavity at the upper part thereof and having a long shape in one direction; and a first lead frame and a second lead frame which are coupled to the bottom of the body part and spaced apart from each other in a transverse direction. The first lead frame includes a first mounting part exposed in the cavity; a first terminal part exposed to one side surface of the body part; and a first connection part exposed to the lower surface of the body part. The second lead frame includes a second mounting part exposed in the cavity; a second terminal part exposed to the other side surface of the body part along a one-side direction; and a second connection part exposed to the lower surface of the body part.

A light-emitting display device includes at least a transparent substrate, a first patterned conductive layer and a second patterned conductive layer respectively disposed on top of the opposite first and second surfaces of the transparent substrate, and a plurality of inorganic electroluminescent objects disposed in form of an array on top of the first surface of the transparent substrate with the inorganic electroluminescent objects being spaced from one another in a distance of at least 2 mm. Each of the inorganic electroluminescent objects has one power pin and light signal pins for red light, green light, and blue light. The transparent substrate has a plurality of through holes between the first surface and the second surface. The first patterned conductive layer has a plurality of soldering pad regions respectively in connection with the power pin and the light signal pins. At least one of the soldering regions is in electrical connection with the second patterned conductive layer by means of one of the through holes.

Disclosed are a light-emitting device structure and a preparation method therefor. The light-emitting device structure includes a buffer layer, where a material of the buffer layer is a transparent material; and a light-emitting structure disposed on a side of the buffer layer, where the light-emitting structure includes at least one light-emitting unit; where the buffer layer includes at least one microlens structure, the microlens structure includes at least two sub-layers, and each the light-emitting unit corresponds to at least one microlens structure. In the present disclosure, the buffer layer of the transparent material is utilized to manufacture the the microlens structure. On the one hand, a problem of total reflection is alleviated and light extraction efficiency of the light-emitting device is improved. On the other hand, no additional microlens structures is required, thereby reducing production cost.

A method of manufacturing an optical member includes: providing a polycrystalline wavelength conversion member including phosphor particles and having a first surface and a second surface opposite to the first surface; forming a modified portion inside the wavelength conversion member by focusing laser light inside the wavelength conversion member; and cleaving the wavelength conversion member with the modified portion being a starting point, which includes pressing the wavelength conversion member from a first surface side.

The present disclosure is applicable to the technical field of display devices and relates to, for example, a display device which uses a composite optical film and a light-emitting diode (LED). To achieve the aforementioned objective, the present disclosure comprises: a display panel; and a composite optical film which is positioned on the display panel, wherein the composite optical film includes an adhesive layer which is attached to the display panel and includes a light scattering agent. The refractive index of the light scattering agent may be greater than that of the adhesive layer.

A circuit board for a light emitting module, comprises a plurality of mounting positions for LEDs, wherein the mounting positions are distributed in a regular two-dimensional pattern on a first surface side of the circuit board. The circuit board is characterized by (i) a plurality of transparent domains, each transparent domain extending around one mounting position of the plurality of mounting positions, and (ii) a plurality of thermally conductive domains, each thermally conductive domain being electrically and thermally connected to at least one mounting position. An average area of the electrically conductive domains is at least 2% of an average area of the transparent domains. Each thermally conductive domain of the plurality of thermally conductive domains comprises at least a portion, which extends as a two-dimensional area on a surface of the circuit board.

Provided are a display apparatus, a display panel and a display baseplate. The display baseplate includes: a substrate (2); a light-blocking layer (11) on the substrate (2), and including light-transmitting holes (10); a first light-adjusting layer (7) at a side of the light-blocking layer (11); and first light-focusing bodies (8) at a surface of the first light-adjusting layer (7) away from the light-blocking layer (11), where a refractive index of the first light-adjusting layer (7) is different from a refractive index of each of the first light-focusing bodies (8). In this way, use effect can be improved.