Substrate based light emitter devices, components, and related methods are disclosed. In some aspects, light emitter components can include a substrate and a plurality of light emitter devices provided over the substrate. Each device can include a surface mount device (SMD) adapted to mount over an external substrate or heat sink. In some aspects, each device of the plurality of devices can include at least one LED chip electrically connected to one or more traces and at least one pair of bottom contacts adapted to mount over a surface of external substrate. The component can further include a continuous layer of encapsulant disposed over each device of the plurality of devices. Multiple devices can be singulated from the component.

A light emitting device including a light emitting element including an element substrate and semiconductor layers formed thereon, an encapsulating member that covers the sides of the light emitting element and forms a cavity at the upper surface of the light emitting element, and a wavelength-conversion layer in the cavity. The wavelength-conversion layer being capable of converting that converts the wavelength of light emitted by the light emitting element. The wavelength-conversion layer includes a first wavelength-conversion sub layer which is disposed at the upper surface of the light emitting element, and a second wavelength-conversion sub layer which is disposed on the first wavelength-conversion sub layer. The first wavelength-conversion sub layer includes first phosphors having a first resistance to environmental exposure, and the second wavelength-conversion sub layer includes second phosphors having a second resistance which is higher than that of the first wavelength-conversion sub layer.

A light-emitting apparatus includes: a substrate; a plurality of LED chips disposed on the substrate and including a plurality of blue LED chips which emit blue light and a plurality of red LED chips which emit red light; and a sealing member that contains a yellow phosphor and seals the plurality of LED chips together. The plurality of LED chips include: a first LED chip group made up of the blue LED chips; a second LED chip group made up of the red LED chips and disposed around the first LED chip group in an annular shape centered on an optical axis; and a third LED chip group made up of the blue LED chips and disposed around the second LED chip group in an annular shape centered on the optical axis.

A light emitting diode (LED) package includes a light element, a light transferring layer disposed on the light element, a packaging layer enclosing the light transferring layer, a white wall surrounding the packaging layer and a diffusion film disposed on the packaging layer. The light transferring layer has a light outlet face, a light inlet face opposite to the light outlet face and a peripheral side. The light inlet face faces the light element. The white wall surrounds the peripheral side that is enclosed by the packaging layer.

A light emitting device including a transparent board elongated in a first direction and having a first surface and an opposite second surface. Light emitting elements are arranged in the first direction on the first surface side of the board. A transparent bulb houses the board and the elements. A base is connected to the bulb, and leads electrically connect the elements to the base. The leads have a first end portion connected to the base, and an opposite second end portion. Conductive members are respectively connected to the second end portions of the leads, and the conductive members are arranged at both side of the elements on the board in the first direction. A first wavelength converting member is provided on the first surface and seals the elements. The first wavelength converting member is elongated in the first direction. The second surface of the board faces the base.

The present invention relates to a light emitting device comprising a transparent substrate which light can pass through and at least one LED chip emitting light omni-directionally. Wherein the LED chip is disposed on one surface of the substrate and the light emitting angle of the LED chip is wider than 180 , and the light emitted by the LED chip will penetrate into the substrate and at least partially emerge from another surface of the substrate. According to the present invention, the light emitting device using LED chips can provide sufficient lighting intensity and uniform lighting performance.

A method according to embodiments of the invention includes disposing a support layer on a surface of a wavelength converting ceramic wafer. The wavelength converting ceramic wafer and the support layer are diced to form wavelength converting members. A wavelength converting member is attached to a light emitting device. After attaching the wavelength converting member to the light emitting device, the support layer is removed.

Provided is a light-emitting module that achieves high brightness, whose electrode structure is simple and whose brightness distribution has rotational symmetry. The light-emitting module includes a substrate, a first electrode and a second electrode disposed on the substrate, LED devices connected between the first electrode and the second electrode, a dam member disposed on the substrate so as to surround the LED devices, and a phosphor-containing resin for sealing the LED devices by being filled into a region surrounded by the dam member on the substrate. The first electrode includes a first outer electrode disposed under the dam member and a first inner electrode disposed nearer to a center of the substrate than the first outer electrode is. The second electrode includes a second outer electrode disposed under the dam member and a second inner electrode disposed nearer to the center of the substrate than the second outer electrode is. The first outer electrode is disposed so as to oppose the second inner electrode. The second outer electrode is disposed so as to oppose the first inner electrode.

A QD glass cell includes a glass cell and QD fluorescent powder material. The glass cell includes a receiving chamber, and the QD fluorescent powder being encapsulated within the receiving chamber. A manufacturing method of the QD glass cell includes: S101: manufacturing a glass cell comprising a receiving chamber, and the glass cell comprising an injection port transmitting fluid into the receiving chamber; S102: manufacturing fluid QD fluorescent powder material; S103: filling the fluid QD fluorescent powder material into the receiving chamber via the injection port; S104: applying a curing process to the fluid QD fluorescent powder material within the receiving chamber; and S105: sealing the injection port by hot melting to obtain the QD glass cell. In addition, the above QD glass cell may be applied to LED light source.

First and second multi-LED packages are installed on a carrier. Each package includes its own emitting diodes that are series coupled to each other and that are encased within a single, internally reflective package having two external terminals. Each package has a light output face from which light, produced by all of the emitting diodes contained therein is emitted in response to a forward current passing through the two terminals. Each package also has phosphor mediums each positioned to be stimulated by primary light of a respective one of its contained emitting diodes, and in response emit secondary wavelength-converted light that emerges from the light output face and is combined with some of the primary light to yield white light. Other embodiments are also described and claimed.