A method of manufacturing a light emitting device includes: mounting light emitting elements on a collective substrate; arranging a first protruding member surrounding the light emitting elements; arranging a second protruding member between the light emitting elements; forming a cover member covering an upper end of the second protruding member, a lateral surface of each of the light emitting elements in a region surrounded by the first protruding member; and singulating the light emitting devices by cutting the cover member, the second protruding member, and the collective substrate at a portion including the second protruding member. The second protruding member is harder than the cover member. An upper end of the second protruding member is located lower than that of the first protruding member but higher than the upper surface of each of the light emitting elements.

A light emitting device includes one or more light emitting elements, a light transmissive member, and a light reflective member. The one or more light emitting elements each includes an upper surface. The light transmissive member has an upper surface and a lower surface. The light reflective member covers surfaces of the light transmissive member and lateral surfaces of the one or more light emitting elements so as to expose the upper surface of the light transmissive member. The upper surface area of the light transmissive member is smaller than a sum of the upper surface areas of the one or more light emitting elements, and the lower surface area of the light transmissive member is larger than a sum of the upper surface areas of the one or more light emitting elements.

A method for manufacturing a display device is provided. The method includes providing an array module having at least one first alignment mark. The method also includes providing a light-emitting module having at least one second alignment mark. The method further includes aligning the light-emitting module and the array module by the at least one first alignment mark and the at least one second alignment mark. In addition, the method includes bonding the light-emitting module onto the array module.

A display device including the semiconductor light emitting device according to an embodiment including a planarization layer disposed on the semiconductor light emitting device, a first opaque filler disposed to be spaced apart on the planarization layer, and a light reflective filling layer disposed around the semiconductor light emitting device, wherein the light reflective filling layer is positioned lower than the top surface of the semiconductor light emitting device.

A light emitting diode (LED) package includes a substrate, a metal stage, at least one LED chip and a packaging material. The substrate has an super surface, and a lower surface opposite to the upper surface. The metal stage is formed on the upper surface of the substrate, and has a lumpy structure. The LED chip is mounted on the metal stage. The packaging material covers the LED chip, the metal stage and the substrate. The packaging material and the lumpy structure of the metal stage are engaged with each other.

A light emitting diode (LED) package includes a substrate, a metal stage, at least one LED chip and a packaging material. The substrate has an super surface, and a lower surface opposite to the upper surface. The metal stage is formed on the upper surface of the substrate, and has a lumpy structure. The LED chip is mounted on the metal stage. The packaging material covers the LED chip, the metal stage and the substrate. The packaging material and the lumpy structure of the metal stage are engaged with each other.

A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.

The present disclosure provides a display device and a method for manufacturing a display device. The method for manufacturing a display device of the present disclosure includes: forming a light emitting layer, a first metal layer and a protective layer on a substrate, wherein the first metal layer is located between the light emitting layer and the protective layer; forming a release layer covering over the light emitting layer, the first metal layer and the protective layer; removing a first portion of the release layer to expose the light emitting layer and the first portion of the first metal layer; and forming a first encapsulation layer covering the light emitting layer, a first portion of the first metal layer and a second portion of the release layer. A thickness of the first encapsulation layer on the light emitting layer is substantially equal to a thickness of the first encapsulation layer on the first portion of the first metal layer.

A display apparatus includes a substrate including island portions spaced apart from each other, a bridge portions connecting the island portions to each other, openings disposed between island portions, at least one light-emitting element arranged in each of the island portions, first encapsulation layers disposed on the island portions, respectively, each of the first encapsulation layers sealing the at least one light-emitting element, a second encapsulation layer disposed on the first encapsulation layers to cover the first encapsulation layer, sealing the plurality of island portions and the bridge portions, and filling at least an upper portion of the openings, a lower encapsulation layer disposed under the substrate, and a lower adhesive layer arranged between the lower encapsulation layer and the substrate, wherein the lower adhesive layer fills at least a portion of a lower portion of the openings.

A light-emitting device includes a substrate including a top surface, a first side surface and a second side surface, wherein the first side surface and the second side surface of the substrate are respectively connected to two opposite sides of the top surface of the substrate; a semiconductor stack formed on the top surface of the substrate, the semiconductor stack including a first semiconductor layer, a second semiconductor layer, and an active layer formed between the first semiconductor layer and the second semiconductor layer; a first electrode pad formed adjacent to a first edge of the light-emitting device; and a second electrode pad formed adjacent to a second edge of the light-emitting device, wherein in a top view of the light-emitting device, the first edge and the second edge are formed on different sides or opposite sides of the light-emitting device, the first semiconductor layer adjacent to the first edge includes a first sidewall directly connected to the first side surface of the substrate, and the first semiconductor layer adjacent to the second edge includes a second sidewall separated from the second side surface of the substrate by a distance.