A light-emitting device including a light-emitting diode and a surface-modified luminophore. The surface-modified luminophore includes a luminophore including a manganese activator and a fluorine compound fixed to the luminophore.

An LED module includes a carrier plate having an arrangement face and a wall on the upper side of the plate, the wall running peripherally around the arrangement face and being raised upwards with respect to said arrangement face; an LED arranged on the face; a contact element, to which the LED is connected; and an at least partially transparent potted body covering the arrangement face and the LED towards the top and laterally adjoins an inner face of the wall. The wall is formed monolithically with the remaining carrier plate and is interrupted over its periphery, and the potted body does not adjoin the inner wall face of the wall. The contact element extends away from the arrangement face along the upper side of the carrier plate in the interruption region so that electrical contact can be made with the LED via the contact element from outside the body.

A light emitting device includes: a heat dissipative board; a wiring board which adheres and is fixed to the heat dissipative board and in which a through-hole is formed; a light-emitting element which is mounted on a front surface of the heat dissipative board which is exposed through the through-hole of the wiring board; a bonding wire which connects the light-emitting element and the wiring board; and a light-reflecting member which covers a surface of an inner peripheral wall of the through-hole excluding disposition places of the light-emitting element and the bonding wire.

A package for mounting a light emitting element includes a recess; a pair of lead electrodes exposed at a bottom surface of the recess; a plating layer covering a surface of each of the pair of lead electrodes; and a resin molded body retaining the pair of lead electrodes, and forming an area between the pair of lead electrodes at the bottom surface of the recess and a lateral surface of the recess. At least one of the lead electrodes has a front surface protrusion that is linearly formed along the resin molded body at the bottom surface of the recess and along a periphery of the bottom surface of the recess, and a back surface protrusion that is formed at a position at a back surface opposite to a position of the front surface protrusion, and at least a tip of each of the front surface protrusion and the back surface protrusion is exposed outside the plating layer.

A lead frame for mounting LED elements includes a frame body region and a large number of package regions arranged in multiple rows and columns in the frame body region. The package regions each include a die pad on which an LED element is to be mounted and a lead section adjacent to the die pad, the package regions being further constructed to be interconnected via a dicing region. The die pad in one package region and the lead section in another package region upward or downward adjacent to the package region of interest are connected to each other by an inclined reinforcement piece positioned in the dicing region.

A light emitting diode (LED) lighting device includes at least one LED assembly comprising a substrate and two or more LEDs configured to generate light spaced apart along the substrate. A cured structural coating is disposed on at least a portion of the LED assembly, wherein the cured structural coating is configured to maintain the LED assembly in a predetermined shape. The substrate of the LED assembly may comprise an elongated and/or flexible substrate.

A light source device having; a blue light emitting element that emits blue light having an emission peak in a wavelength region of 440 nm to 460 nm; a green phosphor that absorbs part of the blue light emitted by the blue light emitting element and thereby emits green light having an emission peak in a wavelength region of 500 nm to 575 nm; a red phosphor that absorbs at least one of part of the blue light emitted by the blue light emitting element and part of the green light emitted by the green phosphor, and thereby emits red light having an emission peak in a wavelength region of 600 nm to 690 nm; and an absorbent containing neodymium fluoride that absorbs part of the green light and part of the red light.

An optical semiconductor element mounting package that has good adhesion between the resin molding and the lead electrodes and has excellent reliability is provided, as well as an optical semiconductor device using the package is also provided. The optical semiconductor element mounting package having a recessed part that serves as an optical semiconductor element mounting region, wherein the package is formed by integrating: a resin molding composed of a thermosetting light-reflecting resin composition, which forms at least the side faces of the recessed part; and at least a pair of positive and negative lead electrodes disposed opposite each other so as to form part of the bottom face of the recessed part, and there is no gap at a joint face between the resin molding and the lead electrodes.

A liquid crystal display according to an exemplary embodiment of the present invention includes a substrate, a plurality of pixels arranged in a matrix on the substrate where each pixel includes a switching element, a plurality of gate lines that are connected to the switching elements and extend in a row direction, and a gate driver that is connected to the gate lines and is formed on the substrate as an integrated circuit. In the liquid crystal display, the gate driver includes a first region and a second region that is not aligned with the first region.

Provided are a light emitting device package in which lens tilting is prevented to reduce luminance and color deviations and a backlight unit having the same. The light emitting device package includes an encapsulation material disposed on a substrate to surround a light emitting device and a guide member disposed on the encapsulation material to guide an assembly path of a lens. The guide member includes a first inclined surface having a first inclination to guide a light incident part of the lens and a second inclined surface having a second inclination greater than the first inclination to further guide the light incident part of the lens.