A semiconductor light-emitting device (101) includes an LED chip (4), a lead (1) having a main surface (11) on which the LED chip (4) is mounted, and a resin package (5) covering the LED chip (4). The main surface (11) is roughened, and the main surface (11) is held in contact with the resin package (5). These configurations contribute to the downsizing of the semiconductor light-emitting device (101).

Provided is a light emitting device that reduces color unevenness between a plurality of light emitting elements. A light emitting device 1 includes a base substrate 10, a first frame body 11 disposed at an upper surface 10a of the base substrate 10, and a second frame body 12 disposed at the upper surface 10a of the base substrate 10 and surrounding the first frame body 11 while being spaced away from the first frame body 11. A plurality of light emitting elements 2 is disposed within a region surrounded by the first frame body 11. A first sealing resin 21 is disposed within the region surrounded by the first frame body 11 to cover the light emitting elements 2. The first sealing resin 21 includes a wavelength conversion member that converts a wavelength of light emitted from the light emitting elements 2. A second sealing resin 22 is disposed within the region surrounded by the second frame body 12 to cover the first sealing resin 21. The second sealing resin 22 has a light diffusion material layer 221 having a convex upper surface over the first sealing resin 21.

An ink jet process is used to deposit a material layer to a desired thickness. Layout data is converted to per-cell grayscale values, each representing ink volume to be locally delivered. The grayscale values are used to generate a halftone pattern to deliver variable ink volume (and thickness) to the substrate. The halftoning provides for a relatively continuous layer (e.g., without unintended gaps or holes) while providing for variable volume and, thus, contributes to variable ink/material buildup to achieve desired thickness. The ink is jetted as liquid or aerosol that suspends material used to form the material layer, for example, an organic material used to form an encapsulation layer for a flat panel device. The deposited layer is then cured or otherwise finished to complete the process.

The present disclosure provides an encapsulation structure, a method for encapsulating an OLED device, and a flexible display device. The encapsulation structure includes: a flexible substrate; an OLED device arranged on the flexible substrate; a thin film encapsulation layer covering the OLED device and including a plurality of first inorganic films and a plurality of organic polymer films arranged alternately; and a second inorganic film having a nanowire structure and covering the thin film encapsulation layer.

Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities. Optical systems of the present invention include devices and device arrays exhibiting a range of useful physical and mechanical properties including flexibility, shapeability, conformability and stretchablity.

A method of manufacturing a light-emitting apparatus includes arranging a plurality of semiconductor light-emitting elements in a straight line on a substrate and applying a sealing material, including an optical wavelength converter, in a straight line on the substrate to collectively seal the semiconductor light-emitting elements with the sealing material. The sealing material is applied so that a contour of a longitudinal end of the sealing material has a curvature, in a plan view of the substrate.

An LED support assembly and an LED module are provided. The LED support assembly includes: a metal heat sink, a first ceramic substrate and a second ceramic substrate, the metal heat sink defines an upper surface; the first ceramic substrate is adapted to support a LED chip and disposed on the upper surface of the metal heat sink; the second ceramic substrate is adapted to support electrodes of the LED chip and surrounds the first ceramic substrate.

An optoelectronic device including a semiconductor substrate having a face, light-emitting diodes arranged on the face and including wired conical or frustoconical semiconductor elements, and an at least partially transparent dielectric layer covering the light-emitting diodes, the refractive index of the dielectric layer being between 1.6 et 1.8.

A low cost, high efficiency light-emitting diode design is disclosed. In some embodiments, a p-n junction of a light-emitting diode is formed in an epitaxial layer grown on a substrate. Grinding the backside of an associated wafer after encapsulation not only opens a light path for the light emitting diode but removes most residual defects.

A display and method of manufacture are described. The display may include a substrate including an array of pixels with each pixel including multiple subpixels, and each subpixel within a pixel is designed for a different color emission spectrum. An array of micro LED device pairs are mounted within each subpixel to provide redundancy. An array of wavelength conversion layers comprising phosphor particles are formed over the array of micro LED device pairs for tunable color emission spectrum.