An LED die conformally coated with phosphor is mounted at the base of a shallow, square reflector cup. The cup has flat reflective walls that slope upward from its base to its rim at a shallow angle of approximately 33 degrees. A clear encapsulant completely fills the cup to form a smooth flat top surface. Any emissions from the LED die or phosphor at a low angle are totally internally reflected at the flat air-encapsulant interface toward the cup walls. This combined LED/phosphor light is then reflected upward by the walls and out of the package. Since a large percentage of the light emitted by the LED and phosphor is mixed by the TIR and the walls prior to exiting the package, the color and brightness of the reflected light is fairly uniform across the beam. The encapsulant is intentionally designed to enhance TIR to help mix the light.

A semiconductor light emitting device includes an LED chip, which includes an n-type semiconductor layer, active layer, and p-type semiconductor layer stacked on a substrate. The LED chip further includes an anode electrode connected to the p-type semiconductor, and a cathode connected to the n-type semiconductor. The anode and cathode electrodes face a case with the LED chip mounted thereon. The case includes a base member including front and rear surfaces, and wirings including a front surface layer having anode and cathode pads formed at the front surface, a rear surface layer having anode and cathode mounting electrodes formed at the rear surface, an anode through wiring connecting the anode pad and the anode mounting electrode and passing through a portion of the base member, and a cathode through wirings connecting the cathode pad and the cathode mounting electrode and passing through a portion of the base member.

A method for manufacturing a light emitting device comprises a package preparation step of preparing a package having a recess in which a light emitting element is locatable, wherein the package includes a projection extending from an upper surface of the package, the projection at least partially surrounding the recess, a sealing resin forming step of filling said recess in which said light emitting element is located with a sealing resin, and providing said sealing resin higher than the height of said package, and a sealing resin cutting step of cutting the sealing resin such that an upper surface of the sealing resin is at a height that is substantially the same as a height of the upper surface of the package.

A solution for packaging a two terminal device, such as a light emitting diode, is provided. In one embodiment, a method of packaging a two terminal device includes: patterning a metal sheet to include a plurality of openings; bonding at least one two terminal device to the metal sheet, wherein a first opening corresponds to a distance between a first contact and a second contact of the at least one two terminal device; and cutting the metal sheet around each of the least one two terminal device, wherein the metal sheet forms a first electrode to the first contact and a second electrode to the second contact.

A light-emitting device includes a substrate; a light-emitting element mounted on the substrate; a first light-transmissive member bonded to an upper surface of the light-emitting element via an adhesive; and a second light-transmissive member placed on an upper surface of the first light-transmissive member. In a plan view of the light-emitting device, a peripheral edge of a lower surface of the first light-transmissive member is positioned more inward than a peripheral edge of the upper surface of the light-emitting element. The adhesive extends from the upper surface of the light-emitting element to a lower surface of the second light-transmissive member, the adhesive covers a side surface of the first light-transmissive member, and the adhesive is separated from the substrate.

A display device includes a lower substrate comprising at least one light-emitting diode (LED) light source, an upper substrate comprising at least one quantum dot color filter, and a bonding layer configured to bond the lower substrate and the upper substrate. The upper substrate may include a partition wall structure including least one sub-rod is repeatedly provided in an edge area of a partition wall layer.

A purpose of the present invention is to provide an optical unit that is capable of effectively sealing one or a plurality of optical devices even without a special material, a special structure, etc. In an optical unit of the present invention, the sealing section (50) includes: a circular seal section (51) surrounding one or a plurality of optical devices (40) on a wiring substrate from an in-plane direction of the wiring substrate; and an inside filling section (52) with which inside of the seal section (51) is filled and that seals the one or plurality of optical devices (40). The optical devices (40) are each a light emitting unit, a light receiving device, an image sensor, an X-ray sensor, or a power generating device. The seal section (51) and the inside filling section (52) are each configured of a cured thermosetting resin. The inside filling section (52) has light transmittance that is higher than light transmittance of the seal section (51). The inside filling section (52) has a modulus of elasticity that is smaller than a modulus of elasticity of the seal section (51).

A lighting device includes a body section; a substrate provided in the body section; a wiring pattern provided on a surface of the substrate and including wiring pads; and light emitting elements provided on the wiring pattern and including electrodes in the vicinity of a circumferential edge of a surface opposite to a side on which the wiring pattern is provided. The lighting device also includes wirings that respectively connect the wiring pads and a plurality of electrodes; a surrounding wall member provided to surround the light emitting elements and having an annular shape; and a sealing section provided to cover the inside of the surrounding wall member. At least a part of the light emitting elements is connected in series. The electrodes are respectively positioned on or inside a circumference passing through centers of the light emitting elements which are connected in series.

An optoelectronic semiconductor component is disclosed. In an embodiment, the semiconductor component includes at least one optoelectronic semiconductor chip for generating primary radiation in a near-ultraviolet or in a visible spectral range, at least one phosphor for partial or complete conversion of the primary radiation into a longer-waved secondary radiation which is in the visible spectral range and at least one filter substance for partial absorption of the secondary radiation, wherein the phosphor and the filter substance are closely connected to the semiconductor chip.

A light emitting device package including a base including a top flat surface; an insulating layer on the base; a light emitting diode on the base; an optical member comprising a light transmissive material such that light emitted from the light emitting diode passes therethrough; a guiding member to guide the optical member, the guiding member having a ring shape; an electrical circuit layer electrically connected to the light emitting diode, the electrical circuit layer including an electrode portion and an extended portion, the electrode portion disposed inside the guiding member and electrically connected to the light emitting diode, the extended portion extended from the electrode portion to outside the guiding member; and an electrode layer on the electrode portion of the electrical circuit layer and electrically connected to the light emitting diode.