Patent classifications
H10D86/021
LIQUID KNIFE CLEANING DEVICE
A liquid knife cleaning device is provided, and it includes a splash shield; a liquid knife, which is located under the splash shield; an oblique baffle, which is located between the splash shield and the liquid knife, and a lower side of which is fixedly bonded to the top of a blade of the liquid knife. The oblique baffle can act to isolate the liquid knife and the substrate on the delivery roll from a majority of water vapor, and droplets dripping on the oblique baffle can flow down along a slope of the oblique baffle, and will not drip on the substrate that has not been rinsed by the liquid knife. Effects of droplets on the uniformity of the substrate can be greatly reduced by the present technique, thereby enhancing the product quality.
MANUFACTURING METHOD OF DISPLAY WITH LIGHTING DEVICES
A manufacturing method of display with lighting devices is disclosed, including providing a tank containing a liquid; disposing a carrying plate with several recessed regions in the tank, and the carrying plate being immersed in the liquid; dropping several lighting devices into the liquid, wherein each of the lighting devices includes two conductive pads, and one of the two conductive pads includes a magnetic material; applying a magnetic field for the lighting devices and the lighting devices will dispose within the recessed regions of the carrying plate; removing the carrying plate with the lighting devices out of the tank, and assembling the lighting devices to an array substrate.
Display driver semiconductor device and method for manufacturing the same
A first high voltage semiconductor element, disposed in a substrate, includes first trenches; a first source region and a first drain region; first drift regions having respective ones partially surround the first source region and the first drain region; a first gate insulating layer and a first gate electrode disposed between the first drift regions; and a first high voltage well surrounding the first drift regions. A second high voltage semiconductor element, disposed in the substrate, includes second trenches; a second source region and a second drain region; second drift regions having respective ones partially surround the second source region and the second drain region; a second gate insulating layer and a second gate electrode disposed between the second drift regions; and a second high voltage well surrounding the second drift regions. Depths of the second trenches are disposed to be greater than depths of the first trenches.
Method of fabricating array substrate, array substrate and display device
An OLED display device including a display area is provided. A first and second thin film transistors (TFTs) are arranged in the display area, the first TFT includes a first active layer, the second TFT includes a second active layer, a material of the first active layer is different from that of the second active layer. The OLED display device includes a substrate, the second active layer, a second gate of the second TFT, the first active layer, a first gate of the first TFT, a first source and drain of the first TFT, a second source and drain of the second TFT, a first data line in a same layer as the second source and drain, a first planarization layer on the first data line, and a second data line on the first planarization layer and electrically insulated from the first data line.
Display device and manufacturing method thereof
The purpose of the invention is to form a stable oxide semiconductor TFT in a display device. The concrete structure is: A display device having a TFT substrate that includes a TFT having an oxide semiconductor layer comprising: the oxide semiconductor layer is formed on a first insulating film that is formed by a silicon oxide layer, the oxide semiconductor layer and an aluminum oxide film are directly formed on the first insulating film. The first insulating film becomes oxygen rich when the aluminum oxide film is formed on the first insulating film by sputtering. Oxygens in the first insulating film is effectively confined in the first insulating film, eventually, the oxygens diffuse to the oxide semiconductor for a stable operation of the oxide semiconductor TFT.
Displaying base plate and manufacturing method thereof, and displaying device
A displaying base plate and a manufacturing method thereof, and a displaying device. The displaying base plate includes a substrate, and a first electrode layer disposed on one side of the substrate, wherein the first electrode layer includes a first electrode pattern; a first planarization layer disposed on one side of the first electrode layer that is away from the substrate, wherein the first planarization layer is provided with a through hole, and the through hole penetrates the first planarization layer, to expose the first electrode pattern; and a second electrode layer, a second planarization layer and a third electrode layer that are disposed in stack on one side of the first planarization layer that is away from the substrate, wherein the second electrode layer is disposed closer to the substrate, the second electrode layer is connected to the first electrode pattern and the third electrode layer.
Thin film transistor array panel and manufacturing method thereof
A thin film transistor array panel according to an exemplary embodiment of the invention includes: an insulating substrate; a gate line disposed on the insulating substrate and including a gate pad portion; a data line insulated from and crossing the gate line, and including a source electrode and a data pad portion; a drain electrode facing the source electrode; an organic insulating layer disposed on the data line and the drain electrode, and including a first contact hole; a common electrode disposed on the organic insulating layer, and including a second contact hole; a passivation layer disposed on the common electrode, and including a third contact hole; and a pixel electrode disposed on the passivation layer, and being in contact with the drain electrode, in which the third contact hole is disposed to be adjacent to one surface of the first contact hole for improvement of an aperture ratio and a stable electrode connection.
Display device and method of fabricating the same
A display device includes a display area, a test pad, a plurality of first test transistors, and at least one outline. The display area includes pixels coupled to data lines and scan lines. The test pad receives a test signal. The first test transistors are coupled between the data lines of the display area and the test pad. The at least one outline is coupled between one of the first test transistors and the test pad. The at least one outline is located in a non-display area outside the display area.
Display device using micro-LED, and manufacturing method therefor
A method for manufacturing a display device can include forming an assembly electrode on a substrate; applying an insulating layer on the assembly electrode; disposing a partition wall on the insulating layer; defining an assembly groove in the partition wall; providing an light emitting diode (LED) having an assembly face corresponding to a shape of the assembly groove in the partition wall; and assembling the assembly face of the LED into the assembly groove in the partition wall, in which the LED includes a first electrode, a first semiconductor layer, an active layer, a second semiconductor layer, and a second electrode stacked in a first direction to form a stacked structure.
Display panel, manufacturing method thereof, and display device
A display panel, a manufacturing method thereof and a display device. The display panel includes a first region and a second region. The second region includes a driving circuitry layer and a first light-emitting unit located on a base substrate, the first region includes a plurality of second light-emitting units located on the base substrate, the second light-emitting unit is electrically coupled to the driving circuitry layer through a transparent conductive layer, the transparent conductive layer includes at least two conductive sub-layers laminated one on another and insulated from each other, each conductive sub-layer includes at least one transparent conductive line, and each transparent conductive line is coupled to a corresponding second light-emitting unit.