An array substrate and a method of manufacturing the same, a display panel and a display device are disclosed. The array substrate includes: a base substrate, and a first conductive layer, a first insulation layer, a semiconductor layer, a second conductive layer, a second insulation layer, and a third conductive layer that are sequentially formed on the base substrate. The first conductive layer includes a gate electrode pattern, the semiconductor layer includes an active area pattern, and the second conductive layer includes a source-drain electrode pattern; the second insulation layer is provided with a connection via hole between the third conductive layer and the second conductive layer; and the semiconductor layer further includes a spacing pad pattern in a region where the connection via hole is provided.

Embodiments of the disclosure generally provide methods of forming a capacitor with high capacitance and low leakage as well as a good interface control for thin film transistor (TFT) applications. In one embodiment, a thin film transistor structure includes a capacitor formed in a thin film transistor device. The capacitor further includes a common electrode disposed on a substrate, a dielectric layer formed on the common electrode and a pixel electrode formed on the dielectric layer. An interface protection layer formed between the common electrode and the dielectric layer, or between the dielectric layer and the pixel electrode. A gate insulating layer fabricated by a high-k material may also be utilized in the thin film transistor structure.

A COA substrate manufacturing method including: forming a TFT on a base substrate; forming a second insulation layer on the TFT; forming a color resist layer on the second insulation layer; forming a third insulation layer on the color resist layer; forming a through hole which reveals the drain electrode of the TFT; forming an ITO film layer on the third insulation layer; forming a photoresist layer on the ITO film layer; performing a light-shielding process to the photoresist layer on the vias-region ITO film layer and an exposure process to the photoresist layer on the non vias-region ITO film layer; developing the photoresist layer on the vias-region ITO and the non vias-region ITO film layers to obtain a photoresist layer plug covered on the vias-region ITO film layer. The present invention utilizes the photoresist to fill the through hole which can improve the quality of a display device.

A flexible display includes a flexible base substrate, a thin film transistors layer formed on the flexible base substrate, and a light emitting elements layer formed on the thin film transistors layer, where the flexible base substrate includes a first support layer formed below the thin film transistors layer, a second support layer disposed below the first support layer, and a heat-energy blocking/reflecting layer provided between the first support layer and the second support layer. The heat-energy blocking/reflecting layer is configured to block or reflect a sufficient portion of radiated heat-energy that is generated when the flexible base substrate is separated from a supporting carrier substrate so as to prevent the damage from the radiated heat-energy to the light emitting elements layer.

Disclosed is a semiconductor device having a first transistor and a second transistor over the first transistor. The first transistor includes a first semiconductor, and the second transistor includes an oxide semiconductor that is different from the first semiconductor. A gate of the first transistor is electrically connected to a source or drain electrode of the second transistor. The second transistor has a semiconductor layer including the oxide semiconductor over the source and drain electrodes and a gate electrode over the semiconductor layer with an insulating layer therebetween.

Embodiments of the present disclosure relate to the field of display technologies, and particularly, to an array substrate and methods of manufacturing and driving the same. With the embodiments of the present disclosure, undesirable phenomenon, e.g. color mixing and so on is avoid in a display device having the array substrate while simplifying the manufacture process of the array substrate. The array substrate comprises a substrate, thin-film transistors, pixel electrodes and a common electrode on the substrate, a plurality of leading wires and a color filter layer; wherein the common electrode comprises a plurality of common electrode blocks reusable as self-capacitance electrodes, and each of the leading wires has one end electrically connected to one of the common electrode blocks and the other end electrically connected to a touch integrated circuit. The array substrate according to the embodiments of the present disclosure is used in the display device.

Disclosed is a thin-film transistor substrate including: a substrate; a thin-film transistor formed on the substrate and including an active layer, a gate electrode, a source electrode, and a drain electrode; an identification (ID) mark formed on the substrate; and a metal layer contacting an upper surface of the ID mark.

A fabrication method of a display panel and a display panel, and a display device are provided. The display panel is divided into a display region and a non-display region and comprises a first substrate, and the non-display region of the first substrate includes an IC attaching region. The fabrication method comprises a thinning process. The thinning process includes: 1) forming a barrier layer insoluble to a thinning fluid in a region of a first surface of the first substrate of the display panel corresponding to the IC attaching region; 2) thinning the display panel by adopting the thinning fluid such that a thickness of the IC attaching region of the first substrate is greater than a thickness of the display region of the first substrate; and 3) removing the barrier layer. The display panel with regions having different thicknesses is formed by partially thinning, so that the display panel adapts to the attaching of the driver IC, ensures the strength of the display panel and realize the thinning of the display panel; and meanwhile, the thickness of the display region of the display panel is ensured, and defects such as light leakage and COG Mura are avoided.

An object is to control composition and a defect of an oxide semiconductor, another object is to increase a field effect mobility of a thin film transistor and to obtain a sufficient on-off ratio with a reduced off current. A solution is to employ an oxide semiconductor whose composition is represented by InMO.sub.3(ZnO).sub.m, where M is one or a plurality of elements selected from Ga, Fe, Ni, Mn, Co, and Al, and m is preferably a non-integer number of greater than 0 and less than 1. The concentration of Zn is lower than the concentrations of In and M. The oxide semiconductor has an amorphous structure. Oxide and nitride layers can be provided to prevent pollution and degradation of the oxide semiconductor.

A method for manufacturing an array substrate includes: forming a first conductive pattern and a second conductive pattern on a base substrate; forming a via hole on the base substrate formed with the first conductive pattern and the second conductive pattern, and a lateral side of the via hole being half opened; and forming a jumper wire film on the base substrate formed with the via hole.