A semiconductor device includes a substrate, at least one semiconductor fin, and at least one epitaxy structure. The semiconductor fin is present on the substrate. The semiconductor fin has at least one recess thereon. The epitaxy structure is present in the recess of the semiconductor fin. The epitaxy structure includes a topmost portion, a first portion and a second portion arranged along a direction from the semiconductor fin to the substrate. The first portion has a germanium atomic percentage higher than a germanium atomic percentage of the topmost portion and a germanium atomic percentage of the second portion.

An electronic device includes a solid body of SiC having a surface and having a first conductivity type. A first implanted region and a second implanted region have a second conductivity type and extend into the solid body in a direction starting from the surface and delimit between them a surface portion of the solid body. A Schottky contact is on the surface and in direct contact with the surface portion. Ohmic contacts are on the surface and in direct contact with the first and second implanted regions. The solid body includes an epitaxial layer including the surface portion and a bulk portion. The surface portion houses a plurality of doped sub-regions which extend in succession one after another in the direction, are of the first conductivity type, and have a respective conductivity level higher than that of the bulk portion.

A semiconductor device includes substrate, a first gate structure, a second gate structure, and an epitaxy layer. The first gate structure and the second gate structure are over the substrate, in which the first gate structure and the second gate structure each comprises a shielding electrode, a gate electrode over the shielding electrode, and a first gate dielectric layer vertically separating the shielding electrode from the gate electrode. The epitaxy layer is over the substrate and cups an underside of the first gate structure and the second gate structure, in which the epitaxy layer comprises a doped region laterally between the first gate dielectric layer of the first gate structure and the first gate dielectric layer of the second gate structure, a dopant concentration of the doped region being non-uniform along a lateral direction.

A method of manufacturing a semiconductor device, including preparing a semiconductor substrate having a main surface, forming a device element structure on the main surface, forming a protective film on the main surface of the semiconductor substrate to protect the device element structure, the protective film having an opening therein, forming at least one material film in a predetermined pattern on the main surface of the semiconductor substrate and in the opening of the protective film, the at least one material film being separate from the protective film by a distance of less than 1 mm, forming a resist film on the main surface of the semiconductor substrate, covering the protective film and the at least one material film, the resist film having an opening therein corresponding to an inducing region for impurity defects, and inducing the impurity defects in the semiconductor substrate, using the resist film as a mask.

A silicon carbide (SiC) planar transistor device includes a SiC semiconductor substrate of a first charge type, a SiC epitaxial layer of the first charge type formed at a top surface of the SiC semiconductor substrate, a source structure of the first charge type formed at a top surface of the SiC epitaxial layer, a drain structure of the first charge type formed at a bottom surface of the SiC semiconductor substrate, a gate structure comprising a gate runner and a gate dielectric that covers at least part of the source structure and the gate runner, and a channel region of a second charge type located in vertical direction below the gate structure and adjacent to the source structure. The channel can be formed by performing a plurality of implantation steps so that the channel region comprises a first region and a second region.

There is provided a high withstand voltage LDMOS field-effect transistor that enables the compatibility of an increase of its withstand voltage and a decrease of its ON resistance. The high withstand voltage LDMOS is characterizing in including: a first electroconductive type body region formed on a main surface of a semiconductor substrate; a second electroconductive type source region formed on a surface of the body region; a second electroconductive type drift region formed so as to have contact with the body region; a second electroconductive type drain region formed on the drift region; a first electroconductive type buried region having contact with the body region and formed below the drift region; a gate electrode formed above the body region between the source region and the drift region and above the drift region nearer to the source region via a gate insulating film; a first field plate that extends from the gate electrode toward the drain region and that is formed above the drift region via a first insulating film; and a second field plate that has contact with the source region or the gate electrode and that is formed above the first field plate via a second insulating film, in which a distance between the buried region and the drain region is smaller than a distance between the first field plate and the drain region and larger than a distance between the second field plate and the drain region.

A semiconductor device is provided. The semiconductor device includes a semiconductor body and a transistor. The transistor includes a drain region in the semiconductor body, a first doped region in the drain region, a source region in the semiconductor body, a second doped region adjacent the source region, and a third doped region between the first doped region and the second doped region. The third doped region includes a first portion having a first concentration of dopants, a second portion adjacent the first portion and having a second concentration of dopants, a third portion adjacent the second portion and having a third concentration of dopants, and a fourth portion adjacent the third portion and having a fourth concentration of dopants. The first concentration is less than the second concentration. The second concentration is greater than the third concentration. The third concentration is less than the fourth concentration.

A method of manufacturing a vertical power semiconductor device includes forming a drift region in a semiconductor body having a first main surface and a second main surface opposite to the first main surface along a vertical direction, the drift region including platinum atoms, and forming a field stop region in the semiconductor body between the drift region and the second main surface, the field stop region including a plurality of impurity peaks, wherein a first impurity peak of the plurality of impurity peaks is set a larger concentration than a second impurity peak of the plurality of impurity peaks, wherein the first impurity peak includes hydrogen and the second impurity peak includes helium.

Approaches for altering the threshold voltage (e.g., to zero threshold voltage) in a fin-type field effect transistor (FinFET) device are provided. In embodiments of the invention, a first N+ region and a second N+ region are formed on a finned substrate that has a p-well construction. A region of the finned substrate located between the first N+ region and the second N+ region is doped with a negative implant species to form an n-well. The size and/or composition of this n-well region can be adjusted in view of the existing p-well construction of the substrate device to change the threshold voltage of the FinFET device (e.g., to yield a zero threshold voltage FinFET device).

A device includes a semiconductor substrate, a body region in the semiconductor substrate having a first conductivity type and in which a channel is formed during operation, source and drain regions in the semiconductor substrate and having a second conductivity type, the source region being disposed on the body region, and a composite drift region in the semiconductor substrate, having the second conductivity type, and through which charge carriers from the source region drift to reach the drain region after passing through the channel. The composite drift region includes a first section adjacent the channel, a second section adjacent the drain region, and a third section disposed between the first and second sections. The first and second sections have a lower effective dopant concentration level than the third section.