A device includes a buried oxide layer disposed on a substrate, a first region disposed on the buried oxide layer and a first ring region disposed in the first region. The first ring region includes a portion of a guardring. The device further includes a first terminal region disposed in the first ring region, a second ring region disposed in the first region and a second terminal region disposed in the second ring region. The first terminal region is connected to an anode and the second terminal region is connected to a cathode. The first region has a graded doping concentration. The first region, the second ring region and the second terminal region have a first conductivity type, and the first ring region and the first terminal region have a second conductivity type. The first conductivity type is different from the second conductivity type.

In accordance with an embodiment, a diode comprises a substrate, a dielectric material including an opening that exposes a portion of the substrate, the opening having an aspect ratio of at least 1, a bottom diode material including a lower region disposed at least partly in the opening and an upper region extending above the opening, the bottom diode material comprising a semiconductor material that is lattice mismatched to the substrate, a top diode material proximate the upper region of the bottom diode material, and an active diode region between the top and bottom diode materials, the active diode region including a surface extending away from the top surface of the substrate.

A manufacturing method of a semiconductor device includes: depositing a thin film semiconductor layer on a semiconductor substrate with an insulating film therebetween, the insulating film having been formed on a surface of the semiconductor substrate; ion-implanting first impurity ions into the thin film semiconductor layer under a condition where a range of the first impurity ions becomes smaller than a film thickness of the thin film semiconductor layer when being deposited; and selectively ion-implanting second impurity ions into the thin film semiconductor layer with a dose quantity more than a dose quantity of the first impurity ions, in which a diode for detecting temperature is formed by a region into which the first impurity ions have been implanted and a region into which the second impurity ions have been implanted in the thin film semiconductor layer.

Provided are a diode and a manufacturing method therefor. The diode includes: a nitride channel layer; a nitride barrier layer, formed on the nitride channel layer; an oxidation forming layer, wherein a part of the oxidation forming layer is positioned in the nitride barrier layer, and a surface of the oxidation forming layer away from the nitride channel layer is flush with a surface of the nitride barrier layer away from the nitride channel layer; a passivation layer, formed on the nitride barrier layer, wherein the passivation layer includes a first groove penetrating through the passivation layer to expose the oxidation forming layer and a part of the nitride barrier layer; and a first electrode, formed in the first groove, wherein the first electrode is in contact with the nitride barrier layer and the oxidation forming layer.

A diode structure includes a nanosheet structure on a substrate, including a first, first-type diffusion region, a second, first-type diffusion region on the substrate, a first, second-type diffusion region, and a second, second-type diffusion region, each on the substrate. The diode structure includes a first gate on the nanosheet structure between the first and second, first-type diffusion regions. The diode structure includes a first frontside zero (M0) metal layer coupled to a frontside of the first and second, first-type diffusion regions, and a first backside M0 metal layer coupled to a backside of the first and second, first-type diffusion regions to form an anode. The diode structure includes a second frontside M0 metal layer coupled to a frontside of the first and second, second-type diffusion regions, and a second backside M0 metal layer coupled to a backside of the first and second, second-type diffusion regions to form a cathode.

A method of manufacturing a semiconductor structure includes forming on a substrate, at intervals in a first direction, a first trench, a second trench, and a third trench, forming a first oxide layer in the first trench, forming a second oxide layer in the second trench, and forming a third oxide layer in the third trench. The method also includes forming a first semiconductor material layer in the first trench, forming a second semiconductor material layer in the second trench, and forming a third semiconductor material layer in the third trench. The method further includes forming a mask layer, performing a first etching process on the mask layer to form a first opening and a second opening, performing a second etching process at the second opening to form a third surface on the substrate, and forming a first doped region adjacent to the third surface exposed by the second opening.

Method of forming pn heterojunction between nickel oxide and gallium oxide disclosed. The method includes forming a trench by etching an n-type gallium oxide epitaxial layer epitaxially grown on an n-type gallium oxide substrate using an etch mask, forming a p-type nickel oxide region on the bottom of the trench by sputtering a nickel oxide target on the n-type gallium oxide epitaxial layer in a mixed gas atmosphere of argon and oxygen, and forming a nickel layer on the p-type nickel oxide region by sputtering a nickel target on the n-type gallium oxide epitaxial layer in an argon gas atmosphere.

A method for producing a silicon carbide component includes forming a silicon carbide layer on an initial wafer, wherein the silicon carbide layer comprises a doping region to be produced, forming an electrically conductive contact structure on the surface of the silicon carbide layer, the electrically conductive contact structure, producing a splitting region by pre-damaging the splitting region, wherein the splitting region is produced by laser treating the splitting region before forming the electrically conductive contact, splitting the silicon carbide layer or the initial wafer along the splitting region such that a silicon carbide substrate of the silicon carbide component to be produced is split off, wherein the silicon carbide substrate has a thickness of more than 30 m, wherein the doping region extends to a surface of the silicon carbide layer before splitting the silicon carbide layer, and wherein splitting along comprises applying a polymer film.

The vertical-conduction electronic power device is formed by a body of wide band gap semiconductor which has a first conductivity type and has a surface, and is formed by a drift region and by a plurality of surface portions delimited by the surface. The electronic device is further formed by a plurality of first implanted regions having a second conductivity type, which extend into the drift region from the surface, and by a plurality of metal portions, which are arranged on the surface. Each metal portion is in Schottky contact with a respective surface portion of the plurality of surface portions so as to form a plurality of Schottky diodes formed by first Schottky diodes and second Schottky diodes, wherein the first Schottky diodes have, at equilibrium, a Schottky barrier having a height different from that of the second Schottky diodes.

A p-type semiconductor region formed in a front surface side of the semiconductor substrate. An n-type field stop (FS) region including protons as a donor is formed in a rear surface side of the semiconductor substrate. A concentration distribution of the donor in the FS region includes a first, second, third and fourth peaks in order from a front surface to the rear surface. A maximum point of peak concentration of the second peak is lower than a maximum point of peak concentration of the first peak.