Patent classifications
B29L31/34
Film applicator, a sticking film and a film-sticking assembly
The present disclosure relates to the technical field of film sticking, more particularly to a film applicator, a sticking film and a film-sticking assembly. The film applicator includes a main body portion, a pulling opening and a fixing portion. When using, the electronic product is positioned at the mounting slot and the sticking film is positioned on the fixing portion, the pulling portion is positioned between the screen and the release film layer, with a gap existed therebetween. The free end of the pulling portion is pulled to separate the release film layer and the tempered film to make the side with static electricity to attract the dust on the screen. By configuring the film applicator with the electrostatic layer, steps of pasting and dust removal are almost simultaneously carried out, and the sticking film is limited to a small space to prevent impurities and improve pasting quality.
Method of manufacturing cover window and method of manufacturing display device
A method of manufacturing a display device, the method including ejecting a window raw material into a mold, precuring the ejected window raw material, molding a cover window by placing the precured window raw material onto a display panel and curing the precured window raw material, and separating the mold from the cover window.
Laminate molding system, method for controlling laminate molding system, and method for manufacturing laminate molded article
A laminate molding system in which three or more press devices are continuously provided and a laminate molded article is sequentially pressure-molded. The laminate molding system includes first, second and third press devices. The first press device includes a pressure reducable chamber and a pressurizing surface formed of an elastic body sheet or a pressurizing surface formed of an elastic body sheet, the laminate molded article being pressurized by a driving force of a servomotor. The second press device includes a pressurizing surface formed of a metal press plate, the laminate molded article being pressurized by a driving force of a servomotor. The third press device includes a pressurizing surface formed of a metal press plate, the laminate molded article being pressurized by a driving force of a servomotor.
Composition for forming underlayer film for imprinting, method for producing composition for forming underlayer film, kit, pattern producing method, and method for manufacturing semiconductor element
Provided are: a composition for forming an underlayer film for imprinting, which contains a high-molecular-weight compound having a polymerizable group, a chelating agent, and a solvent, and a method for producing the same; a kit including the composition for forming an underlayer film; a pattern producing method using the composition for forming an underlayer film; and a method for manufacturing a semiconductor element, which includes the pattern producing method as a step.
Molding device for curved display panel, molding method thereof, and curved display panel
The present disclosure provides a molding device for a curved display panel, the molding device includes a mapping structure with a plurality of thimble pins and a jacking mechanism, one end of each of the thimble pins is configured to be attached to a display panel, the jacking mechanism includes a plurality of bottom plate and a plurality of driving members, each of the bottom plates is configured to be attached to another end of corresponding thimble pins, any one of the bottom plates is independently driven by one of the driving members, the plurality of bottom plates can separately drive the plurality of thimble pins to drive corresponding areas of the display panel to rise by different displacements and achieve a better molding effect.
Materials and methods
A method of forming a shaped foamed polymer article (16) and articles obtained from said method.
Sealing element
A sealing element for a molding machine comprises a base body with an inner receptacle wherein the base body is provided with a venting duct to connect an inner receptacle of the sealing element with an outer surface thereof.
Three-dimensionally patternable thermal interface
A three-dimensional geometry of a thermal interface body may be customized to substantially fill an irregular gap along a thermal dissipation pathway in an electronic package. The thermal interface body is fabricated through an additive deposition process, wherein sequential patterns of thermal interface material are coherently connected to other deposited patterns of thermal interface material.
Curable silicone composition, cured product of same, and method for producing same
Provided is a curable silicone composition and uses thereof. The composition has hot-melt properties, strongly adheres to poorly adhesive substrates, and is particularly superior in flexibility and toughness at high temperatures from room temperature to approximately 150 C. in cured products such as overmolding, in addition to providing a cured product that does not easily warp or become damaged even when integrally molded with a lead frame or the like. The composition comprises: (A) organopolysiloxane resin microparticles where 20 mol % or more of all siloxane units is siloxane units represented by RSiO.sub.3/2 where R is a monovalent hydrocarbon group; (B) a silatrane derivative or a carbasilatrane derivative; (C) a curing agent; and (D) a functional inorganic filler. The content of component (D) is 50% or more by volume relative to the overall composition. The composition is solid at 25 C. and has hot-melt properties at a temperature of 200 C. or lower.
PREPARING A FLEXIBLE DISPLAY SUBSTRATE WITH A MIXTURE OF TETRA ACIDS OR TETRA ACID DERIVATIVES AND POLYAMIC ACIDS
A process for the preparation of an aromatic polyimide substrate for optical displays that can be carried out during the manufacture of a display, which includes the steps of coating a solution of an aromatic tetracarboxylic acid or an aromatic tetracarboxylic acid derivative and a low molecular weight polyamic acid on a solid support and subsequent heating. The polyamic acid is prepared from non-stoichiometric amounts of 3,3,4,4-biphenyltetracarboxylic dianhydride and p-phenylenediamine.