A mechanical system that assembles or deploys pre-stressed structures. The assembly or deployment process outputs and elastically deforms material to form flexural members having a sinusoidal shape and stored potential energy. The sinusoidal shaped members are oriented and deployed with support members as they take shape. Sinusoidal shaped members are formed from a series of contiguous flexures; each flexure's properties may be engineered using a simulation technique. Each flexure is formed from a region of a sinusoidal member's length that begins and ends at antinodes. During assembly or deployment support members are positioned at antinodes maintaining the flexures' shapes and the assembly's pre-stressed state. By controlling the forces applied to and position of each flexure formed during assembly, the distribution of potential energy within the assembly and its secondary shape can be engineered. Elastic potential energy may be harvested from the material forming the flexural members.

A wiring harness (1010), a motor vehicle component (1000), a mold (15) for manufacturing a wiring harness (1010), a mold system (10) and a method for manufacturing the wiring harness (1010), the wiring harness (1010) comprising at least one bunch (1020) of at least two cables (1025) and a sheath (1030), at least some sections of the bunch (1020) of cables being embedded in the sheath (1030).

A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.

Methods and apparatus for fabricating high-resolution thin-layer metal patterns and 3D Metal structures are provided. The methods and apparatus operate via photo-(stereo)lithography at room temperature. The printed metal patterns, for example silver patterns, exhibit high electrical conductivity, comparable to or better than the conductivity of the silver printed by current laser sintering or thermal annealing at high temperature.

An insert molding component includes a primary molding section having a concave portion formed in one surface thereof, the concave portion including stepped lower and upper concave portions, an insert component disposed on a bottom surface of the lower concave portion, a heat-insulating component disposed in the upper concave portion above an opening of the lower concave portion in which the insert component is disposed, and a secondary molding section disposed in contact with the one surface of the primary molding section.

The invention aims to provide an electronic device housing that can maintain the antenna performance without deteriorating the radio communication performance, ensures uniform characteristics as one molded electronic device housing in spite of consisting of a plurality of members, and show excellent features in terms of the degree of warpage and dimensional accuracy as well as small deformation in high temperature environments and high mass productivity. The electronic device housing consists mainly of a fiber reinforcing member (a) and a fiber reinforcing member (b), the fiber reinforcing member (a) containing a resin (a1) and a fiber (a2), the fiber reinforcing member (b) containing a resin (b1) and a fiber (b2), the fiber reinforcing member (a) and the fiber reinforcing member (b) being joined directly without the existence of another layer at the joining face between the fiber reinforcing member (a) and the fiber reinforcing member (b), and the fiber reinforcing member (a) and the fiber reinforcing member (b) fulfilling a specific relation in terms of linear expansion coefficient and/or bending elastic modulus.

Embodiments relate to a polyimide-based composite film, which comprises a base film comprising a polyimide-based resin; and a functional layer disposed on the base film, wherein when the side of the functional layer located opposite to the side in contact with the base film is referred to as a first side and when the side of the base film in contact with the functional layer is referred to as a second side, the leveling index represented by Equation 1 is less than 0.75.

A screen protector assembly includes a glass screen protector, a removable film, and an application film. The screen protector is configured to be adhered to a display of an electronic device. The removable film at least partially covers a first adhesive on a rear surface of the screen protector. The application film is removably adhered to the front surface of the screen protector. A first end of the adhered application film extends beyond a first edge of the screen protector and includes a post aperture for the post of an installation tool. A second end of the adhered application film extends beyond a second edge of the screen protector and includes alignment apertures for teeth of the installation tool. The screen protector is aligned with the display of the electronic device when the electronic device is centered in the installation tool and the application film is installed on the tool.

An injection mould and an injection moulding method are provided. The injection mould includes a base plate used to place a packaged chip to be injection moulded including a substrate and at least one of the chips fixed on the front substrate by a flip chip process. The substrate has a gas hole. Two or more gas ducts that extend in at least two intersected directions and connect with one another are formed in the base plate. Two ends of each one of gas ducts are open, and at least one of the gas ducts is buried into the base plate. Each one of gas ducts is provided with a gas outlet. When the packaged chip is placed on the base plate, the gas outlet connects with the gas hole of the substrate.

A method of fabricating a light emitting device comprises providing a mold having an unpolished surface with an arithmetic mean roughness R.sub.a in a range from 0.1 μm to 10 μm, depositing a thin polymer film over the surface of the mold, wherein the film has a thickness in a range from 1 μm to 100 μm, positioning a light emitting body onto the thin polymer film, wherein the light emitting body includes an anode, a cathode, and a light emitting layer positioned between the anode and the cathode, and separating the thin polymer film with the light emitting body from the mold. A light emitting device is also described.