A wafer level curved image sensor may include a substrate having a central region, a peripheral region, and an edge region, the peripheral region being formed between the central region and the edge region, supporting patterns formed over the substrate, first fixed patterns formed between the supporting patterns, and an image sensing chip formed over the supporting patterns. The supporting patterns and the first fixed patterns, in combination, form a planar lower surface and a concavely-curved upper surface. The image sensing chip has a curved lower surface and a curved upper surface.

An image sensor, and an apparatus and method of acquiring an image by using the image sensor are provided. The image sensor includes a color filter having an array of a plurality of types of color filter elements, where each of the color filter elements transmits visible light in a certain wavelength band and blocks visible light outside the certain wavelength band; a photoelectric conversion cell array that detects light that has been transmitted through the color filter; and a modulator, disposed on the photoelectric conversion cell array, which changes a rate of light transmitted to the photoelectric conversion cell array based on an applied voltage.

A monolithic sensor for detecting infrared and visible light according to an example includes a semiconductor substrate and a semiconductor layer coupled to the semiconductor substrate. The semiconductor layer includes a device surface opposite the semiconductor substrate. A visible light photodiode is formed at the device surface. An infrared photodiode is also formed at the device surface and in proximity to the visible light photodiode. A textured region is coupled to the infrared photodiode and positioned to interact with electromagnetic radiation.

The technology relates to an image pickup unit, an image pickup device, a picture processing method, a diaphragm control method, and program that are capable of suppressing deterioration in quality of a stereoscopic picture. A parallax detection pixel 230 receives object light by a plurality of photodetectors covered with one microlens, to generate a signal used for detecting parallax. G pixels 227 and 228, an R pixel 226, and a B pixel 229 each receive the object light to generate a signal used for generating a planar picture. A parallax detection section 320 detects parallax based on the signal generated by the parallax detection pixels 230. A 2D picture generation section 310 generates a planar picture based on a signal generated by picture generation pixels. A 3D picture generation section 330 adjusts a position of each object image included in the planar picture, based on the detected parallax, to generate a stereoscopic picture.

The present invention relates to a camera module in which a thin camera module can be realized at a low cost and an electronic device. The camera module includes a lens unit that stores a lens that condenses light on a light receiving surface of an image sensor; a rigid substrate on which the image sensor is disposed; and a flexible substrate electrically connected with the rigid substrate, wherein in the case where the light receiving surface of the image sensor locates at the top, the lens unit, the flexible substrate, and the rigid substrate are disposed in this order from the top.

Provided are an image sensor and an imaging apparatus. The image sensor of a multi-layered sensor structure, the image sensor includes a plurality of sensing pixels, each of the plurality of sensing pixels including a micro lens configured to collect light, a first photoelectric converter configured to convert light of a first wavelength band into an electric signal, and a second photoelectric converter formed on a substrate configured to convert incident light into the electric signal, wherein a central axis of the second photoelectric converter is spaced apart from an optical axis of the micro lens.

A solid-state imaging apparatus includes: a solid-state imaging device photoelectrically converting light taken by a lens; and a light shielding member shielding part of light incident on the solid-state imaging device from the lens, wherein an angle made between an edge surface of the light shielding member and an optical axis direction of the lens is larger than an incident angle of light to be incident on an edge portion of the light shielding member.

A color separation element array includes color separation elements which are two-dimensionally arranged to separate an incident light according to a wavelength such that a light of a first wavelength is directed to a first direction and a light of a second wavelength that is different from the first wavelength is directed to a second direction that is different from the first direction. Each of the color separation elements includes a first element and a second element that are sequentially arranged along a traveling direction of the incident light, and the first element and the second element of the color separation elements are symmetrically shifted with respect to a center area of the color separation element array, to be aligned to fit to the traveling direction of the incident light that is obliquely incident.

A camera module and an array camera module based on an integral packing process are disclosed. The camera module or each of the camera module units of the array camera module includes a circuit board, an integral base, a photosensitive element operatively connected to the circuit board, a lens, a light filter holder installed at the integral base and a light filter installed at the light filter holder. The light filter is not required to be directly installed to the integral base, so that the light filter is protected and the requiring area of the light filter is reduced.

A camera module and an array camera module based on an integral packing process are disclosed. The camera module or each of the camera module units of the array camera module includes a circuit board, an integral base, a photosensitive element operatively connected to the circuit board, a lens, a light filter holder installed at the integral base and a light filter installed at the light filter holder. The light filter is not required to be directly installed to the integral base, so that the light filter is protected and the requiring area of the light filter is reduced.