Patent classifications
H10D30/6891
Semi-floating-gate device and its manufacturing method
The disclosure, belonging to the technological field of semiconductor memory, specifically relates to a semi-floating-gate device which comprises at least a semiconductor substrate, a source region, a drain region, a floating gate, a control gate, a perpendicular channel region and a gated p-n junction diode used to connect the floating gate and the substrate. The semi-floating-gate device disclosed in the disclosure using the floating gate to store information and realizing charging or discharging of the floating gate through a gated p-n junction diode boasts small unit area, high chip density, low operating voltage in data storage and strong ability in data retain.
Non-volatile inverter
A non-volatile inverter may be configured to perform a memory function. The non-volatile inverter may include first and second transistors. The first transistor may include a first gate electrode, a first electrode, and a second electrode. The second transistor may include a second gate electrode and a third electrode and may share the second electrode with the first transistor. The first transistor may include a first switching layer and a charge trap layer. The first switching layer may be configured to switch between a high resistance state and a low resistance state. The charge trap layer may be configured to trap or de-trap charges according to the resistance state of the first switching layer. The first switching layer may include a P-N diode. The second transistor may include a second gate switching layer and a charge trap layer.
Systems and Methods for Presenting and Interacting with a Picture-in-Picture Representation of Video Content on an Electronic Device with a Touch-Sensitive Display
Systems and methods for multitasking using touch-sensitive devices are disclosed herein. In one aspect, a method includes: playing video content in a full-screen mode on a touch-sensitive display of an electronic device. While playing the video content in the full-screen mode, the method further includes: receiving a request to display a home screen on the touch-sensitive display. In response receiving the request, the method also includes: (i) displaying the home screen; (ii) resizing the video content to fit within a reduced area of the touch-sensitive display; and (iii) displaying the resized video content overlaying the home screen.
Systems and Methods for Activating a Multi-Tasking Mode Using an Application Selector that is Displayed in Response to a Swipe Gesture on an Electronic Device with a Touch-Sensitive Display
Systems and methods for multitasking using touch-sensitive displays are disclosed. An example method includes: displaying a first application on a touch-sensitive display (TSD) of an electronic device; detecting, via the TSD, a swipe gesture that moves over part of the first application; in response to detecting the swipe gesture, displaying an application selector with a set of affordances, and the application selector is (i) displayed in a predefined portion of the TSD and (ii) overlays at least a portion of the displayed first application; detecting an input at an affordance of the set of affordances; in response to detecting the input: (i) ceasing to display the application selector; (ii) displaying a second application corresponding to the selected affordance in the predefined portion that was previously used to display the application selector; and (iii) resizing the first application to occupy a remaining portion of the TSD adjacent to the predefined portion.
Semiconductor device and method for manufacturing the same
According to one embodiment, the first separation film separates the control electrode, the first insulating layer, the charge storage layer, the intermediate insulating layer, the floating electrode layer, and the second insulating layer in a first direction. The second separation film separates a first stacked unit in a second direction. The first stacked unit includes the charge storage layer, the intermediate insulating layer, the floating electrode layer, the second insulating layer, and the semiconductor layer. The second direction intersects the first direction. The second separation film contains silicon.
Ambipolar synaptic devices
Device architectures based on trapping and de-trapping holes or electrons and/or recombination of both types of carriers are obtained by carrier trapping either in near-interface deep ambipolar states or in quantum wells/dots, either serving as ambipolar traps in semiconductor layers or in gate dielectric/barrier layers. In either case, the potential barrier for trapping is small and retention is provided by carrier confinement in the deep trap states and/or quantum wells/dots. The device architectures are usable as three terminal or two terminal devices.
Method of manufacturing semiconductor device and semiconductor device
A semiconductor device having good characteristics without variation and a method of manufacturing the same are provided. A part of a conductive layer for a floating gate is removed by using a spacer insulating film, a first insulating film, and a second insulating film as a mask. A floating gate having a tip portion is formed from the conductive layer for the floating gate, and a part of an insulating layer for a gate insulating film is exposed from the floating gate. The tip portion of the floating gate is further exposed by selectively removing the second insulating film among the second insulating film, the insulating layer for the gate insulating film, and the spacer insulating film.
Semiconductor device
A semiconductor device and a method for forming the same. The semiconductor device includes a tunnel insulating layer, a charge storage layer including a dopant, and a diffusion barrier layer including at least one of carbon, nitrogen, or oxygen interposed between the tunnel insulating layer and the charge storage layer.
SEMICONDUCTOR DEVICE, MEMORY DEVICE, AND DRIVING METHOD THEREOF
Provided is a highly integrated semiconductor device which can hold data and includes a NAND cell array. Each of the plurality of memory cells of the NAND cell array includes a first transistor, a second transistor, a first terminal, a second terminal, a third terminal, and a fourth terminal. The first terminal is electrically connected to one electrode connected to a channel region of the first transistor. The second terminal is electrically connected to the other electrode connected to the channel region of the first transistor. The third terminal is electrically connected to a gate electrode of the second transistor. The fourth terminal is electrically connected to one electrode connected to a channel region of the second transistor. A gate electrode of the first transistor is in contact with the other electrode connected to the channel region of the second transistor. A string of the plurality of memory cells is formed by connecting the first terminals and the second terminals.
DEVICES AND METHODS INCLUDING AN ETCH STOP PROTECTION MATERIAL
Protective dielectrics are discussed generally herein. In one or more embodiments, a three-dimensional vertical memory may include a protective dielectric material. A device may include an etch stop material, a first control gate (CG) over the etch stop material, a first CG recess adjacent the first CG, a trench adjacent the first CG recess, and an at least partially oxidized polysilicon on at least a portion of the etch stop material. The at least partially oxidized polysilicon may line a sidewall of the trench and may line the first CG recess.