Various embodiments provide a memory cell that includes a vertical selection gate, a floating gate extending above the substrate, wherein the floating gate also extends above a portion of the vertical selection gate, over a non-zero overlap distance, the memory cell comprising a doped region implanted at the intersection of a vertical channel region extending opposite the selection gate and a horizontal channel region extending opposite the floating gate.

A thin-film transistor array panel includes a substrate, a first gate electrode disposed on the substrate, a first self-assembled monolayer disposed on the first gate electrode, a gate insulating layer disposed on the first self-assembled monolayer, a semiconductor disposed on the gate insulating layer, a drain electrode overlapping the semiconductor, the drain electrode being separated from and facing a source electrode with respect to the semiconductor, a first interlayer insulating layer disposed on the source electrode and the drain electrode, a second self-assembled monolayer disposed on the first interlayer insulating layer, a second gate electrode disposed on the second self-assembled monolayer, a second interlayer insulating layer disposed on the second gate electrode, and a pixel electrode disposed on the second interlayer insulating layer and connected to the drain electrode.

A system for object reconstruction includes an illuminating unit, comprising a coherent light source and a generator of a non-periodic pattern. A diffractive optical element (DOE) is disposed in an optical path of illuminating light propagating from the illuminating unit toward an object, thereby projecting the non-periodic pattern onto an object. An imaging unit detects a light response of an illuminated region and generating image data indicative of the object within the projected pattern. A processor reconstructs a three-dimensional (3D) map of the object responsively to a shift of the pattern in the image data relative to a reference image of the pattern.

A semiconductor device includes a semiconductor body and a source metallization arranged on a first surface of the body. The body includes: a first semiconductor layer including a compensation-structure; a second semiconductor layer adjoining the first layer, comprised of semiconductor material of a first conductivity type and having a doping charge per horizontal area lower than a breakdown charge per area of the semiconductor material; a third semiconductor layer of the first conductivity type adjoining the second layer and comprising at least one of a self-charging charge trap, a floating field plate and a semiconductor region of a second conductivity type forming a pn-junction with the third layer; and a fourth semiconductor layer of the first conductivity type adjoining the third layer and having a maximum doping concentration higher than that of the third layer. The first semiconductor layer is arranged between the first surface and the second semiconductor layer.

A flash memory disposed on a substrate is provided. The flash memory includes a semiconductor transistor including stacked gate structures, lightly doped regions and spacers. The stacked gate structures include a gate dielectric layer, a first conductive layer, a dielectric layer and a second conductive layer sequentially disposed on the substrate. The dielectric layer has an opening there around such that the first conductive layer electrically connects with the second conductive layer. The lightly doped regions are disposed in the substrate under the opening at sides of the stacked gate structures. The spacers are disposed on sidewalls of the stacked gate structures. A width of spacers is adjusted by controlling a height of the first conductive layer under the opening. The lightly doped regions are disposed by using the dielectric layer as a mask layer, so as to gain margins of the lightly doped regions for good electrical properties.

An object is to provide a semiconductor device with large memory capacity. The semiconductor device includes first to seventh insulators, a first conductor, and a first semiconductor. The first conductor is positioned on a first top surface of the first insulator and a first bottom surface of the second insulator. The third insulator is positioned in a region including a side surface and a second top surface of the first insulator, a side surface of the first conductor, and a second bottom surface and a side surface of the second insulator. The fourth insulator, the fifth insulator, and the first semiconductor are sequentially stacked on the third insulator. The sixth insulator is in contact with the fifth insulator in a region overlapping the first conductor. The seventh insulator is positioned in a region including the first semiconductor and the sixth insulator.

Some embodiments include apparatuses and methods of forming the apparatuses. One of the apparatuses includes a memory cell included in a memory cell string; the memory cell including charge storage structure and channel structure separated from the charge storage structure by a dielectric structure; a first control gate associated with the memory cell and located on a first side of the charge storage structure and a first side of the channel structure; and a second control gate associated with the memory cell and electrically separated from the first control gate, the second control gate located on a second side of the charge storage structure and a second side of the channel structure.

A height of an upper surface of a control gate electrode is lower than a highest position of a lower surface of a silicide layer on a memory gate electrode adjacent to the control gate electrode via an ONO film. As a result, a structure in contact with the ONO film between the control gate electrode and the memory gate electrode is only the control gate electrode and the memory gate electrode made of polysilicon.

A height of an upper surface of a control gate electrode is lower than a highest position of a lower surface of a silicide layer on a memory gate electrode adjacent to the control gate electrode via an ONO film. As a result, a structure in contact with the ONO film between the control gate electrode and the memory gate electrode is only the control gate electrode and the memory gate electrode made of polysilicon.

A display device according to the present disclosure includes: a thin film transistor with a bottom gate structure and a thin film transistor with a top gate structure on a same substrate. A gate electrode of the thin film transistor with the top gate structure is provided in a same layer as a wire layer. A method of manufacturing a display device according to the present disclosure, the display device including a thin film transistor with a bottom gate structure and a thin film transistor with a top gate structure on a same substrate, includes: forming a gate electrode of the thin film transistor with the top gate structure in a same layer as a wire layer.