A photoresist composition comprises a photosensitive resin including a blend of a photoresist polymer and a dye resin, a photo-acid generator, and a solvent, in which an amount of the dye resin is in a range from about 20 weight percent to about 80 weight percent based on a total weight of the photosensitive resin.

A semiconductor memory cell includes a floating body region configured to be charged to a level indicative of a state of the memory cell; a first region in electrical contact with said floating body region; a second region in electrical contact with said floating body region and spaced apart from said first region; and a gate positioned between said first and second regions. The cell may be a multi-level cell. Arrays of memory cells are disclosed for making a memory device. Methods of operating memory cells are also provided.

A semiconductor nonvolatile memory element is used to form a constant current source in a semiconductor integrated circuit device. The semiconductor nonvolatile memory element includes a control gate electrode, a floating gate electrode, source/drain terminals, a thin first gate insulating film, and a second gate insulating film that is thick enough not to be broken down even when a voltage higher than an operating voltage of the semiconductor integrated circuit device is applied thereto, the first and second gate insulating films being formed below the control gate electrode. Thus, provided is a normally on type semiconductor nonvolatile memory element in which a threshold voltage can be regulated through injection of a large amount of charge with respect to the operating voltage from a drain terminal into the floating gate electrode via the second gate insulating film, and injected carriers do not leak in an operating voltage range.

A display device according to the present disclosure includes: a thin film transistor with a bottom gate structure and a thin film transistor with a top gate structure on a same substrate. A gate electrode of the thin film transistor with the top gate structure is provided in a same layer as a wire layer. A method of manufacturing a display device according to the present disclosure, the display device including a thin film transistor with a bottom gate structure and a thin film transistor with a top gate structure on a same substrate, includes: forming a gate electrode of the thin film transistor with the top gate structure in a same layer as a wire layer.

A semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate. The semiconductor device structure includes a gate stack over the semiconductor substrate. The gate stack includes a first insulating layer, a first layer, a second layer, a second insulating layer, and a gate electrode. The first insulating layer separates the semiconductor substrate from the first layer. The second layer is between the first layer and the second insulating layer. The gate electrode is over the second insulating layer. There is a P-N junction between the first layer and the second layer. The semiconductor device structure includes a first doped region and a second doped region in the semiconductor substrate. The first layer, the first doped region, and the second doped region have a first type conductivity, which is opposite to a second type conductivity of the second layer.

Some embodiments include transistor constructions having a first insulative structure lining a recess within a base. A first conductive structure lines an interior of the first insulative structure, and a ferroelectric structure lines an interior of the first conductive structure. A second conductive structure is within a lower region of the ferroelectric structure, and the second conductive structure has an uppermost surface beneath an uppermost surface of the first conductive structure. A second insulative structure is over the second conductive structure and within the ferroelectric structure. A pair of source/drain regions are adjacent an upper region of the first insulative structure and are on opposing sides of the first insulative structure from one another.

Provided is a floating gate based 3-terminal analog synapse device including a silicon channel layer; a gate oxide deposited on the silicon channel layer; a charge trap layer deposited on the gate oxide, wherein charges are injected into the charge trap layer; a barrier layer deposited on the charge trap layer, and having lower electron affinity than electron affinity of a material of the charge trap layer; and a gate metal layer deposited on an upper surface of the barrier layer, wherein a gate voltage is applied to the gate metal layer.

Provided is a floating gate based 3-terminal analog synapse device including a silicon channel layer; a gate oxide deposited on the silicon channel layer; a charge trap layer deposited on the gate oxide, wherein charges are injected into the charge trap layer; a barrier layer deposited on the charge trap layer, and having lower electron affinity than electron affinity of a material of the charge trap layer; and a gate metal layer deposited on an upper surface of the barrier layer, wherein a gate voltage is applied to the gate metal layer.

A manufacturing method of a semiconductor device, includes providing a substrate; forming a stacked gate, including a floating gate and a control gate, on the substrate; forming a stacked gate by a deposition of a select gate conductive layer on the stacked gate; forming a trench in the stacked gate by etching the stacked gate to separate a first select gate pattern and a second select gate pattern; and forming a first select gate, a second select gate, a first transistor, and a second transistor simultaneously through an etch-back process of the stacked gate

A four transistor ternary content-addressable memory cell includes a first series connection of a first non-hysteretic transistor (e.g., a thin-film transistor) and a first memory transistor (e.g., a thin-film transistor) including a first memory element configured to store a first binary bit; and a second series connection of a second non-hysteretic transistor and a second memory transistor including a second memory element configured to store a second binary bit. The first series connection and the second series connection are connected in parallel between a match line and a word line.