Patent classifications
H
H10
H10F
39/00
H10F39/021
H10F39/021
Infrared image sensor component manufacturing method
12615864
·
2026-04-28
·
·
A method includes following steps. A first III-V compound layer is epitaxially grown over a semiconductive substrate. The first III-V compound layer has an energy gap in a gradient distribution. A source/drain contact is formed over the first III-V compound layer. A gate structure is formed over the first III-V compound layer.