Patent classifications
H10F39/1898
Solid state photomultiplier
Embodiments of a solid state photomultiplier are provided herein. In some embodiments, a photosensor may include a sensing element; and readout electronics, wherein the sensing element is AC coupled to the readout electronics. In some embodiments, a solid state photomultipler may include a microcell having; a sensing element; and readout electronics, wherein the sensing element is AC coupled to the readout electronics.
Solid-state imaging device
A solid-state imaging device includes a sensor panel section and a readout circuit section. The sensor panel section is disposed on a glass substrate and has a photodetecting section including pixels arrayed in M rows and N columns, row selection lines, and readout lines. The readout circuit section is disposed on a substrate and has N integration circuits. Rectifier circuits are connected between nodes, between N panel-side connection points and the integration circuits, and a constant potential line. Circuit elements having resistance components are connected between the nodes and readout lines.
Radiographic detector formed on scintillator
A projection radiographic imaging apparatus includes a scintillator and an imaging array. The imaging array includes a plurality of pixels formed directly on a side of the scintillator. Each of the pixels includes at least one photosensor and at least one readout element.
LIGHT GUIDE ARRAY FOR PET DETECTOR FABRICATION METHODS AND APPARATUS
A photon detector having an optical transparent plate and photodiode array interconnected by an optical light guide array. The optical light guide array including elements providing a transmission line between the optical transparent plate and the photodiode array, where the position of one or more optical light guide elements is formed to adjust for a miss-registered photodiode individual element. A method for assembling the photon detector includes depositing a non-wetting film on opposing surfaces of the optical transparent plate and/or photodiode array, altering the deposited non-wetting film in regions of individual photodiode elements, dispensing an optical coupler adhesive on the optical transparent plate and photodiode array to form adhesive beads, aligning the opposing surfaces, assembling the opposing surfaces so that the corresponding optical coupler adhesive beads contact each other, and curing the optical coupler adhesive to form a structurally merged photon detector having optical light guide elements.
RADIATION DETECTOR FABRICATION
The present approach relates to the fabrication of radiation detectors. In certain embodiments, additive manufacture techniques, such as 3D metallic printing techniques are employed to fabricate one or more parts of a detector. In an example of one such printing embodiment, amorphous silicon may be initially disposed onto a substrate and a laser may be employed to melt some or all of the amorphous silicon so as to form crystalline silicon circuitry of a light imager panel. Such printing techniques may also be employed to fabricate other aspects of a radiation detector, such as a scintillator layer.
Integrated scintillator grid with photodiodes
Various embodiments of a structure implemented in an X-ray imaging system are described. In one aspect, a structure implemented in an X-ray imaging system includes a silicon wafer including a first side and a second side opposite the first side. The silicon wafer also includes an array of photodiodes on the first side of the silicon wafer with the photodiodes electrically isolated from each other as well as an array of grid holes on the second side of the silicon wafer. Each grid hole of the array of grid holes is aligned with a respective photodiode of the array of photodiodes. The structure also includes a layer of scintillating material disposed over the array of grid holes on the second side of the silicon wafer. The structure further includes a layer of reflective material disposed on the layer of scintillating material.
X-RAY DETECTOR WITH DIRECTLY APPLIED SCINTILLATOR
An x-ray image detector includes a light image sensor having a depth, a front side comprising a sensing surface, and a back side. The x-ray image detector further includes a substrate plate on the back side and surrounding the depth of the light image sensor such that the substrate plate forms a lip around the light image sensor. The lip is level with the front side of the light image sensor. The x-ray image detector further includes a scintillator over the sensing surface of the light image sensor and at least a portion of the lip.
APPARATUS FOR RADIATION DETECTION IN A DIGITAL IMAGING SYSTEM
The disclosure is directed at a method and apparatus for producing a detector element. The detector element includes first and second electrodes located on opposites sides of a semiconductor layer. The first and second electrodes are staggered with respect to each other in a plane perpendicular to the semiconductor layer.
IMAGING DEVICE, OPERATING METHOD THEREOF, AND ELECTRONIC DEVICE
An imaging device whose dynamic range is broadened is provided. The imaging device includes a pixel including a first photoelectric conversion element and a first circuit including a second photoelectric conversion element. The first circuit switches the operation mode of the pixel to a normal imaging mode or a wide dynamic range mode and switches the operation region of the first photoelectric conversion element to a normal region or an avalanche region in accordance with the illuminance of light with which the second photoelectric conversion element is irradiated. When the illuminance of light with which the first photoelectric conversion element is irradiated is increased, the increase rate of a writing current flowing to the pixel is higher in the avalanche region than in the normal region. However, in the wide dynamic range mode, the increase rate of current can be lowered, and thus the dynamic range can be broadened.
IMAGE SENSOR
Disclosed is a method for driving an image sensor based on an automatic trigger method, in which pixels are arranged in the form of a matrix along row lines and column lines. The method includes, during an X-ray sensing period, continuously applying a gate signal having a turn-on level to all of the row lines of the image sensor and periodically reading out data from the all of the row lines; determining whether an X-ray is radiated by comparing the periodically read out data with reference data; generating a trigger signal when it is determined that an X-ray is radiated; and acquiring image data, generated by radiating the X-ray, according to the trigger signal.