A thin film transistor (TFT) array substrate and an organic light-emitting diode display employing the same are disclosed. In one aspect, the substrate includes at least one TFT, the TFT including a substrate and a semiconductor pattern comprising a source region, a channel region, and a drain region. The TFT also includes a gate insulating layer covering the semiconductor pattern, a side gate electrode electrically insulated from the semiconductor pattern and formed over at least one side of the channel region, and a top gate electrode formed over the gate insulating layer so as to partially overlap the semiconductor pattern, the side gate electrode and the top gate electrode electrically connected to each other.

Semiconductor devices and methods of forming the same are provided. A first gate stack is formed over a substrate, wherein the first gate stack comprises a first ferroelectric layer. A source/channel/drain stack is formed over the first gate stack, wherein the source/channel/drain stack comprises one or more 2D material layers. A second gate stack is formed over the source/channel/drain stack, wherein the second gate stack comprises a second ferroelectric layer.

A semiconductor device includes a pillar-shaped semiconductor having an impurity concentration of 10.sup.17 cm.sup.3 or less. A first insulator surrounds the pillar-shaped semiconductor and a first metal surrounds a portion of the first insulator at a first end of the pillar-shaped semiconductor. A second metal surrounds a portion of the first insulator at a second end of the pillar-shaped semiconductor, and a third metal surrounds a portion of the first insulator in a region between the first and second metals. The first metal and the second metal are electrically insulated from the third metal. Source/drain regions are defined in the pillar-shaped semiconductor due to a work function difference between the pillar-shaped semiconductor and the first and second metals.

An organic light emitting diode array substrate, a method for manufacturing the same and a display device are provided. The organic light emitting diode array substrate includes a base substrate, a first electrode layer, a first light emitting layer, a second electrode layer, a thin film transistor, a third electrode layer, a second light emitting layer, and a fourth electrode layer. A drain electrode of the thin film transistor is connected to the third electrode layer, the third electrode layer is connected to the second electrode layer, a light emission of the first light emitting layer is controlled by the first electrode layer and a second electrode layer, and the light emission of the second light emitting layer is controlled by the third electrode layer and the fourth electrode layer.

Multi-gate devices and methods for fabricating such are disclosed herein. An exemplary method includes forming a diffusion blocking layer on a semiconductor substrate; forming channel material layers over the diffusion blocking layer; patterning the semiconductor substrate, the channel material layers, and the diffusion blocking layer to form a trench in the semiconductor substrate, thereby defining an active region being adjacent the trench; filling the trench with a dielectric material layer and a solid doping source material layer containing a dopant; and driving the dopant from the solid doping source material layer to the active region, thereby forming an anti-punch-through (APT) feature in the active region.

The purpose of the present invention is to suppress a variation in a threshold voltage ( Vth) in a Thin Film Transistor (TFT) using an oxide semiconductor. The present invention takes a structure as follows to attain this purpose. A semiconductor device having TFT using an oxide semiconductor including: a channel region, a source region, a drain region, and a transition region between the channel region and the source region and between the channel region and the drain region, in which a resistivity of the transition region is smaller than that of the channel region, and larger than that of the source region or the drain region; a source electrode is formed overlapping the source region, and a drain electrode is formed overlapping the drain region; and a thickness of the transition region of the oxide semiconductor is larger than a thickness of the channel region of the oxide semiconductor.

The present invention discloses a multi-gate thin film transistor for realizing a multi-gate occupying a small area, pixels provided with the multi-gate TFTs are high in aperture ratio, and a display device provided with the multi-gate TFTs is high in resolution. The multi-gate thin film transistor comprises: at least three gate electrodes; a plurality of active layers corresponding to each of the gate electrodes, respectively, the active layers being formed into an integrated structure; a source electrode connected with one of the plurality of active layers; and a plurality of drain electrodes connected with each of the remainder of the plurality of active layers, respectively. The present invention further discloses an array substrate comprising the multi-gate thin film transistor, and a display device.

A display device having at least a plurality of pixel circuits, connected to signal lines to which data signals in accordance with luminance information are supplied, arranged in a matrix, wherein pixel circuits of odd number columns and even number columns adjacent sandwiching an axis in a column direction parallel to an arrangement direction of the signal lines have a mirror type circuit arrangement symmetric about the axis of the column direction, and there are lines different from the signal lines between signal lines of adjacent pixel circuits.

A method for fabricating a Polysilicon Thin-Film Transistor is provided. The method includes forming a polysilicon active layer, forming a first gate insulation layer and a first gate electrode sequentially on the active layer, conducting a first ion implantation process on the active layer by using the first gate electrode as a mask to form two doped regions at ends of the active layer, forming a second gate insulation layer and a second gate electrode sequentially on the first gate insulation layer and the first gate electrode, and conducting a second ion implantation process on the active layer by using the second gate electrode as another mask to form two source/drain implantation regions at two outer sides of the doped regions of the active layer. Accordingly, impurity concentration of the two doped regions is smaller than that of the two source/drain implantation regions.

A semiconductor device with reduced parasitic capacitance is provided. A stack is formed on an insulating layer, the stack comprising a first oxide insulating layer, an oxide semiconductor layer over the first oxide insulating layer, and a second oxide insulating layer on the oxide semiconductor layer; a gate electrode layer and a gate insulating layer are formed on the second oxide insulating layer; a first low-resistance region is formed by adding a first ion to the second oxide semiconductor layer using the gate electrode layer as a mask; a sidewall insulating layer is formed on an outer side of the gate electrode layer; a second conductive layer is formed over the gate electrode layer, the sidewall insulating layer, and the second insulating layer; and an alloyed region in the second oxide semiconductor layer is formed by performing heat treatment.