In a light-emitting element including a first InAs layer that is undoped or doped with an n-type dopant; an active layer including one or more InAs.sub.ySb.sub.1-y layers (0<y<1); and a second InAs layer doped with a p-type dopant, an Al.sub.xIn.sub.1-xAs electron blocking layer (0.05x0.40) with a thickness of 5 nm to 40 nm is provided between the active layer and the second InAs layer.

A light source for plant cultivation includes a first light source emitting a first type of light for photosynthesis of a plant and a second light source emitting a second type of light for adjustment of phytochemicals in the plant. The first type of light has at least one peak in the visible spectrum, and the second type of light has a peak in a different wavelength band from the first light source. The second type of light has a peak in the wavelength band of about 360 nm to about 420 nm.

A wavelength converting structure is disclosed, the wavelength converting structure including a spinel type SWIR phosphor material having emission wavelengths in the range of 1000 to 1700 nm, the SWIR phosphor material including AE.sub.1-x-zA.sub.z+0.5(x-y)D.sub.2+0.5(x-y)-z-u E.sub.zO.sub.4:Ni.sub.y,Cr.sub.u where AE=Mg, Zn, Co, or Be, or mixtures thereof, A=Li, Na, Cu, or Ag, or mixtures thereof, D=Ga, Al, B, In, or Sc, or mixtures thereof, and E=Si, Ge, Sn, Ti, Zr, or Hf, or mixtures thereof; where 0x1, 0<y0.1, 0z1, 0u0.2.

An infrared light-emitting diode (LED) element is capable of emitting infrared light having a peak wavelength of 1350 nm to 2000 nm and includes: a first stacked body including a first semiconductor that exhibits a first conductivity type, and an intermediate layer having a thickness of 15 nm or more; an active layer disposed on or over the intermediate layer of the first stacked body; and a second stacked body including a second semiconductor layer that exhibits a second conductivity type different from at least the first conductivity type and is disposed on or over the active layer. A relationship E.sub.a<E.sub.m<E.sub.p holds, where E.sub.a represents the band gap energy of the active layer, E.sub.m represents the band gap energy of the intermediate layer, and E.sub.p represents the band gap energy of the first semiconductor layer.

A semiconductor device is provided, which includes an epitaxial structure. The epitaxial structure includes a first semiconductor structure, a second semiconductor structure, and an active region. The first semiconductor structure has a first conductivity type and includes a first intermediate layer and a first cladding layer. The second semiconductor structure has a second conductivity type. The active region is located between the first semiconductor structure and the second semiconductor structure. The first intermediate layer is located between the active region and the first cladding layer. The first intermediate layer includes P or As. The first intermediate layer and the first cladding layer include a first dopant. A maximum concentration of the first dopant in the first intermediate layer is greater than a maximum concentration of the first dopant in the first cladding layer.

A semiconductor device includes: a first semiconductor structure; a second semiconductor structure on the first semiconductor structure; an active region between the first semiconductor structure and the second semiconductor structure, wherein the active region comprises a well layer and a barrier layer, wherein the barrier layer has a band gap; a first electron blocking layer between the second semiconductor structure and the active region, wherein the first electron blocking layer comprises a band gap which is greater than the band gap of the barrier layer; a first aluminum-containing layer between the first electron blocking layer and the active region, wherein the first aluminum-containing layer has a band gap greater than the band gap of the first electron blocking layer; a confinement layer between the first aluminum-containing layer and the active region; and a second aluminum-containing layer between the second semiconductor structure and the first electron blocking layer; wherein both the first aluminum-containing layer and the second aluminum-containing layer have bandgaps greater than the band gap of the first electron blocking layer; and wherein a distance between the first aluminum-containing layer and an upper surface of the active region is between 3 nm and 20 nm.

A photon source comprising: a quantum dot; and an optical cavity, the optical cavity comprising: a diffractive Bragg grating DBG; and a planar reflection layer, the DBG comprising a plurality of concentric reflective rings surrounding a central disk and at least one conductive track extending from the central disk across the plurality of concentric rings, the quantum dot being provided within the central disk and the planar reflection layer being provided on one side of the DBG to cause light to be preferentially emitted from the opposing side of the DBG.

A light-emitting device includes a light-emitting laminating structure having an ohmic contact layer, a transition layer, a current-spreading layer, a first type semiconductor layer, an active layer, and a second type semiconductor layer. The current-spreading layer has aluminum, and, in the current-spreading layer, a relative content of the aluminum with respect to a composition of the current-spreading layer is fixed. The transition layer has aluminum, and, in the transition layer, a relative content of the aluminum with respect to a composition of the transition layer is less than the relative content of the aluminum in the current-spreading layer. A method for producing the light-emitting device is also disclosed.

A light-emitting device includes a semiconductor epitaxial structure that has a first surface and a second surface, and that includes a first semiconductor layer, an active layer, and a second semiconductor layer. The active layer includes a quantum well structure having multiple periodic units, each including a well layer and a barrier layer greater in bandgap than the well layer. The bandgap of the barrier layer of at least one of the periodic units proximate to the first surface is smaller than that proximate to the second surface, and a thickness of the well layer of at least one of the periodic units proximate to the first surface is greater than that proximate to the second surface. In some embodiments, a bandgap of a second spacing layer disposed between the active and second semiconductor layers increases in a direction from the first surface to the second surface.

A device may include a metal contact between a first isolation region and a second isolation region on a first surface of an epitaxial layer. The device may include a first sidewall and a second sidewall on a second surface of the epitaxial layer distal to the first isolation region and the second isolation region. The device may include a wavelength converting layer on the epitaxial layer between the first sidewall and the second sidewall.