Optoelectronic devices (e.g., optical proximity sensors), methods for fabricating optoelectronic devices, and systems including optoelectronic devices, are described herein. An optoelectronic device includes a light detector die that includes a light detector sensor area. A light source die is attached to a portion of the light detector die that does not include the light detector sensor area. An opaque barrier is formed between the light detector sensor area and the light source die, and a light transmissive material encapsulates the light detector sensor area and the light source die. Rather than requiring a separate base substrate (e.g., a PCB substrate) to which are connected a light source die and a light detector die, the light source die is connected to the light detector die, such that the light detector die acts as the base for the finished optoelectronic device. This provides for cost reductions and reduces the total package footprint.

According to various embodiments, an optoelectronic component may be provided, the optoelectronic component including: an electrode structure disposed at least one of over and in a carrier; and a grating structure disposed over the electrode structure, the grating structure including at least a first region and a second region, wherein the first region of the grating structure includes amorphous silicon; and wherein the second region of the grating structure includes a material having a refractive index different from the refractive index of the amorphous silicon.

An optical coupler includes an optical transmitting unit and an optical receiving unit in a facing arrangement. The optical transmitting unit includes a power lead having a first die-pad portion, a light emitting element on the first die-pad portion, a ground lead having a second die-pad portion, and an integrated circuit on the second die-pad portion. The integrated circuit has a power pad portion, a light emitting element pad portion, and input pad portions thereon. An inter-center distance between an inner lead of the first input lead and an inner lead of the second input lead is equal to or less than an inter-center distance between an outer lead of the first input lead and an outer lead of the second input lead.

An optical device includes a light element that outputs first output light and second output light, a first light-receiving portion that converts the first output light into a first electrical signal, a second light-receiving portion that converts the second output light into a second electrical signal, a substrate having a plurality of surfaces, a first electrode which is provided on the substrate and is connected to the first light-receiving portion, and a second electrode which is provided on the substrate and is connected to the second light-receiving portion, and a part of the first electrode is disposed on a surface different from a surface on which the second electrode is disposed.

Various embodiments may relate to an optoelectronic component, including an optoelectronic structure formed for providing an electromagnetic radiation, a measuring structure formed for measuring the electromagnetic radiation, and a waveguide formed for guiding the electromagnetic radiation. The optoelectronic structure and the measuring structure are optically coupled to the waveguide. The waveguide includes scattering centers distributed in a matrix, wherein the scattering centers are distributed in the matrix in such a way that part of the electromagnetic radiation is guided from the optoelectronic structure to the measuring structure.

An electronic device including optical sensing with a concentric architecture and methods for operation thereof is disclosed. The concentric architecture can include light detector(s) arranged in a concentric manner around light emitter(s). In some examples, at least one light emitter can be located in the center of the device, and each light detector can be located the same separation distance from the light emitter. Each light detector can be arranged such that the separation distance from the centrally located light emitter can be greater than the separation distance from another light emitter. Examples of the disclosure further include a selective transparent layer overlaying the light detector(s). The selective transparent layer can include section(s) transparent to a first wavelength range and non-transparent to a second wavelength ranges. In some examples, the selective transparent layer can further include section(s) transparent to the second wavelength range.

An electronic device including optical sensing with a concentric architecture and methods for operation thereof is disclosed. The concentric architecture can include light detector(s) arranged in a concentric manner around light emitter(s). In some examples, at least one light emitter can be located in the center of the device, and each light detector can be located the same separation distance from the light emitter. Each light detector can be arranged such that the separation distance from the centrally located light emitter can be greater than the separation distance from another light emitter. Examples of the disclosure further include a selective transparent layer overlaying the light detector(s). The selective transparent layer can include section(s) transparent to a first wavelength range and non-transparent to a second wavelength ranges. In some examples, the selective transparent layer can further include section(s) transparent to the second wavelength range.

An electronic assembly is provided. The electronic assembly includes a first circuit structure including a transistor, a through via and a conductive structure, a plurality of electronic elements disposed on the first circuit structure, a first pad disposed between the first circuit structure and one of the plurality of electronic elements, a second circuit structure disposed on the first circuit structure, and a second pad disposed between the second circuit structure and one of the plurality of electronic elements. At least a portion of the conductive structure is disposed in the through via. The conductive structure is electrically connected to the first pad and the transistor.

An electronic assembly is provided. The electronic assembly includes a first circuit structure including a transistor, a through via and a conductive structure, a plurality of electronic elements disposed on the first circuit structure, a first pad disposed between the first circuit structure and one of the plurality of electronic elements, a second circuit structure disposed on the first circuit structure, and a second pad disposed between the second circuit structure and one of the plurality of electronic elements. At least a portion of the conductive structure is disposed in the through via. The conductive structure is electrically connected to the first pad and the transistor.

An electrical system includes a signal security detection system performing a method of determining a security of an interconnect. An interconnect extended between a first device and a second device. The interconnect has at least one conductive pathway aligned along a direction between the first device and the second device. A light source is configured to transmit a light through the interconnect and an optical detector is configured to receive the light passing through the interconnect. A processor records a first optical signature of the interconnect based on the light received at the optical detector at a first time, records a second optical signature of the interconnect based on the light received at the optical detector at a second time, and validates the second optical signature against the first optical signature to determine a security of the interconnect.