An electrical system includes a signal security detection system performing a method of determining a security of an interconnect. An interconnect extended between a first device and a second device. The interconnect has at least one conductive pathway aligned along a direction between the first device and the second device. A light source is configured to transmit a light through the interconnect and an optical detector is configured to receive the light passing through the interconnect. A processor records a first optical signature of the interconnect based on the light received at the optical detector at a first time, records a second optical signature of the interconnect based on the light received at the optical detector at a second time, and validates the second optical signature against the first optical signature to determine a security of the interconnect.

Provided is an optical module including a substrate, a light emitting element on the substrate, a light receiving element on the substrate, a first casing on the substrate and surrounds a periphery of the light emitting element, and a second casing on the substrate and surrounds a periphery of the light receiving element. Furthermore, the optical module includes a light emitting lens in the first casing on an optical axis of the light emitting element and a light receiving lens in the second casing on an optical axis of the light receiving element, in which a first diameter of one lens out of the light emitting lens and the light receiving lens in a first direction toward an optical axis of the other lens with reference to an optical axis of the one lens is shorter than a second diameter of the one lens in a second direction.

Provided is an optical module including a substrate, a light emitting element on the substrate, a light receiving element on the substrate, a first casing on the substrate and surrounds a periphery of the light emitting element, and a second casing on the substrate and surrounds a periphery of the light receiving element. Furthermore, the optical module includes a light emitting lens in the first casing on an optical axis of the light emitting element and a light receiving lens in the second casing on an optical axis of the light receiving element, in which a first diameter of one lens out of the light emitting lens and the light receiving lens in a first direction toward an optical axis of the other lens with reference to an optical axis of the one lens is shorter than a second diameter of the one lens in a second direction.

An electronic device including optical sensing with a concentric architecture and methods for operation thereof is disclosed. The concentric architecture can include light detector(s) arranged in a concentric manner around light emitter(s). In some examples, at least one light emitter can be located in the center of the device, and each light detector can be located the same separation distance from the light emitter. Each light detector can be arranged such that the separation distance from the centrally located light emitter can be greater than the separation distance from another light emitter. Examples of the disclosure further include a selective transparent layer overlaying the light detector(s). The selective transparent layer can include section(s) transparent to a first wavelength range and non-transparent to a second wavelength ranges. In some examples, the selective transparent layer can further include section(s) transparent to the second wavelength range.

An electronic device including optical sensing with a concentric architecture and methods for operation thereof is disclosed. The concentric architecture can include light detector(s) arranged in a concentric manner around light emitter(s). In some examples, at least one light emitter can be located in the center of the device, and each light detector can be located the same separation distance from the light emitter. Each light detector can be arranged such that the separation distance from the centrally located light emitter can be greater than the separation distance from another light emitter. Examples of the disclosure further include a selective transparent layer overlaying the light detector(s). The selective transparent layer can include section(s) transparent to a first wavelength range and non-transparent to a second wavelength ranges. In some examples, the selective transparent layer can further include section(s) transparent to the second wavelength range.

Processors may interface with memory using microLED-based optical connections. MicroLEDs and photodetectors of the optical connections may be packaged outside of a package for the processor, packaged with a processor, or may be bonded to a surface of the processor. The optical connections may make use of interface chiplets. Some of the interface chiplets may include memory controller circuitry.

Processors may interface with memory using microLED-based optical connections. MicroLEDs and photodetectors of the optical connections may be packaged outside of a package for the processor, packaged with a processor, or may be bonded to a surface of the processor. The optical connections may make use of interface chiplets. Some of the interface chiplets may include memory controller circuitry.

Technologies for chip-to-chip optical data transfer are disclosed. In the illustrative embodiment, microLEDs on a first chip are used to send data to microphotodiodes on a second chip. The beams from the microLEDs may be sent to the microphotodiodes using an optical bridge, microprisms, a channel through a substrate, a channel defined in a substrate, etc. The microLEDs may be used for high-speed data transfer with low power usage. A chip may include a relatively large number of microLEDs and/or microphotodiodes, allowing for a large bandwidth connection. MicroLEDs and microphotodiodes may be used to connect different parts of the same chip, different chips on the same package, different packages on the same device, or different chips on different devices.

An electrical system includes a signal security detection system performing a method of determining a security of an interconnect. An interconnect extended between a first device and a second device. The interconnect has at least one conductive pathway aligned along a direction between the first device and the second device. A light source is configured to transmit a light through the interconnect and an optical detector is configured to receive the light passing through the interconnect. A processor records a first optical signature of the interconnect based on the light received at the optical detector at a first time, records a second optical signature of the interconnect based on the light received at the optical detector at a second time, and validates the second optical signature against the first optical signature to determine a security of the interconnect.

An electrical system includes a signal security detection system performing a method of determining a security of an interconnect. An interconnect extended between a first device and a second device. The interconnect has at least one conductive pathway aligned along a direction between the first device and the second device. A light source is configured to transmit a light through the interconnect and an optical detector is configured to receive the light passing through the interconnect. A processor records a first optical signature of the interconnect based on the light received at the optical detector at a first time, records a second optical signature of the interconnect based on the light received at the optical detector at a second time, and validates the second optical signature against the first optical signature to determine a security of the interconnect.