Embodiments are described of a color filter array including a plurality of tiled minimal repeating units. Each minimal repeating unit includes an invisible-wavelength filter layer including a plurality of filters and a visible-wavelength filter layer positioned on the invisible-wavelength filter layer and having a plurality of filters such that each filter from the visible-wavelength layer is optically coupled to a corresponding filter in the invisible-wavelength layer.

Embodiments relate to photodetectors comprising: a substrate and a bulk-alloy infrared (IR) photo absorption layer disposed on the substrate to absorb photons in an infrared wavelength and having a graded section and an ungraded section. The photodetector comprises a unipolar barrier layer disposed on the bulk-alloy photo absorption layer. The graded section includes a graded alloy composition such that its energy bandgap is largest near the substrate and smallest near the unipolar barrier layer. The embodiments also relate to methods fabricating the photodetectors.

An infrared imaging system includes a phase grating overlying a two-dimensional array of thermally sensitive pixels. The phase grating comprises a two-dimensional array of identical subgratings that define a system of Cartesian coordinates. The subgrating and pixel arrays are sized and oriented such that the pixels are evenly distributed with respect to the row and column intersections of the subgratings. The location of each pixel thus maps to a unique location beneath a virtual archetypical subgrating.

A solid-state imaging apparatus includes: a solid-state imaging device photoelectrically converting light taken by a lens; and a light shielding member shielding part of light incident on the solid-state imaging device from the lens, wherein an angle made between an edge surface of the light shielding member and an optical axis direction of the lens is larger than an incident angle of light to be incident on an edge portion of the light shielding member.

An optical sensor in which photo currents generated by light in the visible and infrared wavelength ranges are to be tapped separately at pn junctions of active regions. The active regions include n- or p-doping and are formed in a p-substrate 52. The optical sensor comprises a surface-near first active region 12, and a second active region 14 subjacent to the first active region 12 and forming together with the first active region 12 a pn junction 22 that is short-circuited. A third active region 20 is subjacent to the second active region 14 and forming together with the second active region a further pn junction 23. Together with a fourth active region 24 subjacent to the second active region 20, a further pn junction 25, 29 is formed together with the third active region 20 and the substrate 52.

An infrared detector is provided. The infrared detector includes an absorption layer sensitive to radiation in only a short wavelength infrared spectral band, and a barrier layer coupled to the absorption layer. The barrier layer is fabricated from an alloy including aluminum and antimony, and at least one of gallium or arsenic, and the composition of the alloy is selected such that valence bands of the absorption layer and the barrier layer substantially align.

An infrared high-pass plasmonic filter includes a copper layer interposed between two layers of a dielectric material. An array of patterned openings extend through the copper layer and are filled with the dielectric material. Each patterned opening is in the shape of a greek cross, with the arms of adjacent patterns being collinear. A ratio of the width to the length of each arm is in the range from 0.3 to 0.6, and the distance separating the opposite ends of arms of adjacent patterns is shorter than 10 nm.

A semiconductor device, and method of fabricating the same, includes a first substrate, the first substrate including at least one visible light photosensor disposed between a first side and a second side of the first substrate, a second substrate including an infrared light photosensor disposed between a second side of the second substrate and a first side of the second substrate, and a metalens disposed between the visible light photosensor and the infrared light photosensor, the metalens configured to focus infrared light impinging on a surface of the first substrate onto the infrared light photosensor.

A sensor including: a semiconductor substrate (41) having a first surface (S1) and a second surface (S2) opposed to each other, and including an avalanche photodiode; an on-chip lens (71) provided on side of the first surface (S1) of the semiconductor substrate (41); a first reflective member (73) provided on the on-chip lens (71); and a wiring layer (42) provided on side of the second surface (S2) of the semiconductor substrate (41), and including a second reflective member (104).

An infrared imaging apparatus having thin-film spatial filters in a stacked array to filter and collate light generated internally by the infrared imaging apparatus such that the light generated impacts a detection area of the imaging apparatus at or near a critical angle. The index of refraction of the detection area being subject to change when irradiated with infrared light such that the amount of light generated internally and reflected to a light detector attached to the imaging apparatus varies with the intensity of the irradiating infrared light.