The present disclosure relates to an optical sensor module, an optical sensing accessory, and an optical sensing device. An optical sensor module comprises a light source, a photodetector, and a substrate. The light source is configured to convert electric power into radiant energy and emit light to an object surface. The photodetector is configured to receive the light from an object surface and convert radiant energy into electrical current or voltage. An optical sensing accessory and an optical sensing device comprise the optical sensor module and other electronic modules to have further applications.

The invention relates to an optoelectronic light-emitting device (1), including: at least one light-emitting diode (40) having an emitting surface (44) adapted to emit so-called excitation luminous radiation; and a photoluminescent material (31) that coats the emitting surface (44), the photoluminescent material containing photoluminescent particles adapted to convert said excitation luminous radiation through the emitting surface (44) at least in part into so-called photoluminescence luminous radiation.

The optoelectronic device includes at least one photodiode (50) adjacent the light-emitting diode (40) having a receiving surface (54) coated by the photoluminescent material (31) and adapted to detect at least part of the excitation radiation and/or the photoluminescence radiation coming from the photoluminescent material (31) through the receiving surface.

A ranging apparatus includes a first array with first light sensitive detectors configured to receive light which has been reflected by an object and generate an output. A second array, spaced apart from the first array by a spacing distance, is further included, the second array having second light sensitive detectors. The second array is configurable to either receive light which has been reflected by the object or to be a reference array and generate an output. A processor operates to determine a distance to the object in response to the outputs from the first and the second arrays.

In one example, a device includes a trench formed in a substrate. The trench includes a first end and a second end that are non-collinear. A first plurality of semiconductor pillars is positioned near the first end of the trench and includes integrated light sources. A second plurality of semiconductor pillars is positioned near the second end of the trench and includes integrated photodetectors.

In one example, a device includes a trench formed in a substrate. The trench includes a first end and a second end that are non-collinear. A first plurality of semiconductor pillars is positioned near the first end of the trench and includes integrated light sources. A second plurality of semiconductor pillars is positioned near the second end of the trench and includes integrated photodetectors.

An optical sensor arrangement, in particular an optical proximity sensor arrangement comprises a three-dimensional integrated circuit further comprising a first layer comprising a light-emitting device, a second layer comprising a light-detector and a driver circuit. The driver circuit is electrically connected to the light-emitting device and to the light-detector to control the operation of the light-emitting device and the light-detector. A mold layer comprising a first light-barrier between the light-emitting device and the light-detector configured to block light from being transmitted directly from the light-emitting device to the light-detector.

The present application relates generally to light emitting diodes and photodetectors as well as their methods of manufacture and use. In one exemplary embodiment, an integrated device may include a substrate, a light emitting diode formed on the substrate, and a photodetector formed on the substrate. In another embodiment, a device may include a light emitting diode formed on a substrate, and the light emitting diode may act as both a solid state light and as an optical transmitter.

A photocoupler comprises a light emitting element, a light-sensing element, a transparent inner encapsulant body, an outer covering body, and two conductive frames. An optically reflective surface is formed on the outer covering body directly in contact with the dome encapsulant portion of the transparent inner encapsulant body. A portion of the light emitted by the light emitting element is reflected to the light-sensing element through the optically reflective surface, and the other portion of the light emitted from the light emitting element is directly emitting to the light-sensing element through the dome encapsulant portion. The present invention applies the optically reflective surface to minimize the overlapping area between the two conductive frames, and reduces the capacitance value, and increases the CMRR in a manner that the photocoupler of the present invention is able to meet the standard of electrical characteristics as required.

An optoelectronic device includes an optoelectronic component that generates or receives radiation, a frame and an optical element, wherein the frame extends in a vertical direction between a radiation passage side and a rear side; an opening, in which the component is arranged, is formed in the frame; the optical element covers the component in a plan view of the radiation passage side; and the optical element is a Fresnel lens or a Fresnel zone plate.

The opto-electronic module (1) comprises a first substrate member (P); a third substrate member (B); a second substrate member (O) arranged between said first and third substrate members and comprising one or more transparent portions (ta, tb) through which light can pass, said at least one transparent portion comprising at least a first optical structure (5a;5a;5b;5b); a first spacer member (S1) comprised in said first substrate member (P) or comprised in said second substrate member (O) or distinct from and located between these, which comprises at least one opening (4a;4b); a second spacer member (S2) comprised in said second substrate member (O) or comprised in said third substrate member (B) or distinct from and located between these, which comprises at least one opening (3); a light detecting element (D) arranged on and electrically connected to said first substrate member (P); a light emission element (E) arranged on and electrically connected to said first substrate member (P); and a sensing element (8) comprised in or arranged at said third substrate member (B).

Such modules (1) are particularly suitable as sensor modules for sensing a magnitude such as a pressure.