A photoelectric conversion element includes a first photoelectric conversion unit configured to generate an electron serving as a signal charge, a second photoelectric conversion unit configured to generate a hole serving as a signal charge, a first floating diffusion region to which the electron generated in the first photoelectric conversion unit is transferred, a second floating diffusion region to which the hole generated in the second photoelectric conversion unit is transferred, an amplifying transistor including a gate electrically connected to the first floating diffusion region and the second floating diffusion region, a first charge ejection unit configured to eject the electron generated in the first photoelectric conversion unit, and a second charge ejection unit configured to eject the hole generated in the second photoelectric conversion unit, wherein the first photoelectric conversion unit and the second photoelectric conversion unit are arranged along a principal surface of a semiconductor substrate.

The opto-electronic module (1) comprises a first substrate member (P); a third substrate member (B); a second substrate member (O) arranged between said first and third substrate members and comprising one or more transparent portions (ta, tb) through which light can pass, said at least one transparent portion comprising at least a first optical structure (5a;5a;5b;5b); a first spacer member (S1) comprised in said first substrate member (P) or comprised in said second substrate member (O) or distinct from and located between these, which comprises at least one opening (4a;4b); a second spacer member (S2) comprised in said second substrate member (O) or comprised in said third substrate member (B) or distinct from and located between these, which comprises at least one opening (3); a light detecting element (D) arranged on and electrically connected to said first substrate member (P); a light emission element (E) arranged on and electrically connected to said first substrate member (P); and a sensing element (8) comprised in or arranged at said third substrate member (B). Such modules (1) are particularly suitable as sensor modules for sensing a magnitude such as a pressure.

An photoelectric convertor comprises an optical coupler, a circuit board and two restricting posts fixed on the circuit board. The optical coupler defined two restricting grooves passing through its bottom surface and top surface. When the optical coupler is positioned on the circuit board, the two restricting posts are respectively engaged in the two restricting grooves. Each restricting groove has a sidewall opposite to a front surface of the optical coupler.

In one example, a device includes a trench formed in a substrate. The trench includes a first end and a second end that are non-collinear. A first plurality of semiconductor pillars is positioned near the first end of the trench and includes integrated light sources. A second plurality of semiconductor pillars is positioned near the second end of the trench and includes integrated photodetectors.

The invention relates to an optoelectronic device including a transmitter designed to emit electromagnetic radiation and to be operated with an input voltage, and a receiver designed to receive the electromagnetic radiation and to provide an output voltage, the transmitter including at least one surface emitter, and the receiver comprising at least one photodiode.

A microelectronics chip contains an integrated CMOS imaging sensor integrated with a LED die. Circuitry is established on the chip for a shared power arrangement.

The present disclosure relates to an integrated light emitting device. The integrated light emitting device comprises a substrate of semiconductor material, a light emitting unit integrated into the semiconductor material, and at least one cavity formed into the semiconductor material between the substrate and the light emitting unit. At least portions of the at least one cavity may be formed by Silicon-On-Nothing (SON) process steps.

A method for producing an optical position encoder including an optoelectronic component and a measuring scale which is illuminated by an LED light source of the optoelectronic component. The LED light source is molded not a mold housing such that a light outlet surface of the LED light source is outwardly exposed, and the light outlet surface has a coating and is uncoated in some regions in order to provide a light outlet window. The disclosure additionally relates to an optical position encoder including an optoelectronic component with a mold housing in which an LED light source is arranged such that a light outlet surface of the LED light source is outwardly exposed, the light outlet surface being coated and having an uncoated light outlet window, and including a measuring scale which is illuminated by the LED light source of the optoelectronic component.

A method for producing an optical position encoder including an optoelectronic component and a measuring scale which is illuminated by an LED light source of the optoelectronic component. The LED light source is molded not a mold housing such that a light outlet surface of the LED light source is outwardly exposed, and the light outlet surface has a coating and is uncoated in some regions in order to provide a light outlet window. The disclosure additionally relates to an optical position encoder including an optoelectronic component with a mold housing in which an LED light source is arranged such that a light outlet surface of the LED light source is outwardly exposed, the light outlet surface being coated and having an uncoated light outlet window, and including a measuring scale which is illuminated by the LED light source of the optoelectronic component.

An electrical power converter can include a plurality of layers disposed on a substrate. An emitter, including a first semiconductor junction that is formed at an interface between a first pair of adjacent layers, can produce light in response to a first electrical signal. An absorber, including a second semiconductor junction that is formed at an interface between a second pair of adjacent layers, can absorb at least some of the light. Circuitry can produce a second electrical signal in response to the absorbed light. The second electrical signal can be substantially proportional to the first electrical signal and can be electrically isolated from the first electrical signal. Because the light can remain within the layers during use, the electrical power converter can have a higher efficiency than a comparable device that propagates the light through at least one interface between air and a semiconductor material.