A photovoltaic assembly for converting solar radiation to electrical energy is described. The photovoltaic assembly includes a photovoltaic module and an electronic component housing. The photovoltaic module has a frame, a laminate, a plurality of solar cells and a backsheet. The electronic component housing has an upper section to couple to the backsheet, a middle section and a lower section for enclosing electronic components. The electronic components can include a microinverter or electronics for a junction box. The middle section can have a heat sink in thermal communication with the electronic component and an opening. The opening can be a plurality of openings having a plurality of air fins distributed therein, or can be a diagonal or curved structure. The opening can permit fluid communication between the heat sink and an ambient environment. The upper section and/or the aforementioned air fins can also be coupled to the backsheet via a heat conductive adhesive.

A radiographic image detector includes a phosphor layer, a heat shield layer, and a photoelectric converter in this order, wherein the heat shield layer has a thickness T (m) and a thermal conductivity C (W/m.Math.K) satisfying that C/T is from 0.004 to 5.

A composite material, which can be used as an encapsulant for an ultraviolet device, is provided. The composite material includes a matrix material and at least one filler material incorporated in the matrix material that are both at least partially transparent to ultraviolet radiation of a target wavelength. The filler material includes microparticles and/or nanoparticles and can have a thermal coefficient of expansion significantly smaller than a thermal coefficient of expansion of the matrix material for relevant atmospheric conditions. The relevant atmospheric conditions can include a temperature and a pressure present during each of: a curing and a cool down process for fabrication of a device package including the composite material and normal operation of the ultraviolet device within the device package.

A light generator comprises a light conversion device and a light source arranged to apply a light beam to the light conversion element. The light conversion device includes an optoceramic or other solid phosphor element comprising one or more phosphors embedded in a ceramic, glass, or other host, a metal heat sink, and a solder bond attaching the optoceramic phosphor element to the metal heat sink. The optoceramic phosphor element does not undergo cracking in response to the light source applying a light beam of beam energy effective to heat the optoceramic phosphor element to the phosphor quenching point.

A temperature-controlled photodetector sub-system is described. The temperature control element allows the operation of the photodetector at a desired temperature. The temperature control element can be a heater or a cooler. In some cases, the photodetector is a germanium photodetector. In some cases a temperature measuring device is provided. In some cases, a control circuit is used to control the temperature of the germanium photodetector within a temperature range, or at a temperature of interest. An advantage provided by the apparatus described is the operation of the photodetector so that the responsivity of the germanium detector can be held at essentially a constant value.

Techniques for enhancing the absorption of photons in semiconductors with the use of microstructures are described. The microstructures, such as pillars and/or holes, effectively increase the effective absorption length resulting in a greater absorption of the photons. Using microstructures for absorption enhancement for silicon photodiodes and silicon avalanche photodiodes can result in bandwidths in excess of 10 Gb/s at photons with wavelengths of 850 nm, and with quantum efficiencies of approximately 90% or more.

A slab laser and its method of use for high power applications including the manufacture of semiconductors and deposition of diamond and/or diamond-like-carbon layers, among other materials. A lamp driven slab design with a face-to-face beam propagation scheme and an end reflection that redirects the amplified radiation back out the same input surface is utilized. A side-to-side amplifier configuration permitting very high average and peak powers having scalability is also disclosed. Cavity filters adjacent to pump lamps convert the normally unusable UV portion of the pump lamp spectrum into light in the absorption band of the slab laser, thereby increasing the overall pump efficiency. The angle of the end reflecting surface is changed to cause the exit beam to be at a different angle than the inlet beam, thereby eliminating the costly need to separate the beams external to the laser with the subsequent loss of power.

An electronic component housing package includes a substrate having an upper surface including a mount region on which an electronic component is to be mounted; a frame body disposed on the upper surface of the substrate, the frame body being provided with a through-hole portion; and an input/output member disposed on the frame body so as to block the through-hole portion, the input/output member having wiring conductors which are to be electrically connected to the electronic component, the wiring conductors extending to an inside and outside of the frame body and also extending along a lower surface of the input/output member on the outside of the frame body. The input/output member is provided with a cutout portion which is cut out so as to extend from a gap between the wiring conductors on the lower surface along the wiring conductors to an outer side surface of the input/output member.

A tiled array of hybrid assemblies and a method of forming such an array enables the assemblies to be placed close together. Each assembly comprises first and second dies, with the second die mounted on and interconnected with the first die. Each vertical edge of a second die which is to be located adjacent to a vertical edge of another second die in the tiled array is etched such that the etched edge is aligned with a vertical edge of the first die. Indium bumps are deposited on a baseplate where the hybrid assemblies are to be mounted, and the assemblies are mounted onto respective indium bumps using a hybridizing machine, enabling the assemblies to be placed close together, preferably 10 m. The first and second dies may be, for example. a detector and a readout IC, or an array of LEDs and a read-in IC.

A circuit chip module heat dissipation structure includes a circuit module including a circuit board and a chip unit mounted at the circuit board, and a heat dissipation device consisting of a plurality of heat-transfer blocks bonded to the surface of the circuit board and abutted against the peripheral walls of the chip unit to create a heat-transfer path for transferring heat from the chip unit for quick dissipation.