Provided is a sensor apparatus that can suppress movement of foreign matter from a Peltier element to a sensor element. The sensor apparatus includes a package substrate, a Peltier element, a circuit substrate, and a sensor element. The package substrate has a recess portion on a side of a first surface and plural terminals on a side of a second surface located on an opposite side of the first surface. The Peltier element is arranged in the recess portion. The circuit substrate is arranged on an opposite side of a bottom surface of the recess portion with the Peltier element sandwiched therebetween. The sensor element is attached to an opposite side of a surface, the surface being opposed to the Peltier element.

Provided is a sensor apparatus that can suppress movement of foreign matter from a Peltier element to a sensor element. The sensor apparatus includes a package substrate, a Peltier element, a circuit substrate, and a sensor element. The package substrate has a recess portion on a side of a first surface and plural terminals on a side of a second surface located on an opposite side of the first surface. The Peltier element is arranged in the recess portion. The circuit substrate is arranged on an opposite side of a bottom surface of the recess portion with the Peltier element sandwiched therebetween. The sensor element is attached to an opposite side of a surface, the surface being opposed to the Peltier element.

In various embodiments, an electro-optical device is provided. The electro-optical device includes a transparent layer. The electro-optical device also includes a heat sink mechanically coupled to and embedding the transparent layer, where the heat sink includes a first heat sink section, and a second heat sink section. The electro-optical device also includes an electronic circuitry disposed on a substrate, a first pillar configured to mechanically couple the first heat sink section to the electronic circuitry and transfer heat generated by the electronic circuitry to the first heat sink section, and a second pillar configured to mechanically couple the second heat sink sections to the electronic circuitry and transfer heat generated by the electronic circuitry to the second heat sink section.

An integrated apparatus, a detection apparatus, a terminal, and a manufacturing method are disclosed, relate to the field of electronic technologies, and are used to resolve problems of heat dissipation and proneness to a chip stress of a sensing chip. The integrated apparatus includes a substrate layer, a sensing chip, and a PCB. The sensing chip is disposed on the substrate layer. The PCB is disposed on the substrate layer, the PCB is provided with an opening, the sensing chip is located in the opening, and the sensing chip is connected to the PCB through a transmission line. A difference between a coefficient of thermal expansion CTE of the substrate layer and a CTE of the sensing chip is less than a first preset threshold.

An integrated apparatus, a detection apparatus, a terminal, and a manufacturing method are disclosed, relate to the field of electronic technologies, and are used to resolve problems of heat dissipation and proneness to a chip stress of a sensing chip. The integrated apparatus includes a substrate layer, a sensing chip, and a PCB. The sensing chip is disposed on the substrate layer. The PCB is disposed on the substrate layer, the PCB is provided with an opening, the sensing chip is located in the opening, and the sensing chip is connected to the PCB through a transmission line. A difference between a coefficient of thermal expansion CTE of the substrate layer and a CTE of the sensing chip is less than a first preset threshold.

Each of the pair of lead pins has a first portion protruding from the first surface and a second portion protruding from the second surface. Each of the pair of first lines is connected to the first portion. Each of the pair of second lines is connected to the second portion. A photoelectric device is electrically connected to the pair of first lines. A longer one of the pair of first lines is electrically connected to a shorter one of the pair of second lines, through a corresponding one of the pair of lead pins. A shorter one of the pair of first lines is electrically connected to a longer one of the pair of second lines, through another corresponding one of the pair of lead pins.

In part, in one aspect, the disclosure relates to a system including a photonic integrated circuit (PIC) assembly, comprising a PIC comprising: a first bond pad disposed inward from an edge of the PIC a first distance; and a first wire having a first length, the first wire electrically connected to the first bond pad and extending therefrom, wherein the first distance is greater than 0.4 mm.

In part, in one aspect, the disclosure relates to a system including a photonic integrated circuit (PIC) assembly, comprising a PIC comprising: a first bond pad disposed inward from an edge of the PIC a first distance; and a first wire having a first length, the first wire electrically connected to the first bond pad and extending therefrom, wherein the first distance is greater than 0.4 mm.

An integrated filter optical package including an ambient light sensor that incorporates an infrared (IR) filter in an integrated circuit (IC) stacked-die configuration is provided. The integrated filter optical package incorporates an infrared (IR) coated glass layer to filter out or block IR light while allowing visible (ambient) light to pass through to a light sensitive die having a light sensor. The ambient light sensor detects an amount of visible light that passes through the IR coated glass layer and adjusts a brightness or intensity of a display screen on an electronic device accordingly so that the display screen is readable.

An integrated filter optical package including an ambient light sensor that incorporates an infrared (IR) filter in an integrated circuit (IC) stacked-die configuration is provided. The integrated filter optical package incorporates an infrared (IR) coated glass layer to filter out or block IR light while allowing visible (ambient) light to pass through to a light sensitive die having a light sensor. The ambient light sensor detects an amount of visible light that passes through the IR coated glass layer and adjusts a brightness or intensity of a display screen on an electronic device accordingly so that the display screen is readable.