The present invention provides a package structure of an optical apparatus which includes a substrate, a light emitting device, a light sensing device, and a light barrier member. The light emitting device is disposed on the substrate and electrically connected to the substrate. The light emitting device is for emitting light. The light sensing device is disposed on the substrate and is a chip scale package (CSP) device. The light sensing device is for receiving light reflected by an object. The light barrier member is disposed around a periphery of the light sensing device.

There is provided an optical wavelength conversion element with a good temporal stability and such a high optical wavelength conversion efficiency that the element is viable even under sunlight or similar, low intensity light. Owing to these properties, the element is suited for use in solar cells, photocatalysts, photocatalytic hydrogen and oxygen generating devices, photon upconversion filters, and like articles. The optical wavelength conversion element is visually homogeneous and transparent and produced by dissolving and/or dispersing in an ionic liquid (C) a combination of organic photosensitizing molecules (A) and organic light-emitting molecules (B) that exhibits triplet-triplet annihilation. The organic photosensitizing molecules (A) have either an only one local maximum absorption wavelength or a plurality of local maximum absorption wavelengths, and either the single local maximum absorption wavelength or a maximum one of the plurality of local maximum absorption wavelengths is from 250 nm to 499 nm.

In some aspects, graphic layers for depicting a visible representation of an image along a surface of a photovoltaic module can include a plurality of substantially opaque isolated regions; and at least one substantially transparent contiguous region surrounding the substantially opaque isolated regions, wherein an outer surface of the at least one substantially transparent contiguous region comprises a matte surface finish.

The present invention provides a package structure of an optical apparatus which includes a substrate, a light emitting device, a light sensing device, and a light barrier member. The light emitting device is disposed on the substrate and electrically connected to the substrate. The light emitting device is for emitting light. The light sensing device is disposed on the substrate and is a chip scale package (CSP) device. The light sensing device is for receiving light reflected by an object. The light barrier member is disposed around a periphery of the light sensing device.

Fabricating optical devices can include mounting a plurality of singulated lens systems over a substrate, adjusting a thickness of the substrate below at least some of the lens systems to provide respective focal length corrections for the lens systems, and subsequently separating the substrate into a plurality of optical modules, each of which includes one of the lens systems mounted over a portion of the substrate. Adjusting a thickness of the substrate can include, for example, micro-machining the substrate to form respective holes below at least some of the lens systems or adding one or more layers below at least some of the lens systems so as to correct for variations in the focal lengths of the lens systems.

A device may include a multispectral filter array disposed on the substrate. The multispectral filter array may include a first metal mirror disposed on the substrate. The multispectral filter may include a spacer disposed on the first metal mirror. The spacer may include a set of layers. The spacer may include a second metal mirror disposed on the spacer. The second metal mirror may be aligned with two or more sensor elements of a set of sensor elements.

A semiconductor photonics device includes a plurality of grating couplers, each configured to couple a particular wavelength (or wavelength range) of an optical signal to a waveguide of the semiconductor photonics device. In some implementations, various implementations of optical signal splitters or filters described herein enable respective wavelengths (or respective wavelength ranges) to be passed to each of the grating couplers (while filtering out other wavelengths or other wavelength ranges), thereby enabling the grating couplers to each handle a respective wavelength (or respective wavelength range). This enables multiple wavelengths (or multiple wavelength ranges) to be distributed across multiple grating couplers, which may increase the bandwidth of the semiconductor photonics device relative to a semiconductor photonics device that includes only a single grating coupler.

A optical sensing device includes a substrate, an optical acting area and a filter layer. The optical acting area is disposed on the substrate. The filter layer covers the optical acting area and selectively allows only a light beam with a specific wavelength to pass through and be received by the optical acting area while blocking the light beams with other wavelengths. Each of the two sides of the substrate has a bevel structure. The filter layer covers each bevel structure of each side to prevent the light beams with other wavelengths from passing through the two sides of the substrate being received by the optical acting area.

Disclosed is a cost-effective method to fabricate a multifunctional collimator structure for contact image sensors to filter ambient infrared light to reduce noises. In one embodiment, an optical collimator, includes: a dielectric layer; a substrate; a plurality of via holes; and a conductive layer, wherein the dielectric layer is formed over the substrate, wherein the plurality of via holes are configured as an array along a lateral direction of a first surface of the dielectric layer, wherein each of the plurality of via holes extends through the dielectric layer and the substrate from the first surface of the dielectric layer to a second surface of the substrate in a vertical direction, and wherein the conductive layer is formed over at least one of the following: the first surface of the first dielectric layer and a portion of sidewalls of each of the plurality of via holes, and wherein the conductive layer is configured so as to allow the optical collimator to filter light in a range of wavelengths.

An optical sensor including a planar nano-photonic microlens array and an electronic apparatus including the same are provided. The optical sensor may include: a sensor substrate including a plurality of photosensitive cells for sensing light; a filter layer provided on the sensor substrate; and a planar nano-photonic microlens array provided on the filter layer, and including a plurality of planar nano-photonic microlenses, wherein the plurality of planar nano-photonic microlenses are two-dimensionally arranged in a first direction and a second direction that is perpendicular to the first direction, and each of the planar nano-photonic microlenses include nano-structures arranged such that the light transmitting through each of the planar nano-photonic microlenses has a phase profile in which a phase change curve is convex in the first direction and the second direction.