The invention of the application is the invention regarding a semiconductor device and a method for driving the semiconductor device. The semiconductor device includes first and second transistors, first to fifth switches, first to third capacitors, and a display element. The first transistor (M2) comprises a back gate, a gate of the first transistor is electrically connected to the first switch (M1), the second switch (M3) and the first capacitor (C1) are positioned between the gate of the first transistor and a source of the first transistor, the back gate of the first transistor is electrically connected to the third switch (M4), the second capacitor (C2) is positioned between the back gate of the first transistor and the source of the first transistor, the source of the first transistor is electrically connected to the fourth switch (M6) and a drain of the second transistor (M5), a gate of the second transistor is electrically connected to the fifth switch (M7), the third capacitor (C3) is positioned between the gate of the second transistor and a source of the second transistor, and the source of the second transistor is electrically connected to the display element (61).

A structure and method for the formation and use of fuses within a semiconductor device is provided. The fuses may be formed within the third metal layer and are formed so as to be arranged perpendicularly to active devices located on an underlying semiconductor substrate. Additionally, the fuses within the third metal layer may be formed thicker than an underlying second metal layer.

A method of integrating at least one passive component and at least one active power device on a same substrate includes: forming a substrate having a first resistivity value associated therewith; forming a low-resistivity region having a second resistivity value associated therewith in the substrate, the second resistivity value being lower than the first resistivity value; forming the at least one active power device in the low-resistivity region; forming an insulating layer over at least a portion of the at least one active power device; and forming the at least one passive component on an upper surface of the insulating layer above the substrate having the first resistivity value, the at least one passive component being disposed laterally relative to the at least one active power device and electrically connected with the at least one active power device.

A metal-oxide-semiconductor field-effect transistor (MOSFET) with integrated passive structures and methods of manufacturing the same is disclosed. The method includes forming a stacked structure in an active region and at least one shallow trench isolation (STI) structure adjacent to the stacked structure. The method further includes forming a semiconductor layer directly in contact with the at least one STI structure and the stacked structure. The method further includes patterning the semiconductor layer and the stacked structure to form an active device in the active region and a passive structure of the semiconductor layer directly on the at least one STI structure.

A manufacturing method of a sensing integrated circuit including the following acts. A plurality of transistors are formed. At least one dielectric layer is formed on or above the transistors. A plurality of connecting structures are formed in the dielectric layer. The connecting structures are respectively and electrically connected to the transistors. A plurality of separated conductive wells are respectively formed in electrical contact with the connecting structures.

Systems and methods are provided for fabricating a static random access memory (SRAM) cell in a multi-layer semiconductor device structure. An example SRAM device includes a first array of SRAM cells, a second array of SRAM cells, a processing component, and one or more inter-layer connection structures. The first array of SRAM cells are formed in a first device layer of a multi-layer semiconductor device structure. The second array of SRAM cells are formed in a second device layer of the multi-layer semiconductor device structure, the second device layer being formed on the first device layer. The processing component is configured to process one or more input signals and generate one or more access signals. One or more inter-layer connection structures are configured to transmit the one or more access signals to activate the first device layer or the second device layer for allowing access to a target SRAM cell.

Multiple gate stack portions are formed in a gate cavity by direct metal gate patterning to provide FinFETs having different threshold voltages. The different threshold voltages are obtained by selectively incorporating metal layers with different work functions in different gate stack portions.

A semiconductor device (100) includes a substrate (11), a first TFT (10), and a second TFT (20). The first TFT includes a first semiconductor layer (12) that is supported by the substrate, a first gate electrode (14) that is formed on the first semiconductor layer and overlaps with the first semiconductor layer with a first gate insulating layer (13) interposed therebetween, a first insulating layer (16) that covers the first gate electrode, and a first source electrode (17s) and a first drain electrode (17d) that are formed on the first insulating layer and are connected to the first semiconductor layer. The second TFT includes a second gate electrode (22) that is supported by the substrate, a second semiconductor layer (25) that contains an oxide semiconductor and is formed overlapping with the second gate electrode with a second gate insulating layer (23) interposed therebetween, and a second source electrode (24s) and a second drain electrode (24d) that are formed between the second gate insulating layer and the second semiconductor layer. The first semiconductor layer and the second gate electrode are both formed from a same semiconductor film (52).

A semiconductor device includes dummy gate structures formed on a dielectric layer over a substrate and forming a gap therebetween. A trench silicide structure is formed in the gap on the dielectric layer and extends longitudinally beyond the gap on end portions. The trench silicide structure forms a resistive element. Self-aligned contacts are formed through an interlevel dielectric layer and land on the trench silicide structure beyond the gap on the end portions.

Bulk semiconductor devices are co-fabricated on a bulk semiconductor substrate with SOI devices. The SOI initially covers the entire substrate and is then removed from the bulk device region. The bulk device region has a thicker dielectric on the substrate than the SOI region. The regions are separated by isolation material, and may or may not be co-planar.