A light emitting device includes a base substrate having a recessed portion at a flat upper surface thereof. The recessed portion has an inner wall. A sealing member is provided in the recessed portion. The sealing member contains surface-treated particles, or particles coexisting with a dispersing agent. The particles have a particle diameter of 1 nm or more and 100 m or less. The particles are made of an organic material or an inorganic material. The organic material and the inorganic material are free of a phosphor. The at least a part of an edge portion of the sealing member is a region located in the vicinity of an edge of the recessed portion which is a boundary between a surface of the inner wall and the flat upper surface. The at least one of the particles and aggregates of particles are unevenly distributed in the region.

Heavily phosphor loaded LED packages having higher stability and a method for increasing the stability of heavily phosphor loaded LED packages. The silicone content of the packages is increased by decreasing the amount of one phosphor of the blend or by increasing the thickness of the silicone phosphor blend layer.

A display and method of manufacture are described. The display may include a substrate including an array of pixels with each pixel including multiple subpixels, and each subpixel within a pixel is designed for a different color emission spectrum. An array of micro LED device pairs are mounted within each subpixel to provide redundancy. An array of wavelength conversion layers comprising phosphor particles are formed over the array of micro LED device pairs for tunable color emission spectrum.

The invention provides a shell integrated light-emitting diode assembly, which includes: a plurality of light-emitting units, each of the light-emitting units including at least one light-emitting chip and an external wiring which is coupled to the light-emitting chip; and a shell structure, formed as a consolidation structure by a molding material for enclosing the light-emitting units to be inside the molding material; wherein the light-emitting units emit light through the molding material into an outside of the shell structure. The present invention also provides a shell integrated light-emitting diode lamp with the shell integrated light-emitting diode assembly, and a manufacturing method for the shell integrated light-emitting diode assembly.

A light-emitting device including a substrate, a first light-emitting diode disposed on the substrate, a molding member encapsulating the first light-emitting diode, and luminophores dispersed in the molding member and including a surface-modified luminophore, in which the surface-modified luminophore includes a fluorinated coating and a fluoride luminophore including a manganese activator. The fluoride luminophore is selected from the group consisting of K.sub.2SiF.sub.6, Na.sub.2SiF.sub.6, Rb.sub.2SiF.sub.6, K.sub.2GeF.sub.6, Na.sub.2GeF.sub.6, and Rb.sub.2GeF.sub.6.

An adhesive or encapsulant composition, having a siloxane polymer having a molecular weight of from 300 to 150,000 g/mol and having a viscosity of from 1000 to 100,000 mPa-sec at 5 rpm viscometer and at 25 C., and a curing agent that aids in curing the siloxane polymer upon the application of ultraviolet light. The composition is transmissive to visible light with an optical transmissivity of 95% or more in the visible spectrum at a thickness of 1 mm or less, and wherein the siloxane polymer is a material formed without hydrosilylation and has less than 5 mol % of SiOH groups compared to all groups bound to Si therein, and substantially no SiH bonds.

This specification discloses spinel-type phosphors that may be advantageously employed in light sources for medical optical coherence tomography (OCT), light sources for medical OCT comprising such phosphors, and OCT systems comprising such light sources.

Organic ligand-capped quantum dots and curable ink compositions containing the organic ligand-capped quantum dots are provided. Also provided are thin films formed from the ink compositions.

Light emitting devices comprise: one or more light emitting diode (LED) dies in a reflector cup; a first light-scattering layer contacting side surfaces of the LED dies, and a bottom wall and a sidewall of the reflector cup, the first light-scattering layer comprising light-scattering particles and a first binder material; and a second light-scattering layer contacting at least a top surface of the LED dies, and the first light-scattering layer at an interface, the second light-scattering layer comprising phosphor particles and a second binder material.

The invention provides a light generating system (1000) configured to generate system light (1001), wherein the light generating system (1000) comprises a first light generating device (110), wherein: (A) the first light generating device (110) comprises a first light source (10) and a first luminescent converter (210); (B) the first light source (10) comprises a solid state light source, wherein the first light source (10) is configured to generate first light source light (11) having a first light source centroid wavelength (.sub.S, 1) selected from the range of 380-420 nm; (C) the first luminescent converter (210) is configured to convert at least part of the first light source light (11) into first converter light (211) having a first converter centroid wavelength (.sub.c, 1) selected from the green-yellow wavelength range; (D) the first light generating device (110) is configured to generate first device light (111) having a spectral power distribution in the wavelength range of 380-780 nm with at least 60% of the spectral power provided by the first light source light (11) and at maximum 40% of the spectral power provided by the first converter light (211).