H10H20/8511

Light emitting diode
09620687 · 2017-04-11 · ·

Provided are a light emitting diode, a method of manufacturing the same, and a use thereof. The light emitting diode having excellent initial light flux and excellent color uniformity and dispersion, the method of manufacturing the same, and the use thereof may be provided.

LED fluorescent cover and preparation method thereof
09617467 · 2017-04-11 · ·

A Light Emitting Diode (LED) fluorescent cover comprises the following components by weight: 90-96% of single-component solid silicone rubber, 3-8% of fluorescent powder and 1-2% of vulcanizer; and the preparation method includes the following steps: step 1): using mixed compound of the single-component solid silicone rubber, as well as the fluorescent powder and the vulcanizer as raw material to mix, standing for 2-4 h after mixing with open mill or internal mixer; step 2): controlling temperature, pressure and vulcanization time of vulcanizing machine according to size of the fluorescent cover mold, using the vulcanizing machine to carry out first vulcanization to the raw material that is obtained from the step 1) and placed in the fluorescent cover mold; step 3): with combined action of blower gun, taking the fluorescent cover out slowly; step 4): baking the semi-finished product in a closed space at a temperature of 150-200 C. for 1-2 h.

Display light sources with quantum dots

A display may be provided with light sources. The light sources may include light-emitting diodes. The light sources may have packages formed from package bodies to which the light-emitting diodes are mounted. Layers such as quantum dot layers, light-scattering layers, spacer layers, and diffusion barrier layers may be formed over the package bodies and light-emitting diodes. Quantum dots of different colors may be stacked on top of each other. A getter may be incorporated into one or more of the layers to getter oxygen and water. Quantum dots may be formed from semiconductor layers that are doped with n-type and p-type dopant to adjust the locations of their conduction and valance bands and thereby enhanced quantum dot performance.

LED FLUORESCENT COVER AND PREPARATION METHOD THEREOF
20170098744 · 2017-04-06 ·

A Light Emitting Diode (LED) fluorescent cover comprises the following components by weight: 90-96% of single-component solid silicone rubber, 3-8% of fluorescent powder and 1-2% of vulcanizer; and the preparation method includes the following steps: step 1): using mixed compound of the single-component solid silicone rubber, as well as the fluorescent powder and the vulcanizer as raw material to mix, standing for 2-4 h after mixing with open mill or internal mixer; step 2): controlling temperature, pressure and vulcanization time of vulcanizing machine according to size of the fluorescent cover mould, using the vulcanizing machine to carry out first vulcanization to the raw material that is obtained from the step 1) and placed in the fluorescent cover mould; step 3): with combined action of blower gun, taking the fluorescent cover out slowly; step 4): baking the semi-finished product in a closed space at a temperature of 150-200 C. for 1-2 h.

Light emitting device having surface-modified luminophores

A light-emitting device including a light-emitting diode and a surface-modified luminophore. The surface-modified luminophore includes a luminophore including a manganese activator and a fluorine compound fixed to the luminophore.

HIGH OPTICAL POWER LIGHT CONVERSION DEVICE USING A PHOSPHOR ELEMENT WITH SOLDER ATTACHMENT

A light generator comprises a light conversion device and a light source arranged to apply a light beam to the light conversion element. The light conversion device includes an optoceramic or other solid phosphor element comprising one or more phosphors embedded in a ceramic, glass, or other host, a metal heat sink, and a solder bond attaching the optoceramic phosphor element to the metal heat sink. The optoceramic phosphor element does not undergo cracking in response to the light source applying a light beam of beam energy effective to heat the optoceramic phosphor element to the phosphor quenching point.

Coating method and device
09608174 · 2017-03-28 · ·

[PROBLEM TO BE SOLVED] To provide a method and apparatus for applying a coating material that reacts at ordinary temperatures and increases in viscosity with lapse of time or a coating material that is difficult to handle, such as an unstable slurry in which sedimentation occurs at high rate, to a high-value-added object to be coated. [SOLUTION] Before at least applying coating material to an object to be coated, the coating amount is automatically measured using a highly-accurate measuring device set in an atmosphere that does not substantially affect the measurement to control the coating amount during production. Therefore, high-quality products can be mass-produced with a low production cost.

LIGHT EMITTING DEVICE, COLOR COORDINATE MEASURING APPARATUS AND COLOR COORDINATE CORRECTION METHOD THEREOF
20170084502 · 2017-03-23 ·

A method and apparatus for measuring color coordinates of a light emitting device. The color coordinate measuring apparatus includes a rail on which a substrate is mounted, the substrate having a plurality of light emitting devices (LEDs) formed thereon, a transfer device disposed under the rail and configured to move toward or away from a target region of the substrate, a plurality of electrode pins disposed on the transfer device and configured to respectively contact electrodes of the plurality of light emitting devices in the target region at the same time when the transfer device approaches the target region, a controller configured to sequentially supply electric power to the plurality of electrode pins, and a measurement unit disposed above the rail and configured to be placed above the target region in which the plurality of electrode pins is brought into contact with the electrodes of the plurality of light emitting devices.

Vertical solid-state transducers having backside terminals and associated systems and methods

Vertical solid-state transducers (SSTs) having backside contacts are disclosed herein. An SST in accordance with a particular embodiment can include a transducer structure having a first semiconductor material at a first side of the SST, a second semiconductor material at a second side of the SST opposite the first side, and an active region between the first and second semiconductor materials. The SST can further include first and second contacts electrically coupled to the first and second semiconductor materials, respectively. A portion of the first contact can be covered by a dielectric material, and a portion can remain exposed through the dielectric material. A conductive carrier substrate can be disposed on the dielectric material. An isolating via can extend through the conductive carrier substrate to the dielectric material and surround the exposed portion of the first contact to define first and second terminals electrically accessible from the first side.

Curable composition

Provided is a curable composition and its use. The curable composition may exhibit excellent processibility and workability. The curable composition has excellent light extraction efficiency, crack resistance, hardness, thermal and shock resistance and an adhesive property after curing. The curable composition may provide a cured product exhibiting stable durability and reliability under severe conditions for a long time and having no whitening and surface stickiness.