A thermoelectric generation device includes a first thermoelectric generation module, a second thermoelectric generation module, and an electroconductive member electrically connecting the first and second thermoelectric generation modules. The first thermoelectric generation module is spaced from the second thermoelectric generation module. The first and second thermoelectric generation modules each have at least one heat utilization power generation element that includes a stack of an electrolyte layer and a thermoelectric conversion layer and a housing that accommodates the heat utilization power generation element.

This disclosure relates to an integrated thermoelectric cooler and methods for forming thereof. The integrated thermoelectric cooler can include a plurality of thermoelectric rods located between the detector substrate and a system interposer. The detector substrate and the system interposer can directly contact ends of the thermoelectric rods. The integrated thermoelectric cooler can be formed by forming the plurality of thermoelectric rods on reels, for example, and the plurality of thermoelectric rods can be thinned down to a certain height. The thermoelectric rods can be transferred and bonded to the system substrate. An overmold can be formed around the plurality of thermoelectric rods. The height of the overmold and thermoelectric rods can be thinned down to another height. The thermoelectric rods can be bonded to the detector substrate. In some examples, the overmold can be removed.

A downhole tool is described comprising a housing (24), a fluid flow passage (28) located within (5) the housing (24), and at least one thermoelectric generator (30) located between the fluid flow passage (28) and the housing (24) and operable to generate an electrical output in the event of there being a temperature difference between, in use, the fluid within the fluid flow passage (28), and fluid in contact with the exterior of the housing (24).

A thermoelectric element according to one embodiment of the present disclosure includes a first substrate, a first insulating layer disposed on the first substrate, a second insulating layer disposed on the first insulating layer, a first electrode disposed on the second insulating layer, and a semiconductor structure disposed on the first electrode, wherein the first insulating layer includes an uneven portion, a partial region of the first electrode is buried in the second insulating layer, the second insulating layer includes a concave portion which is concave in a direction toward the first insulating layer from a side surface of the first electrode, and the concave portion vertically overlaps the uneven portion.

The thermoelectric module includes a first thermoelectric element including a first thermoelectric conversion layer and a first electrolyte layer stacked each other along a stacked direction, a second thermoelectric element stacking the first thermoelectric element in the stacked direction and including a second thermoelectric conversion layer and a second electrolyte layer stacked each other along the stacked direction, a first current collector located on a side of one edge in the stacked direction, a second current collector located on a side of another edge in the stacked direction, and an electron transmission layer located between the first thermoelectric element and the second thermoelectric element in the stacked direction.

The thermoelectric module includes a flexible base, a first current collector located on the flexible base, a first thermoelectric element located on the first current collector, the first thermoelectric element including a first thermoelectric conversion layer and a first electrolyte layer stacked in order along a stacked direction of the flexible base and the first current collector, and a second current collector located on the first thermoelectric element.

The present disclosure discloses a dynamic equivalent circuit of a combined heat and power system, and a working method thereof. Controlled sources are used to represent a thermoelectric coupling source; equivalent inductance is used to represent a delay of a heat transmission pipeline; equivalent resistance is used to represent a heat load and a heat loss of the heat transmission pipeline; and equivalent capacitance is used to represent a heat storage water tank. A circuit model is used to uniformly represent two thermoelectric heterogeneous energy sources, and a single power simulation tool may be used to simulate a combined heat and power system, so that the simulation system has a simple structure and is easy to develop and maintain.

A thermoelectric generator includes a heat-receiving plate having a heat-receiving surface for receiving flame and high-temperature combustion gas, a thermoelectric generation module disposed at a surface of the heat-receiving plate opposite the heat-receiving surface, a cooling plate disposed at a side of the thermoelectric generation module opposite the heat-receiving plate, a cover disposed to cover the heat-receiving surface and including a heat inlet for introducing the flame and the high-temperature combustion gas and a heat outlet for discharging the temperature-reduced combustion gas introduced through the heat inlet, a heat diffuser provided on the heat-receiving surface at a position corresponding to the heat inlet and configured to diffuse the combustion gas introduced through the heat inlet along the heat-receiving surface, and a heat absorber provided on the heat-receiving surface to surround the heat diffuser and configured to absorb the heat of the high-temperature combustion gas diffused by the heat diffuser.

A device that includes a region comprising a heat generating device, and an energy harvesting device coupled to the region comprising the heat generating device. The energy harvesting device includes a first thermal conductive layer, a thermoelectric generator (TEG) coupled to the first thermal conductive layer, and a second thermal conductive layer coupled the thermoelectric generator (TEG) such that the thermoelectric generator (TEG) is between the first thermal conductive layer and the second thermal conductive layer. In some implementations, the energy harvesting device includes an insulation layer.

A heat conversion apparatus according to one embodiment of the present invention comprises: a duct through which cooling fluid passes; a first thermoelectric module disposed on a first surface of the duct; a second thermoelectric module disposed on a second surface, which is disposed in parallel to the first surface, of the duct; and a gas guide member disposed above a third surface disposed between the first surface and the second surface of the duct so as to be spaced from the third surface, wherein the gas guide member includes one end thereof coming in contact with the first thermoelectric module, the other end thereof coming in contact with the second thermoelectric module, and an extended part for connecting the one end and the other end, and the gas guide member can have a form in which the distance thereof from the third surface gradually increases toward the center between the one end and the other end.