An an apparatus for manufacturing a thermoelectric module is provided. The apparatus includes a thermoelectric element interposed between a lower substrate that includes a lower electrode and an upper substrate that includes an upper electrode. Additionally, the apparatus includes a first block that is configured to support the lower substrate and a second block that is configured to move vertically with respect to the first block and support the upper substrate. A jig is configured to position the thermoelectric element in connection with the upper electrode and the lower electrode.

The invention relates to a thermoelectric module, having an electric insulation, an electric conductor path, one surface of the electric conductor path being attached to a surface of the electrical insulation, and a thermoelectric material, one surface of the thermoelectric material being attached to another surface of the conductor path.

A thermoelectric conversion material made of a polycrystalline material represented by a composition formula (1) shown below and having an MgAgAs type crystal structure is provided. An insulating coat is provided on at least one surface of the polycrystalline material. Composition formula (1): (A.sub.a1Ti.sub.b1).sub.xD.sub.yX.sub.100-x-y, wherein 0.2≦a1≦0.7, 0.3≦b1≦0.8, a1+b1=1, 30≦x≦35, 30≦y≦35 hold, wherein A is at least one element selected from the group consisting of Zr and Hf, D is at least one element selected from the group consisting of Ni, Co, and Fe, and X is at least one element selected from the group consisting of Sn and Sb.

Operations for integrating thermoelectric devices in Fin FET technology may be implemented in a semiconductor device having a thermoelectric device. The thermoelectric device includes a substrate and a fin structure disposed on the substrate. The thermoelectric device includes a first connecting layer and a second connecting layer disposed on opposing ends of the fin structure. The thermoelectric device includes a first thermal conductive structure thermally and a second thermal conductive structure thermally coupled to the opposing ends of the fin structure. The fin structure may be configured to transfer heat from one of the first thermal conductive structure or the second thermal conductive structure to the other thermal conductive structure based on a direction of current flow through the fin structure. In this regard, the current flow may be adjusted by a power circuit electrically coupled to the thermoelectric device.

The invention provides a portable electronic system. The portable electronic system includes a semiconductor package. The semiconductor package includes a substrate. A semiconductor die is coupled to the substrate. A thermoelectric device chip is disposed close to the semiconductor die, coupled to the substrate. The thermoelectric device chip is configured to detect a heat energy generated from the semiconductor die and to convert the heat energy into a recycled electrical energy. A power system is coupled to the semiconductor package, configured to store the recycled electrical energy.

Cooling devices for SOI wafers and methods for forming the devices are presented. A substrate having a top surface layer, a support substrate and an insulator layer isolating the top surface layer from the support substrate is provided. At least one device is disposed in the top surface layer of the substrate. The IC includes a cooling device. The cooling device includes a doped layer which is disposed in a top surface of the support substrate, and a RDL layer disposed within the support substrate below the doped layer for providing connections to hotspots in the doped layer to facilitate thermoelectric conduction of heat in the hotspots away from the hotspots.

We disclose a chemical sensing device for detecting a fluid. The sensing device comprises: at least one substrate region comprising at least one etched portion; a dielectric region formed on the at least one substrate region, the dielectric region comprising at least one dielectric membrane region adjacent to the at least one etched portion; an optical source for emitting an infra-red (IR) signal; an optical detector for detecting the IR signal emitted from the optical source; one or more further substrates formed on or under the dielectric region, said one or more further substrates defining an optical path for the IR signal to propagate from the optical source to the optical detector. At least one of the optical source and optical detector is formed in or on the dielectric membrane region.

A cross-plane flexible micro-TEG with hundreds of pairs of thermoelectric pillars formed via electroplating, microfabrication, and substrate transferring processes is provided herein. Typically, fabrication is conducted on a Si substrate, which can be easily realized by commercial production line. The fabricated micro-TEG transferred to the flexible layer from the Si substrate. Fabrication methods provided herein allow fabrication of main TEG components including bottom interconnectors, thermoelectric pillars, and top interconnectors by electroplating. Such flexible micro-TEGs provide high output power density due to high density of thermoelectric pillars and very low internal resistance of electroplated components. The flexible micro-TEG can achieve a power per unit area of 4.5 mW cm.sup.−2 at a temperature difference of ˜50 K, which is comparable to performance of flexible TEGs developed by screen printing. The power per unit weight of flexible TEGs described herein is as high as 60 mW g.sup.−1, which is advantageous for wearable applications.

A housing for a thermoelectric module can stably protect individual elements of the thermoelectric module such as thermoelectric elements, electrodes, and insulating boards, while maintaining power generation performance of the thermoelectric module. The housing for a thermoelectric module includes: a housing enveloping at least one thermoelectric module; and a heat barrier unit configured to prevent a flow of heat from being transferred through a sidewall of the housing.

A thermoelectric module having a first and second housing element, at least two thermoelectric elements arranged between the housing elements and are each connected electrically to one another via first or second electrical contacts or are connected electrically to an electrical circuit via first and/or second electrical contacts. The first electrical contacts are assigned to the first housing element and the second electrical contacts are assigned to the second housing element. The first housing element and/or the second housing element have at least one opening, which is covered by at least one section of the first electrical contacts and/or the second electrical contacts. The first electrical contacts and/or the second electrical contacts are connected to the first housing element and/or the second housing element.