The present disclosure generally relates to a SOT-MRAM cell that has a spin Hall effect layer and a magnetic tunnel junction. The magnetic tunnel junction is disposed at an edge of the spin Hall effect layer. In order to write the cell, current is applied through the spin Hall effect layer to create spin accumulation of z-polarized spins under the free layer due to the spin Hall effect. The spins exert a spin torque on the free layer via spin diffusion. Based upon the design, the SOT-MRAM cell has deterministic switching of the perpendicular free layer with the spin Hall effect layer without application of an external magnetic field.

A method for manufacturing a Hall sensor, an insulation layer being initially applied to a wafer including an ASIC or integrated into the wafer, a Hall layer, for example, made of InSb or another III-V semiconductor material, being situated thereon, and this Hall layer being at least sectionally recrystallized with the aid of a laser. The insulation layer may be porous or may include a cavity or reflective layer for thermal protection of the ASIC.

A chip package, a chip package system, a method of manufacturing a chip package, and a method of operating a chip package including: a first sensor configured to measure a magnetic field component up to a maximum magnetic field value; a second sensor configured to measure the magnetic field component beyond the maximum magnetic field value; and a circuit coupled to the first sensor and the second sensor and configured to receive at least one sensor signal from at least one of the first sensor and the second sensor, wherein the circuit is further configured to select the first sensor or the second sensor to measure the magnetic field component based on the received sensor signal.

A contactless position and/or distance sensor for determining the distance, the spatial orientation, the material properties, or the like of a target object, and a method for operating the same, uses at least two sensor elements, which form a sensor module, Signals provided by the at least two sensor elements are jointly evaluated using at least one artificial neural network.

The present disclosure relates to 3-dimensional Hall sensor devices comprising a Hall sensor element having a Hall effect region implemented in a 3-dimensional shell and comprising at least three terminals. Each terminal is connected to at least one electrical contact of the Hall effect region and each electrical contact is disposed at a different region of the 3-dimensional shell. The present disclosure further discloses spinning current/voltage schemes for offset cancellation in such 3-dimensional Hall sensor devices.

A method for manufacturing semiconductor devices is provided. The method includes bonding a semiconductor element to a first surface of a planar lead frame, clamping a partial area of the lead frame to hold the lead frame and the semiconductor element in molding dies, and covering at least a part of the lead frame and the semiconductor element with a resin member by resin molding which fills the molding dies with resin. A thin-walled portion having a relative small thickness is previously formed on a shortest virtual line connecting a clamp area of the lead frame to an area where the semiconductor element is bonded.

A method of manufacturing a magnetoresistive device may comprise forming a first magnetic region, an intermediate region, and a second magnetic region of a magnetoresistive stack above a via; removing at least a portion of the second magnetic region using a first etch; removing at least a portion of the intermediate region and at least a portion of the first magnetic region using a second etch; removing at least a portion of material redeposited on the magnetoresistive stack using a third etch; and rendering at least a portion of the redeposited material remaining on the magnetoresistive stack electrically non-conductive.

Described is a power semiconductor module that includes: a frame made of an electrically insulative material; a first substrate seated in the frame; a plurality of power semiconductor dies attached to the first substrate; a plurality of signal pins attached to the first substrate and electrically connected to the power semiconductor dies; a busbar extending from the first substrate through a side face of the frame; a current sensor module seated in a receptacle of the frame in sensing proximity of the busbar, the current sensor module including a current sensor attached to a circuit board; and a potting material fixing the current sensor module to the frame such that no air gap is present between the current sensor and the busbar. The potting material contacts the frame and the current sensor. Methods of producing the power semiconductor module are also described.

An electronic neuron device that includes a thresholding unit which utilizes current-induced spin-orbit torque (SOT). A two-step switching scheme is implemented with the device. In the first step, a charge current through heavy metal (HM) places the magnetization of a nano-magnet along the hard-axis (i.e. an unstable point for the magnet). In the second step, the device receives a current (from an electronic synapse) which moves the magnetization from the unstable point to one of the two stable states. The polarity of the net synaptic current determines the final orientation of the magnetization. A resistive crossbar array may also be provided which functions as the synapse generating a bipolar current that is a weighted sum of the inputs of the device.

In one example, circuitry is formed in a semiconductor die. A magnetic concentrator is formed on a surface of the semiconductor die and over the circuitry. An isolation spacer is placed on a lead frame. The semiconductor die is placed on the isolation spacer, and the magnetic concentrator is aligned to overlap the lead frame. Electrical interconnects are formed between the semiconductor die and the lead frame.