There are provided a semiconductor unit that prevents connection failure caused by a wiring substrate to improve reliability, a method of manufacturing the semiconductor unit, and an electronic apparatus including the semiconductor unit. The semiconductor unit includes: a device substrate including a functional device and an electrode; a first wiring substrate electrically connected to the functional device through the electrode; and a second wiring substrate electrically connected to the functional device through the first wiring substrate.

A free-form display is disclosed which makes a step-like pattern adjacent to a free-form portion less visible. The free-form display has an active area and a bezel area, and at least part of a boundary between the active area and the bezel area has a free-form portion. The free-form portion comprises subpixel electrodes and a light blocking portion. A plurality of subpixel electrodes are placed in areas defined by a plurality of gate lines and a plurality of data lines that intersect each other. A light blocking portion has openings exposing the subpixel electrodes, respectively, and is arranged to overlap the gate lines and the data lines. The active area comprises subpixel areas where the subpixel electrodes are placed, and a non-pixel area where no subpixel electrodes are placed. The openings of the light blocking portion adjacent to the non-pixel area, are made in different sizes.

A display device may include these elements: a first data line; a second data line; a first subpixel electrode positioned at a first half of the display device, connected to the first data line, and comprising a first member and a second member, the first member extending parallel to the first data line, the second member connecting directly to and extending perpendicular to the first member; and a second subpixel electrode positioned at a second half of the display device, connected to the second data line, and comprising a third member and a fourth member, the third member extending parallel to the second data line, the fourth member connecting directly to and extending perpendicular to the third member, wherein the second member and the fourth member are aligned and are positioned between the first member and the third member in a layout view of the display device.

A backplane substrate and a flexible display having the same are provided. The backplane substrate includes a flexible base film having an active area with a plurality of sub-pixels and a non-display area around the active area; and an interlayer insulating film on flexible base film and including a plurality of connection holes provided in first columns and second columns with each of the first and second columns arranged in a first direction of the flexible base film. When the flexible base film is folded along a folding axis in a direction intersecting the first and second columns, the folding axis intersects at least one connection hole of the first and second columns.

A display of an electric device includes a plurality of separated transparent electrode blocks, which are configured to provide one or more of supplemental features such as touch recognition. Signal paths between the transparent electrode blocks and the driver for the supplemental feature are implemented with a plurality of conductive lines placed under positioned under one or more planarization layers. The conductive lines implementing the signal paths are routed across the display area, directly toward a non-display area where drive-integrated circuits are located.

Provided is a method for fabricating an electronic device, the method including: preparing a carrier substrate including an element region and a wiring region; forming a sacrificial layer on the carrier substrate; forming an electronic element on the sacrificial layer of the element region; forming a first elastic layer having a corrugated surface on the first elastic layer of the wiring region; forming a metal wirings electrically connecting the electronic element thereto, on the first elastic layer of the wiring region; forming a second elastic layer covering the metal wirings, on the first elastic layer; forming a high rigidity pattern filling in a recess of the second elastic layer above the electronic element so as to overlap the electronic element, and having a corrugated surface; forming a third elastic layer on the second elastic layer and the high rigidity pattern; and separating the carrier substrate.

An organic light-emitting display device and a method of fabricating the same are provided. The organic light-emitting display device includes a substrate having a plurality of trenches; a thin film transistor on the substrate; a light-emitting diode connected to the thin film transistor; an upper auxiliary electrode connected to one of an anode and a cathode of the light-emitting diode; and a lower auxiliary electrode in an auxiliary electrode trench among the plurality of trenches of the substrate and connected to the upper auxiliary electrode.

A flexible device is manufactured at low temperatures. A second substrate is bonded to a first substrate by a first adhesive layer. A first insulating layer, a transistor, and a second insulating layer are formed over the second substrate. Then, the first substrate and the second substrate are separated from each other while being heated at a first temperature. The heat resistant temperatures of the first substrate, the second substrate, and the first adhesive layer are a second temperature, a third temperature, and a fourth temperature, respectively. Each of the first insulating layer, the second insulating layer, and the transistor is formed at a temperature higher than or equal to room temperature and lower than the fourth temperature. The third temperature is higher than the fourth temperature and lower than the second temperature. The first temperature is higher than the fourth temperature and lower than the third temperature.

An array substrate and a display panel are provided. The array substrate includes a transparent substrate including a display area and a rim area; a pixel structure and an antistatic switching tube which are arranged on a same side of the transparent substrate. The pixel structure includes a pixel thin-film transistor located in the display area, and the antistatic switching tube is located in the rim area. The pixel structure also includes first grounding wire located on a side of the antistatic switching tube facing away from the transparent substrate, and a second grounding wire located between the antistatic switching tube and the transparent substrate.

Solved is a problem of attenuation of output amplitude due to a threshold value of a TFT when manufacturing a circuit with TFTs of a single polarity. In a capacitor (105), a charge equivalent to a threshold value of a TFT (104) is stored. When a signal is inputted thereto, the threshold value stored in the capacitor (105) is added to a potential of the input signal. The thus obtained potential is applied to a gate electrode of a TFT (101). Therefore, it is possible to obtain the output having a normal amplitude from an output terminal (Out) without causing the amplitude attenuation in the TFT (101).